Abstract: A lithography method comprises: providing a substrate with a target region; determining a topology of the substrate within the target region; determining a correcting telecentricity profile based on the topology of the substrate within the target region; providing a radiation beam; and projecting the radiation beam onto the target region of the substrate so as to form an image on the substrate. The radiation beam is such that a net direction of the total radiation received by one or more points in the target region of the substrate is chosen in dependence on the determined correcting telecentricity. The correcting telecentricity profile is such that the net direction of the total radiation received by at least one point in the target region of the substrate is chosen so as to at least partially correct for an overlay error introduced by a curvature of a surface of the substrate at said point.

Abstract: A lithography method comprises: providing a substrate with a target region; determining a topology of the substrate within the target region; determining a correcting telecentricity profile based on the topology of the substrate within the target region; providing a radiation beam; and projecting the radiation beam onto the target region of the substrate so as to form an image on the substrate. The radiation beam is such that a net direction of the total radiation received by one or more points in the target region of the substrate is chosen in dependence on the determined correcting telecentricity. The correcting telecentricity profile is such that the net direction of the total radiation received by at least one point in the target region of the substrate is chosen so as to at least partially correct for an overlay error introduced by a curvature of a surface of the substrate at said point.

Abstract: A lithographic apparatus configured to project a patterned radiation beam onto a target portion of a substrate held on a substrate holder in an indent on a substrate table, the apparatus includes a liquid supply system configured to at least partly fill a space between a projection system and the substrate with liquid; a barrier structure configured to substantially contain the liquid within the space; and a heat pipe supplied, in use, with a temperature conditioned fluid and configured to thermally condition the substrate and/or the substrate holder at locations where localized cooling is likely to occur.

Abstract: A lithographic apparatus comprising a source that generates a beam of radiation, a support structure supporting a patterning device, a substrate table for holding a substrate, and a projection system projecting the patterned radiation beam onto a target portion of the substrate. The lithographic apparatus further comprises a vibration measurement apparatus configured to measure relative vibration between the patterning device and the substrate during exposure of the target portion. A control apparatus adjusts power of the radiation beam to compensate for the effect of the measured relative vibration on the pattern projected onto the substrate.

Abstract: A lithographic apparatus comprising a source that generates a beam of radiation, a support structure supporting a patterning device, a substrate table for holding a substrate, and a projection system projecting the patterned radiation beam onto a target portion of the substrate. The lithographic apparatus further comprises a vibration measurement apparatus configured to measure relative vibration between the patterning device and the substrate during exposure of the target portion. A control apparatus adjusts power of the radiation beam to compensate for the effect of the measured relative vibration on the pattern projected onto the substrate.

Abstract: Methods and apparatus for maintaining the thermal equilibrium of a substrate and an immersion lithographic apparatus are disclosed using or having a timetable comprising information regarding the position, speed and/or acceleration of the substrate; and an evaporation controller and/or condensation controller acting to decrease localized evaporation and/or increase localized condensation in response to the information in the timetable. Evaporation of liquid from the surface of the substrate cools it down, while condensing liquid on its bottom surface heats the substrate locally.

Abstract: Methods and apparatus for maintaining the thermal equilibrium of a substrate and an immersion lithographic apparatus are disclosed using or having a timetable comprising information regarding the position, speed and/or acceleration of the substrate; and an evaporation controller and/or condensation controller acting to decrease localized evaporation and/or increase localized condensation in response to the information in the timetable. Evaporation of liquid from the surface of the substrate cools it down, while condensing liquid on its bottom surface heats the substrate locally.

Abstract: A method of removing contamination from an apparatus used in lithography is disclosed. The method includes loading a substrate into the apparatus, the substrate comprising a rigid support layer and a deformable layer provided on the rigid support layer, bringing the deformable layer of the substrate into contact with a surface of the apparatus from which contamination is to be removed, introducing relative movement between the deformable layer and the surface of the apparatus from which contamination is to be removed to dislodge contamination from the surface for removal, and removing the dislodged contamination. Other aspects of the invention are also described and claimed.