Abstract: A socket adapted for electrically connecting an IC package, comprises a base defining a receiving space for the IC package, a plurality of contacts received in the base, a pair of metal cams mounted on two opposed sides of the base and a pair of metal plates for retaining the cams on the base. Each cam defines a first position and a second position where the cam is close to a center of the receiving space relative to the first position. When the cam rotates from its first position and its second position, the cam can force the IC package received in the receiving space to move.

Abstract: An electrical connector includes an insulative housing defining a number of passageways and a plurality of electrical contacts received in corresponding passageways of the insulative housing. Each contact is formed with a base portion, a solder portion bended from a bottom edge of the base portion, a spring portion and a connecting portion linking the base portion and the spring portion. The spring portion has a tip portion at a top end thereof, which is twisted and protrudes out of the insulative housing.

Abstract: An electrical connector assembly (100) includes a frame (2) defining a central cavity (21) therein. A connector assembled to the central cavity and at least one alignment post (3) assembled to the frame (2). Each alignment post (3) defining a middle stop section (32) and an upper latching section (33) consisting of number of latching ribs (331) symmetrically arranged around a circle and a lower engaging section formed with a plurality of ribs around outer periphery; and the frame (2) defining at least one locating hole (23) for said alignment post (3) extending through. The frame (2) is sandwiched between the latching section (33) and the stop section (32) of the at least alignment post.

Abstract: An electrical connector (100) for connecting a chip module to a printed circuit board comprises an insulative housing (1) of a substantially rectangular shape defining a receiving area (130) with sidewalls therearound, the receiving area (130) defining a number of passageways (1300) therethrough, a number of terminals (3) receiving in corresponding passageways (1300) of the housing (1), wherein at least one detachable datum member (2) is engaged on the housing (1) for providing a datum surface (233) for a chip module received in the housing (1). In assembly, the housing (1) can provide more areas for defining passageways (1300) for receiving the terminals (3), because the datum member (2) is defined detachable with the housing (1). When the passageways (1300) made or the terminals (3) inserted, the datum members (2) are removed from the housing (1) for providing an enlarged space.