Abstract: Disclosed herein are exemplary embodiments of an EMI shielding apparatus. A frame of the apparatus has a sidewall and an inwardly extending lip defining at least one opening along an upper portion of the frame. A reusable cover is attachable to the frame for at least substantially covering opening(s) of the frame. A first border portion of the cover includes one or more sliding members. A second border portion of the cover includes one or more stops. The sliding member(s) and stop(s) are configured to abut, in generally opposed directions, one or more lip edges generally facing the opening(s) when the cover is attached to the frame. The shielding apparatus is operable for shielding the component(s) on the substrate that are within an interior cooperatively defined by the frame and the cover.

Abstract: Disclosed herein are exemplary embodiments of methods of making frames for electromagnetic (EMI) shielding apparatus. An exemplary method generally includes forming a frame to have at least a first frame portion, a second frame portion, and a common sidewall including at least a portion shared by and connecting the first and second frame portions. The second frame portion is repositioned from being disposed within a footprint of the first frame portion to outside the footprint of the first frame portion. Another exemplary embodiment includes a frame having first and second frame portions. The second frame portion is of a size sufficient to fit within an interior region defined by the first frame portion. The first and second frame portions share at least a portion of a common sidewall having a bendable hinge portion that connects the second frame portion to the first frame portion.

Abstract: An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame.

Abstract: An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame.

Abstract: An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame.

Abstract: An electromagnetic interference (EMI) shield according to one embodiment generally includes a frame and a cover. The frame includes peripheral walls each having at least one folded portion forming an outer sidewall and an inner sidewall. The cover includes a lid portion and a plurality of edge portions extending downwardly from the lid portion. The shield includes at least one dimple configured to be engagingly received in at least one opening for releasably retaining the cover to the frame.

Abstract: An EMI/RFI shield assembly for shielding printed circuit board components, including a frame affixed to the PCB, and a lid connected to the frame. The frame sidewalls each have top and bottom portions. Each bottom portion includes formed series of crenels and merlons. The crenels have a termination edge disposed a predetermined distance from the merlons. The lid includes a cover wall portion and engagement elements extending therefrom such that at least one of the engagement elements is associated with each sidewall. Each engagement element includes a surface for connection with the frame at the upper terminating edge of one of the crenels, whereby said lid is biased toward the frame compensating for tolerance stack-up.

Abstract: An EMI/RFI shield comprises a frame and a push-fit lid. The frame includes a frame top wall having outer frame edges jointly defining a frame perimeter of predetermined configuration in plan view, and a plurality of side walls depending from the frame edges. The lid includes a frame cover wall having free edges jointly defining a cover wall perimeter complementary in configuration in plan view to that of the frame perimeter, and a plurality of elongated spring fingers formed integrally of the cover wall and extending from the free edges. The fingers are configured to extend laterally beyond said frame perimeter and then downwardly and inwardly to engage the side walls when the lid is fit on the frame. At least some of the fingers have contact portions that are received in slots provided in the frame side walls.

Abstract: An EMI/RFI shield assembly for shielding printed circuit board components, including a frame affixed to the PCB, and a lid connected to the frame. The frame sidewalls each have top and bottom portions. Each bottom portion includes formed series of crenals and merlons. The crenals have a termination edge disposed a predetermined distance from the merlons. The lid includes a cover wall portion and engagement elements extending therefrom such that at least one of the engagement elements is associated with each sidewall. Each engagement element includes a surface for connection with the frame at the upper terminating edge of one of the crenels, whereby said lid is biased toward the frame compensating for tolerance stack-up.