Patents by Inventor Igor Zavarine

Igor Zavarine has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tin-silver solder bumping in electronics manufacture
    Patent number: 7713859
    Abstract: A process for forming a solder bump on an under bump metal structure in the manufacture of a microelectronic device comprising exposing the under bump metal structure to an electrolytic bath comprising a source of Sn2+ ions, a source of Ag+ ions, a thiourea compound and/or a quaternary ammonium surfactant; and supplying an external source of electrons to the electrolytic bath to deposit a Sn—Ag alloy onto the under bump metal structure.
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: May 11, 2010
    Assignee: Enthone Inc.
    Inventors: Thomas B. Richardson, Marlies Kleinfeld, Christian Rietmann, Igor Zavarine, Ortrud Steinius, Yun Zhang, Joseph A. Abys
  • TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE
    Publication number: 20070037377
    Abstract: A process for forming a solder bump on an under bump metal structure in the manufacture of a microelectronic device comprising exposing the under bump metal structure to an electrolytic bath comprising a source of Sn2+ ions, a source of Ag+ ions, a thiourea compound and/or a quaternary ammonium surfactant; and supplying an external source of electrons to the electrolytic bath to deposit a Sn—Ag alloy onto the under bump metal structure.
    Type: Application
    Filed: August 9, 2006
    Publication date: February 15, 2007
    Applicant: ENTHONE INC.
    Inventors: Thomas Richardson, Marlies Kleinfeld, Christian Rietmann, Igor Zavarine, Ortrud Steinius, Yun Zhang, Joseph Abys
  • Corrosion resistance enhancement of tin surfaces
    Publication number: 20050268991
    Abstract: A method for enhancing corrosion resistance of a tin-based surface on a workpiece involving contacting the tin-based surface with a composition comprising a phosphonic acid compound and water to form a phosphorus-based film over the tin-based coating thereby inhibiting corrosion of the tin-based surface. Phosphonic acid containing compositions having a concentration up to about 30 vol. % of an organic solvent, and water.
    Type: Application
    Filed: June 3, 2004
    Publication date: December 8, 2005
    Inventors: Chonglun Fan, Joseph Abys, Chen Xu, Edward Kudrak, Vincent Paneccasio, Igor Zavarine, Christian Rietmann