Abstract: A battery pack includes a battery, a first temperature sensor configured to provide a first temperature value associated with a temperature of the battery, a heat source disposed proximate to the battery and configured to heat the battery, a second temperature sensor configured to provide a second temperature value associated with a temperature of the heat source, and a control board coupled to the first temperature sensor and the second temperature sensor, wherein the control board is configured to receive the first temperature value and the second temperature value. The control board is configured to compare the first temperature value and the second temperature value to determine a temperature gradient between the battery and the heat source and transmit an alert if the temperature gradient exceeds a first temperature gradient threshold.

Abstract: This document describes a thermal-control system that is integrated into a security camera. The thermal-control system includes a combination of heatsinks and thermal interface materials with high thermal conductivities. The thermal-control system may transfer and spread energy from a high thermal-loading condition effectuated upon the security camera to concurrently maintain temperatures of multiple thermal zones on or within the security camera at or below prescribed temperature thresholds.

Abstract: This document describes a thermal-control system that is integrated into a video-recording doorbell. The thermal-control system includes a combination of heat spreaders and materials with high thermal conductivity. The thermal-control system may spread and dissipate energy from a thermal-loading condition effectuated upon the video-recording doorbell to concurrently maintain temperatures of multiple thermal zones on or within the video-recording doorbell at or below prescribed temperature thresholds.

Abstract: This document describes a reinforced graphite heat-spreader for a surface of a housing component of an electronic device. The reinforced graphite heat-spreader includes a heat-spreader material stack having a layer of graphite material to spread heat. The reinforced graphite heat-spreader also includes an interface material stack that joins the heat-spreader material stack to the housing surface of an electronic device. The interface material stack, which may be formed using embossing techniques, includes protuberances that may be formed from an adhesive material.

Abstract: The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device.

Abstract: The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits.

Abstract: The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits.

Abstract: The present disclosure describes thermal mitigation for an electronic speaker device and associated systems and methods. The thermal mitigation includes monitoring several thermal zones to determine or estimate thermal conditions in corresponding parts of the electronic speaker device. The thermal zones may include a System-on-Chip (SoC) integrated circuit (IC) component, audio components including power-dissipating IC components, and a temperature of an exterior surface of a housing component of the electronic speaker device. To mitigate thermal runaway, different throttling schemes may be triggered based on the thermal zones exceeding certain thermal limits. The throttling schemes may include reducing the amount of power supplied to the SoC, reducing audio power of the audio components to a lower wattage, or manipulating SoC cores such as by disabling one or more of the cores or adjusting utilization of the SoC cores.

Abstract: A camera includes an image sensor, a heat diffuser, and a heat spreader. The heat spreader includes a heat source coupled to the image sensor, an arm coupled to the heat source and the heat diffuser, and a heat exchange coupled with the heat source and the arm. A system includes a camera and a heat spreader coupled with the camera. The system includes a stabilizer coupled with the heat spreader and an electronics assembly coupled with the stabilizer. A heat controller for an imaging device that includes a flexible arm and a heat source coupled to the flexible arm that absorbs heat from the imaging device. The heat controller includes a heat exchange coupled to the flexible arm that transfers the heat away from the imaging device via the flexible arm.

Abstract: A camera system includes a lens assembly and image processing electronics internal to the camera housing and thermally coupled to the battery assembly. The battery assembly is sensitive to low ambient temperatures and may become damaged if the temperature of the assembly becomes sufficiently low. The camera system comprises a thermal management system that dissipates heat from electronic components of the camera to increase or maintain the temperature of the battery assembly. The thermal management configures the electronic components in different modes to create a step-wise increase of the resistive heat generated in the camera system and thereby increase the temperature of the components in the camera system.

Abstract: A camera system includes a camera with a lens assembly and image processing electronics internal to the camera housing. The lens assembly and image processing electronics are sensitive to thermal gradients within the camera body. The image processing electronics are coupled to a thermal management system that transfers thermal energy away from the electronics towards a heat diffuser. The thermal management system comprises a heat controller with a heat source, an offset arm, and a heat exchange. The thermal energy moves from the heat source to the heat exchange via the offset arm. The thermal management system also manages heat transfer between auxiliary electronic components and the image processing electronics. The thermal management system is constructed of materials that react to the compressive forces created on the system during camera assembly.

Abstract: This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.

Abstract: A camera system includes a lens assembly and image processing electronics internal to the camera housing and thermally coupled to the battery assembly. The battery assembly is sensitive to low ambient temperatures and may become damaged if the temperature of the assembly becomes sufficiently low. The camera system comprises a thermal management system that dissipates heat from electronic components of the camera to increase or maintain the temperature of the battery assembly. The thermal management configures the electronic components in different modes to create a step-wise increase of the resistive heat generated in the camera system and thereby increase the temperature of the components in the camera system.

Abstract: A camera system includes a camera with a lens assembly and image processing electronics internal to the camera housing. The lens assembly and image processing electronics are sensitive to thermal gradients within the camera body. The image processing electronics are coupled to a thermal management system that transfers thermal energy away from the electronics towards a heat diffuser. The thermal management system comprises a heat controller with a heat source, an offset arm, and a heat exchange. The thermal energy moves from the heat source to the heat exchange via the offset arm. The thermal management system also manages heat transfer between auxiliary electronic components and the image processing electronics. The thermal management system is constructed of materials that react to the compressive forces created on the system during camera assembly.

Abstract: A camera system includes a camera with a lens assembly and image processing electronics internal to the camera housing. The lens assembly and image processing electronics are sensitive to thermal gradients within the camera body. The image processing electronics are coupled to a thermal management system that transfers thermal energy away from the electronics towards a heat diffuser. The thermal management system comprises a heat controller with a heat source, an offset arm, and a heat exchange. The thermal energy moves from the heat source to the heat exchange via the offset arm. The thermal management system also manages heat transfer between auxiliary electronic components and the image processing electronics. The thermal management system is constructed of materials that react to the compressive forces created on the system during camera assembly.

Abstract: A propeller blade comprises a blade root coupled to a rotor hub and a blade tip. The propeller blade is composed of airfoil cross-sections, each cross-section a distance away from the rotor hub. Each airfoil is designed with particular structural characteristics that improve the overall amount of thrust generated on the quadcopter. Namely, each airfoil possesses a ? angle and chord length whose values depend on the distance of that airfoil from the rotor hub. For example, the relationship between an airfoil's ? angle and its distance from the rotor hub is described by a power law. Additionally, the relationship between an airfoil's chord length and its distance from the rotor hub is described using a polynomial regression. Compared to current, off the shelf propeller blades, the current propeller blade embodiment achieves the same thrust at a lower RPM, thereby yielding benefits in reduced acoustic noise and improved response time.

Abstract: A camera system includes a lens assembly and image processing electronics internal to the camera housing and thermally coupled to the battery assembly. The battery assembly is sensitive to low ambient temperatures and may become damaged if the temperature of the assembly becomes sufficiently low. The camera system comprises a thermal management system that dissipates heat from electronic components of the camera to increase or maintain the temperature of the battery assembly. The thermal management configures the electronic components in different modes to create a step-wise increase of the resistive heat generated in the camera system and thereby increase the temperature of the components in the camera system.

Abstract: A camera system includes a lens assembly and image processing electronics internal to the camera housing and thermally coupled to the battery assembly. The battery assembly is sensitive to low ambient temperatures and may become damaged if the temperature of the assembly becomes sufficiently low. The camera system comprises a thermal management system that dissipates heat from electronic components of the camera to increase or maintain the temperature of the battery assembly. The thermal management configures the electronic components in different modes to create a step-wise increase of the resistive heat generated in the camera system and thereby increase the temperature of the components in the camera system.

Abstract: A camera system includes a lens assembly and image processing electronics internal to the camera housing and thermally coupled to the battery assembly. The battery assembly is sensitive to low ambient temperatures and may become damaged if the temperature of the assembly becomes sufficiently low. The camera system comprises a thermal management system that dissipates heat from electronic components of the camera to increase or maintain the temperature of the battery assembly. The thermal management configures the electronic components in different modes to create a step-wise increase of the resistive heat generated in the camera system and thereby increase the temperature of the components in the camera system.

Abstract: An electronic device can be provided with a housing having at least one wall defining a cavity and a flow sensor at least partially contained within the cavity. The flow sensor may be configured to detect a flow characteristic related to the flow of a fluid through a first portion of the cavity. The electronic device may also include a processor configured to alter a performance characteristic of the electronic device based on the detected flow characteristic.