Abstract: A head-mounted display (HMD) device includes a printed circuit board having one or more processors. A heat transfer plate having a heat-generating component facing surface is thermally coupled to the printed circuit board. The HMD exterior-facing surface of the heat transfer plate opposite from the heat-generating component facing surface is thermally coupled to a heat pipe. The heat pipe is thermally coupled to a heat transfer shell, which is configured as a heat sink to receive heat from the heat pipe. In operation, heat flows from the heat-generating components of the HMD (e.g., the HMD's processor and other electronic components) to the heat transfer plate. Thermal energy removed from the heat-generating components is transferred to the heat transfer shell via the heat pipe, which in turn transfers the heat to the external surface of the HMD to be dissipated into ambient room temperature of the surrounding environment.

Abstract: A head mounted display (HMD) device for supporting virtual reality and augmented reality includes a frame and a thermal door component between which a mobile device may be sandwiched. The thermal door component includes a first portion that is substantially planar for reversibly coupling with a portion of a back surface of the mobile device and a heat sink. The heat sink includes a substantially planar portion coupled to a surface of the first portion of the thermal door component. The heat sink may be made of magnesium or other thermally conductive material. A second portion is coupled to the back of the first portion. An opening, channel, or recess that allows access to the interior of the thermal door component by ambient air to allow the thermal door component to draw heat away from the mobile device and the HMD device.

Abstract: A head-mounted display (HMD) device includes a printed circuit board having one or more processors. A heat transfer plate having a heat-generating component facing surface is thermally coupled to the printed circuit board. The HMD exterior-facing surface of the heat transfer plate opposite from the heat-generating component facing surface is thermally coupled to a heat pipe. The heat pipe is thermally coupled to a heat transfer shell, which is configured as a heat sink to receive heat from the heat pipe. In operation, heat flows from the heat-generating components of the HMD (e.g., the HMD's processor and other electronic components) to the heat transfer plate. Thermal energy removed from the heat-generating components is transferred to the heat transfer shell via the heat pipe, which in turn transfers the heat to the external surface of the HMD to be dissipated into ambient room temperature of the surrounding environment.

Abstract: A head mounted display (HMD) device for supporting virtual reality and augmented reality includes a frame and a thermal door component between which a mobile device may be sandwiched. The thermal door component includes a first portion that is substantially planar for reversibly coupling with a portion of a back surface of the mobile device and a heat sink. The heat sink includes a substantially planar portion coupled to a surface of the first portion of the thermal door component. The heat sink may be made of magnesium or other thermally conductive material. A second portion is coupled to the back of the first portion. An opening, channel, or recess that allows access to the interior of the thermal door component by ambient air to allow the thermal door component to draw heat away from the mobile device and the HMD device.

Abstract: A chip package for a computer system includes a substrate having a first region and a second region on a first surface, at least one die coupled to the first region on the first surface of the substrate and a main logic board coupled to the second region on the first surface of the substrate. By coupling the die and the main logic board on the first surface of the substrate, an overall thickness of the chip package is reduced.

Abstract: A cooling system for a computer is provided. In one implementation, the cooling system includes a heat spreader that is in thermal contact with a heat generating component in the computer, a frame casting, and a heat pipe to passively dissipate heat generated from the heat generating component in the computer to the frame casting. The heat pipe includes a first portion that is co-planar with and in direct contact with the heat generating component, and a second portion that is in thermal contact with the frame casting.

Abstract: A cooling system for a computer is provided. In one implementation, the cooling system includes a heat spreader that is in thermal contact with a heat generating component in the computer, a frame casting, and a heat pipe to passively dissipate heat generated from the heat generating component in the computer to the frame casting. The heat pipe includes a first portion that is co-planar with and in direct contact with the heat generating component, and a second portion that is in thermal contact with the frame casting.

Abstract: A chip package for a computer system includes a substrate having a first region and a second region on a first surface, at least one die coupled to the first region on the first surface of the substrate and a main logic board coupled to the second region on the first surface of the substrate. By coupling the die and the main logic board on the first surface of the substrate, an overall thickness of the chip package is reduced.

Abstract: A cooling system for a computer includes a heat spreader that is in thermal contact with at least one component in the computer, a frame casting, and at least one heat pipe coupled to the heat spreader and coupled to the frame casting for passively dissipating heat generated from the at least one component in the computer. By coupling the heat spreader to the frame casting via the at least one heat pipe, the conductive and convective heat transfer characteristics of the frame casting are utilized to provide additional passive cooling for the at least one component.

Abstract: A cooling system for a computer includes a heat spreader that is in thermal contact with at least one component in the computer, a frame casting, and at least one heat pipe coupled to the heat spreader and coupled to the frame casting for passively dissipating heat generated from the at least one component in the computer. By coupling the heat spreader to the frame casting via the at least one heat pipe, the conductive and convective heat transfer characteristics of the frame casting are utilized to provide additional passive cooling for the at least one component.