Patents by Inventor Ihavin Sinha

Ihavin Sinha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8048281
    Abstract: Methods for fabricating thin film magnetic head coil structures are disclosed. The methods disclose deposition of a first thick seed layer, followed by deposition of an ultra-thin second seed layer. Coil structures having sub-micron pitch and high aspect ratios are deposited on the second ultra-thin seed layer, which is removed from between the coil windings via an isotropic etch process such as wet etching or RIE. Subsequent to selective removal of the ultra-thin second seed layer, the first thick seed layer is utilized to deposit pole and backgap structures, eliminating the need to deposit (and remove) a subsequent seed layer on the coil structure.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: November 1, 2011
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Christian Rene Bonhote, Quang Le, Ihavin Sinha
  • Publication number: 20100084263
    Abstract: Methods for fabricating thin film magnetic head coil structures are disclosed. The methods disclose deposition of a first thick seed layer, followed by deposition of an ultra-thin second seed layer. Coil structures having sub-micron pitch and high aspect ratios are deposited on the second ultra-thin seed layer, which is removed from between the coil windings via an isotropic etch process such as wet etching or RIE. Subsequent to selective removal of the ultra-thin second seed layer, the first thick seed layer is utilized to deposit pole and backgap structures, eliminating the need to deposit (and remove) a subsequent seed layer on the coil structure.
    Type: Application
    Filed: October 2, 2008
    Publication date: April 8, 2010
    Inventors: Christian Rene Bonhote, Quang Le, Ihavin Sinha