Abstract: These vinyl-based polymerizable group-containing silane compounds may be used alone, or two or more thereof may be used in combination. The content of the vinyl-based polymerizable group-containing silane compound is 1% by mass or more and 10% by mass or less, and preferably 1% by mass or more and 5% by mass or less, in 100% by mass of the organosiloxane mixture. When the amount of the vinyl-based polymerizable group-containing silane compound is the lower limit value or more, the peeling force and impact resistance of the obtained cured product tend to be high. When the amount of the vinyl-based polymerizable group-containing silane compound is the upper limit value or less, the peeling force and impact resistance of the obtained cured product tend to be high.

Abstract: To provide an interlayer filler composition which, in 3D lamination of semiconductor device chips, forms a highly thermally conductive filling interlayer simultaneously with the bonding of solder bumps or the like and lands between semiconductor device chips, a coating fluid and a process for producing a three-dimensional integrated circuit. An interlayer filler composition for a three-dimensional integrated circuit, which comprises a resin (A) having a melt viscosity at 120° C. of at most 100 Pa·s and a flux (B), the content of the flux (B) being at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A).

Abstract: To provide an interlayer filler composition which, in 3D lamination of semiconductor device chips, forms a highly thermally conductive filling interlayer simultaneously with the bonding of solder bumps or the like and lands between semiconductor device chips, a coating fluid and a process for producing a three-dimensional integrated circuit. An interlayer filler composition for a three-dimensional integrated circuit, which comprises a resin (A) having a melt viscosity at 120° C. of at most 100 Pa·s and a flux (B), the content of the flux (B) being at least 0.1 part by weight and at most 10 parts by weight per 100 parts by weight of the resin (A).