Abstract: A tin (Sn)-based solder ball having appropriate characteristics for electronic products and a semiconductor package including the same are provided. The tin-based solder ball includes about 0.3 to 3.0 wt. % silver (Ag), about 0.4 to 0.8 wt. % copper (Cu), about 0.01 to 0.09 wt. % nickel (Ni), about 0.1% to 0.5 wt. % bismuth (Bi), and balance of tin (Sn) and unavoidable impurities.

Abstract: A display device includes a plurality of gate lines and a plurality of data lines crossing each other on a first substrate, to define a pixel; a first thin film transistor in a portion where the gate lines and the data lines cross each other; a plurality of position detection lines on the first substrate, the position detection lines spaced a constant distance from the data lines and crossing the gate lines; a second thin film transistor for detecting a position, in a portion on the first substrate where the gate lines and the position detection lines cross each other; a protrusion pattern protruding from a second substrate and corresponding to a drain electrode of the second thin film transistor; and a transparent conductive layer on the protrusion pattern, electrically connected to the drain electrode when touching.