Abstract: A cooking appliance may include a holder disposed in an induction heating element provided below a cover plate, and a supporter disposed inside the holder that supports a sensor inserted into the holder to contact the sensor to the cover plate.

Abstract: An electric range is provided, in which filter circuits are disposed at an edge of a lower end of a case and are spaced a maximum distance apart from a plurality of working coils, thereby reducing noise generated by the working coils as much as possible and improving performance of the filter circuits.

Abstract: An electric range is provided that may include an elastic holder to fix a fuse and a sensor in a central portion of an induction heating unit disposed over/on/in an upper portion of a base plate, thereby stably fixing the fuse and sensor against external impact. In the electric range, an upper end of the sensor may come into close contact with a lower surface of a cover plate disposed over/on/in an upper portion of the induction heating unit, thereby stably measuring a temperature of the cover plate and absorbing an external impact.

Abstract: Provided is a semiconductor fabrication technology; and, more particularly, to a semiconductor device having a heat release structure that uses a silicon-on-insulator (SOI) substrate, and a method for fabricating the semiconductor device. The device and method of the present research provides a semiconductor device having a high heat-release structure and high heat-release structure, and a fabrication method thereof. In the research, the heat and high-frequency noises that are generated in the integrated circuit are released outside of the substrate through the tunneling region quickly by forming an integrated circuit on a silicon-on-insulator (SOI) substrate, aiid removing a buried insulation layer under the integrated circuit to form a tunneling region. The heat-release efficiency can be enhanced much more, when unevenness is formed on the surfaces of the upper and lower parts of the tunneling region, or when the air or other gases having excellent heat conductivity is flown into the tunneling region.