Patents by Inventor IIha LEE

IIha LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONDUCTIVE STRUCTURE AND PREPARATION METHOD THEREFOR
    Publication number: 20180224960
    Abstract: The present application relates to a conductive structure and a method for manufacturing the same. The conductive structure according to an exemplary embodiment of the present application includes a substrate, a metal layer which is provided on the substrate and includes copper, a discoloration preventing layer provided on the metal layer, and a darkening layer which is provided on the discoloration preventing layer and includes one or more of copper oxide, copper nitride, copper oxynitride, aluminum oxide, aluminum nitride, and aluminum oxynitride.
    Type: Application
    Filed: September 23, 2015
    Publication date: August 9, 2018
    Applicant: LG CHEM LTD.
    Inventors: Chan Hyoung PARK, Ki-Hwan Kim, Jin Hyong LIM, IIha LEE
  • CONDUCTIVE STRUCTURE BODY AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20150373844
    Abstract: The present specification relates to a conductive structure body and a method for manufacturing the same.
    Type: Application
    Filed: November 4, 2014
    Publication date: December 24, 2015
    Inventors: Junghwan YOON, Jin Hyong LIM, Yong Chan KIM, IIha LEE, Ki-Hwan KIM
  • CONDUCTIVE STRUCTURE BODY PRECURSOR, CONDUCTIVE STRUCTURE BODY AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20150370359
    Abstract: The present application provides a conductive structure body precursor, a conductive structure body and a method for manufacturing the same.
    Type: Application
    Filed: November 27, 2014
    Publication date: December 24, 2015
    Inventors: Jin Hyong LIM, Yong Chan KIM, Junghwan YOON, Jung II YOON, KI-Hwan KIM, IIha LEE