Abstract: A semiconductor package includes a plurality of semiconductor chips each including a front insulating layer and a rear insulating layer, wherein the plurality of semiconductor chips are bonded to each other through a first direct bonding between the front insulating layer and the rear insulating layer, wherein at least one of the plurality of semiconductor chips includes: a device layer includes a wiring structure, a semiconductor substrate above the device layer, a plurality of front pads electrically connected to the wiring structure in front of the device layer, and the front insulating layer surrounding the plurality of front pads in front of the device layer, and wherein the front insulating layer includes a burr buried in an edge of a front surface of the front insulating layer.

Abstract: A sensor device includes: a support structure having a cantilever shape extending in a first direction and having a first end fixed; a sensing element having a surface and a resonant frequency changing according to contaminants adsorbed to the surface and disposed at a second end of the support structure; a frequency detector configured to detect the resonant frequency of the sensing element; and an actuator disposed at the one end of the support structure and configured to move the support structure so that the second end of the support structure moves in a second direction perpendicular to the first direction.

Abstract: Disclosed are a combination structure including a nanostructure array including a plurality of nanostructures with a smaller dimension than the near-infrared wavelength are repeatedly arranged and a light absorption portion adjacent to the nanostructure array and including a near-infrared absorbing material configured to absorb light in at least a portion of near-infrared wavelength regions, an optical filter, an image sensor, a camera module, and an electronic device including the same.

Abstract: A measurement unit for measuring a bio-impedance of a body, the measurement unit comprising a current generator circuit, a readout circuit, and a baseline cancellation current circuit, wherein the current generator circuit is configured to amplify a reference current to form a measurement current to be driven through a body to generate a measurement voltage representing the bio-impedance; wherein the readout circuit comprises a Instrumentation amplifier (IA) which has a transconductance stage and a transimpedance stage, wherein the IA is configured to: produce a first current in the transconductance stage, the first current being proportional to the measurement voltage, receive a second current from the baseline cancellation current circuit, produce an output voltage in the transimpedance stage, the output voltage being proportional to a difference between the first current and the second current and representative of the measured bio-impedance; wherein the baseline cancellation current circuit is confi

Abstract: A three-dimensional location measurement sensor including first and second rotation plates to rotate about a fixed axial member independently of each other, a camera, formed inside the fixed axial member in the middle of the second rotation plate, a mirror, to be supported by a mirror supporting unit so as to be disposed over the camera, the mirror supporting unit being fixed to the first rotation plate, at least one light source, to be supported by a light source supporting unit so as to be disposed between the mirror and the second rotation plate, the light source supporting unit being fixed to the first rotation plate, a mark, to be supported by a mark supporting unit so as to be disposed between the mirror and the second rotation plate, the mark supporting unit being formed on the second rotation plate, and a gear unit, which is formed at an outer circumference of the second rotation plate and adjusts an inclination angle of the mirror.