Patents by Inventor Iipo Kokkonen

Iipo Kokkonen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Trimming of embedded structures
    Publication number: 20050230349
    Abstract: The idea of the invention is to form a cavity in a multilayer substrate at the point of the structure to be trimmed. This enables the embedding of tolerance critical components inside substrates, such as printed circuit boards, modules, and sub-systems. Trimming is done through the cavity using, for example, a laser. After trimming the cavity is easy to fill in with a suitable dielectric material, or to cover otherwise, e.g. by using a lid, or to leave the cavity uncovered.
    Type: Application
    Filed: June 20, 2005
    Publication date: October 20, 2005
    Inventors: Olli Salmela, IIpo Kokkonen
  • Trimming of embedded structures
    Patent number: 6921868
    Abstract: A cavity is formed in a multilayer substrate at the point of the structure to be trimmed. This enables the embedding of tolerance critical components inside substrates, such as printed circuit boards, modules, and sub-systems. Trimming is done through the cavity using, for example, a laser. After trimming the cavity is easy to fill in with a suitable dielectric material or to cover otherwise, e.g. by using a lid, or to leave the cavity uncovered.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: July 26, 2005
    Assignee: Nokia Corporation
    Inventors: Olli Salmela, Iipo Kokkonen