Abstract: A medical device includes an elongated medical device body; a first operating line and a second operating line inserted in an axial direction of the medical device body; and a bending operating part for performing a bending operation of a distal end part of the medical device body by pulling the first and second operating lines, at an intermediate part and a proximal end part in the axial direction of the medical device body, the first and second operating lines extending in parallel so as to be spaced apart from each other in a circumferential direction of the medical device body, and at the distal end part in the axial direction of the medical device body, the first and second operating lines being curved and joined together so as to approach each other in the circumferential direction of the medical device body gradually toward a distal end side.

Abstract: A medical device includes a medical device body, first and second operating lines inserted in axial direction of the device body, and a bending operating part that pulls the operating lines to perform bending operation of a distal end part of the device body. The device body has the distal end part in the axial direction such that the operating lines are gradually curved and approach each other in circumferential direction of the device body toward a distal end side in the distal end part. The device body has a curved region and a parallel region such that in the curved region, the operating lines gradually curve and approach each other in the circumferential direction toward the distal end side and that in a parallel region, the operating lines extend in parallel to each other between the distal end of the curved region and distal ends of the operating lines.

Abstract: A medical device includes an elongated medical device body; a first operating line and a second operating line that are inserted in an axial direction of the medical device body; and a bending operating part for performing a bending operation of a distal end part of the medical device body by pulling the first operating line and the second operating line, in which at an intermediate part and a proximal end part in the axial direction of the medical device body, a first operating line and a second operating line extend in parallel so as to be spaced apart from each other in a circumferential direction of the medical device body, and at a distal end part in the axial direction of the medical device body, the first operating line and the second operating line are gradually curved so as to approach each other in the circumferential direction of the medical device body toward a distal end side and joined together.

Abstract: The present invention provides a catheter provided with a tubular main body. The catheter is characterized in that: the tubular main body has defined therein a first length region and a second length region which is adjacent to the first length region and which is located closer to the distal side than the first length region; the resin hardness of the second length region is lower than the resin hardness of the first length region; and the distance from a plane perpendicular to the axial direction of the tubular main body to the joining line between the first length region and the second length region is non-uniform.

Abstract: The invention provides a medical device or the like including an elongated medical device body; a first operating line and a second operating line that are inserted in an axial direction of the medical device body; and a bending operating part for performing a bending operation of a distal end part of the medical device body by pulling the first operating line and the second operating line, at an intermediate part and a proximal end part in the axial direction of the medical device body, the first operating line and the second operating line extending in parallel so as to be spaced apart from each other in a circumferential direction of the medical device body, and at a distal end part in the axial direction of the medical device body, the first operating line and the second operating line being curved and joined together so as to approach each other in the circumferential direction of the medical device body gradually toward a distal end side.

Abstract: There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less.

Abstract: The present invention provides: an insulating substrate or metal-clad laminate able to sufficiently reduce or prevent negative warping of a semiconductor device; a printed wiring board that uses the insulating substrate or metal-clad laminate; and a semiconductor device. The insulating substrate is composed of a cured product of a laminate including one or more fibrous base material layers and two or more resin layers, in which the outermost layers on both sides is the resin layers. At least one of the fibrous base material layers is shifted towards the first side or a second side on the opposite side thereof with respect to the reference position, namely the dividing position at which a total thickness of the insulating substrate is equally divided by the number of the fibrous base material layers and each divided region having the thickness is further equally divided by two. The fibrous base material layers are not shifted in different directions.

Abstract: Disclosed are a composite body, a method for producing the composite body and a semiconductor device, the composite body comprising a resin layer and a fine wiring and/or via hole being formed in the resin layer, having high adhesion and high reliability, and being capable of high frequencies. Also disclosed are a resin composition and a resin sheet, both of which can provide such a composite body. The composite body comprises a resin layer and an electroconductive layer, wherein a groove having a maximum width of 1 ?m or more and 10 ?m or less is on a surface of the resin layer; the electroconductive layer is inside the groove; and a surface of the resin layer being in contact with the electroconductive layer has an arithmetic average roughness (Ra) of 0.05 ?m or more and 0.

Abstract: There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less.

Abstract: An insulating resin layer, which is capable of being employed for forming a multiple-layered printed wiring board via a thermal compression forming process, comprising: at least one first layer and at least one second layer being stacked, wherein a specific dielectric constant of the first layer at a frequency of 1 MHz after the thermal compression forming is not more than 3.2, and wherein a linear expansion coefficient of the second layer at a temperature within a range of from not lower than 35 degree C. to not higher than 85 degree C. after the thermal compression forming is not more than 40 ppm/degree C. A multiple-layered printed wiring board, formed by disposing the aforementioned insulating resin layer over at least one side of an internal layer circuit board, and then conducting a thermal compression forming process.

Abstract: The present invention provides the miniaturization and weight reduction of the multi-layer circuit board and improvement in the processability thereof. The multi-layer circuit board comprises a substrate 10, on at least one surface of a substrate 10, a first electrical conductive circuit (metal plating film 30) disposed on the substrate 10, an resin layer 20 disposed on the first electrical conductive circuit and a second electrical conductive circuit (metal plating film 30) disposed on the resin layer. The resin layer 20 is composed of a resin compound including benzocyclobutene resin, particulate inorganic filler and ultraviolet absorbent.