Patents by Inventor Ik-Ho CHOI

Ik-Ho CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11958210
    Abstract: Disclosed are wood preforming devices for manufacturing a crash pad for a vehicle including a real wood sheet. A wood preforming device for manufacturing a crash pad for a vehicle includes a real wood sheet includes a lower press mold comprising a debossed portion provided on a portion on which a product is formed, and a support portion configured to support an upper press mold, in response to the lower press mold and the upper press mold pressing each other, the support portion having a protrusion for fixing a real wood sheet, the upper press mold having an embossed portion corresponding to the debossed portion of the lower press mold, and a movable core provided on the debossed portion of the lower press mold and being configured to guide the real wood sheet by moving upward from the debossed portion, in response to the upper press mold moving downward.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: April 16, 2024
    Assignees: Hyundai Mobis Co., Ltd., Intops Co., Ltd., Seoyon Autovision Co., Ltd.
    Inventors: Ik Keun Choi, Min Kyeong Lee, Hyun Ho Lee, Ji Seung Hong, Jong Jin Lee
  • Publication number: 20120006687
    Abstract: Disclosed herein is a method of forming a CIGS thin film, comprising the steps of: immersing a substrate comprising an electrode into an electrolyte solution comprising Na2SO4, a water-soluble copper (Cu) precursor, a water-soluble indium (In) precursor, a water-soluble gallium (Ga) precursor, and a water-soluble selenium (Se) precursor; performing electrodeposition in such a way as to apply a direct current (DC) voltage of ?0.95V˜?0.85V to the electrolyte solution at room temperature and normal pressure for 10˜120 minutes to form a preliminary CIGS thin film; and heat-treating the preliminary CIGS thin film at 230˜270° C. to form a CIGS thin film.
    Type: Application
    Filed: January 6, 2011
    Publication date: January 12, 2012
    Inventors: Chi-Woo LEE, Sang-Min LEE, Suk-In HONG, Ik-Ho CHOI