Abstract: A method for manufacturing a semiconductor package includes disposing a semiconductor chip having contact pads, and a connection structure around the semiconductor chip on a supporting substrate, with the contact pads facing the supporting substrate, forming an encapsulant encapsulating the semiconductor chip and the connection structure on the supporting substrate, embedding a wiring pattern having a connection portion in the encapsulant, the connection portion having a connection hole, forming a through hole penetrating the encapsulant in the connection hole, the through hole exposing a portion of an upper surface of the connection structure, and forming a conductive via in the through hole, the conductive via connecting the wiring pattern to the connection structure.

Abstract: A charging connector control system may include a charging control unit of a charging equipment for supplying a control signal for charging; and a vehicle control unit for changing a sensing control signal to a normal control signal by executing a variable resistor control according to whether the sensing control signal, which is generated by sensing the control signal transmitted through a charging connector for connecting the charging equipment and a vehicle, is normal.

Abstract: A system for managing a battery of a vehicle includes a first controller configured to control a power-on (IG ON) state and a power-off (IG OFF) state of a plurality of controllers in the vehicle and to be periodically woken up in the power-off (IG OFF) state to wake up at least some of the plurality of controllers, and a second controller configured to turn off a main relay connecting a first battery in the vehicle and a vehicle system when the power-off (IG OFF) state begins, to monitor a state of the first battery storing energy for generating power of the vehicle by maintaining power during a preset first reference time, to be woken up at a wake-up period of the first controller when the first reference time elapses, and to monitor the state of the first battery.

Abstract: A system for managing a battery of a vehicle includes a first controller configured to control a power-on (IG ON) state and a power-off (IG OFF) state of a plurality of controllers in the vehicle and to be periodically woken up in the power-off (IG OFF) state to wake up at least some of the plurality of controllers, and a second controller configured to turn off a main relay connecting a first battery in the vehicle and a vehicle system when the power-off (IG OFF) state begins, to monitor a state of the first battery storing energy for generating power of the vehicle by maintaining power during a preset first reference time, to be woken up at a wake-up period of the first controller when the first reference time elapses, and to monitor the state of the first battery.

Abstract: A method for manufacturing a semiconductor package includes disposing a semiconductor chip having contact pads, and a connection structure around the semiconductor chip on a supporting substrate, with the contact pads facing the supporting substrate, forming an encapsulant encapsulating the semiconductor chip and the connection structure on the supporting substrate, embedding a wiring pattern having a connection portion in the encapsulant, the connection portion having a connection hole, forming a through hole penetrating the encapsulant in the connection hole, the through hole exposing a portion of an upper surface of the connection structure, and forming a conductive via in the through hole, the conductive via connecting the wiring pattern to the connection structure.

Abstract: An apparatus, a system, and a method are for automatically billing a vehicle left unattended in a charging station. The automatic billing apparatus includes a processor that provides a vehicle charging service at a charging station, determines that a vehicle is unattended after charging is completed, and performs a billing based on an unattended time. The apparatus further includes a storage that stores data obtained by the processor when the billing is performed.

Abstract: A semiconductor package includes a supporting member that has a cavity and includes a wiring structure connecting first and second surfaces opposing each other. A connection member is on the second surface of the supporting member and includes a first redistribution layer connected to the wiring structure. A semiconductor chip is on the connection member in the cavity and has connection pads connected to the first redistribution layer. An encapsulant encapsulates the semiconductor chip disposed in the cavity and covers the first surface of the supporting member. A second redistribution layer includes wiring patterns embedded in the encapsulant and has exposed surfaces and connection vias that penetrate through the encapsulant to connect the wiring structure and the wiring patterns to each other.

Abstract: A carrier substrate comprises a core layer, a first metal layer disposed on the core layer, a release layer disposed on the first metal layer, and a second metal layer disposed on the release layer. At least one layer among the first metal layer, the release layer, and the second metal layer is disposed in a plurality of unit pattern portions having an area smaller than an area of the core layer. In addition, a method of manufacturing a semiconductor package using the carrier substrate is provided.

Abstract: A charging connector control system may include a charging control unit of a charging equipment for supplying a control signal for charging; and a vehicle control unit for changing a sensing control signal to a normal control signal by executing a variable resistor control according to whether the sensing control signal, which is generated by sensing the control signal transmitted through a charging connector for connecting the charging equipment and a vehicle, is normal.

Abstract: An apparatus, a system, and a method are for automatically billing a vehicle left unattended in a charging station. The automatic billing apparatus includes a processor that provides a vehicle charging service at a charging station, determines that a vehicle is unattended after charging is completed, and performs a billing based on an unattended time. The apparatus further includes a storage that stores data obtained by the processor when the billing is performed.

Abstract: A semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon; a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; a passivation layer disposed on the connection member; and an underbump metallurgy (UBM) layer embedded in the passivation layer and electrically connected to the redistribution layer of the connection member, wherein the UBM layer includes a UBM pad embedded in the passivation layer, at least one plating layer disposed on the UBM pad and having side surfaces of which at least portions are covered by the UBM pad, and a UBM via penetrating through at least portions of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other.

Abstract: A carrier substrate comprises a core layer, a first metal layer disposed on the core layer, a release layer disposed on the first metal layer, and a second metal layer disposed on the release layer. At least one layer among the first metal layer, the release layer, and the second metal layer is disposed in a plurality of unit pattern portions having an area smaller than an area of the core layer. In addition, a method of manufacturing a semiconductor package using the carrier substrate is provided.

Abstract: A carrier substrate comprises a core layer, a first metal layer disposed on the core layer, a release layer disposed on the first metal layer, and a second metal layer disposed on the release layer. At least one layer among the first metal layer, the release layer, and the second metal layer is disposed in a plurality of unit pattern portions having an area smaller than an area of the core layer. In addition, a method of manufacturing a semiconductor package using the carrier substrate is provided.

Abstract: A carrier substrate comprises a core layer, a first metal layer disposed on the core layer, a release layer disposed on the first metal layer, and a second metal layer disposed on the release layer. At least one layer among the first metal layer, the release layer, and the second metal layer is disposed in a plurality of unit pattern portions having an area smaller than an area of the core layer. In addition, a method of manufacturing a semiconductor package using the carrier substrate is provided.

Abstract: A semiconductor package includes a supporting member that has a cavity and includes a wiring structure connecting first and second surfaces opposing each other. A connection member is on the second surface of the supporting member and includes a first redistribution layer connected to the wiring structure. A semiconductor chip is on the connection member in the cavity and has connection pads connected to the first redistribution layer. An encapsulant encapsulates the semiconductor chip disposed in the cavity and covers the first surface of the supporting member. A second redistribution layer includes wiring patterns embedded in the encapsulant and has exposed surfaces and connection vias that penetrate through the encapsulant to connect the wiring structure and the wiring patterns to each other.

Abstract: A semiconductor package includes: a semiconductor chip having an active surface having connection pads disposed thereon; a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads; a passivation layer disposed on the connection member; and an underbump metallurgy (UBM) layer embedded in the passivation layer and electrically connected to the redistribution layer of the connection member, wherein the UBM layer includes a UBM pad embedded in the passivation layer, at least one plating layer disposed on the UBM pad and having side surfaces of which at least portions are covered by the UBM pad, and a UBM via penetrating through at least portions of the passivation layer and electrically connecting the redistribution layer of the connection member and the UBM pad to each other.

Abstract: Disclosed are block copolymer formed by block-copolymerizing vinyl aromatic hydrocarbon and conjugated diene compound and asphalt modifier composition including specific functional additives. Asphalt modifier composition according to the present invention is rapidly dissolved in asphalt without substantially lowering a softening point of asphalt, making it possible to form uniform asphalt composition and improve the productivity of the asphalt composition.

Abstract: Disclosed are block copolymer formed by block-copolymerizing vinyl aromatic hydrocarbon and conjugated diene compound and asphalt modifier composition including specific functional additives. Asphalt modifier composition according to the present invention is rapidly dissolved in asphalt without substantially lowering a softening point of asphalt, making it possible to form uniform asphalt composition and improve the productivity of the asphalt composition.

Abstract: The present invention relates to a graft copolymer and a method for preparing the same, and more precisely a graft copolymer prepared by the steps of preparing a living activator with a single monomer and a block copolymer of a vinyl aromatic hydrocarbon or a conjugated diene hydrocarbon; and then grafting the prepared living activator to polyolefin polymer, and a method for preparing the same. According to the method of the present invention, the individual vinyl aromatic hydrocarbon or conjugated diene hydrocarbon polymers, and a block copolymer thereof, can be grafted onto chlorinated polyolefin polymer as a branch by using a living activator, and the resultant graft copolymer can be widely applied to various high molecular additives, compatabilizers, waterproof sheets and asphalt, etc.