Abstract: A display panel including a circuit board including first pads, first light emitting devices disposed on the circuit board and including pads, at least one second light emitting device disposed on the circuit board and including pads, metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board, and a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion.

Abstract: A flat bonding method of light emitting devices including bonding light emitting devices on a circuit board using a reflow process, and re-bonding at least a portion of the light emitting devices bonded on the circuit board using a press plate while pressing the portion of the light emitting devices.

Abstract: A display panel including a circuit board including first pads, first light emitting devices disposed on the circuit board and including pads, at least one second light emitting device disposed on the circuit board and including pads, metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board, and a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion.

Abstract: A flat bonding method of light emitting devices including bonding light emitting devices on a circuit board using a reflow process, and re-bonding at least a portion of the light emitting devices bonded on the circuit board using a press plate while pressing the portion of the light emitting devices.

Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and a surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.

Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and an upper surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.

Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and an upper surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.

Abstract: A method of transferring a plurality of micro LEDs formed on a substrate including transferring the micro LEDs onto a first carrier substrate having a first adhesive material layer, reducing an adhesiveness of the first adhesive material layer by curing the first adhesive material layer, transferring the micro LEDs from the first carrier substrate onto a second carrier substrate having a second adhesive material layer, bonding at least a portion of the micro LEDs on the second carrier substrate to pads of a circuit board using a metal bonding layer, and separating the second carrier substrate from the micro LEDs bonded onto the circuit board.

Abstract: A display panel including a circuit board having first pads, a plurality of light emitting devices disposed on the circuit board and having second pads, at least one of the light emitting devices including a repaired light emitting device, and a metal bonding layer bonding the first pads and the second pads, in which the metal bonding layer of the repaired light emitting device has at least one of a thickness and a composition different from that of the metal bonding layer of the remaining light emitting devices.

Abstract: A method of manufacturing a light emitting module includes mounting a plurality of unit pixels on a module substrate, thermally curing a light diffusion film and a black film, laminating the light diffusion film and the black film, forming a molding layer to surround side surfaces of the plurality of unit pixels by disposing the laminated light diffusion film and the black film on the module substrate, and pressing the light diffusion film and the black film; and cutting and removing edges of the module substrate and the molding layer. The molding layer includes a light diffusion layer and a black molding layer disposed on the light diffusion layer.

Abstract: A pixel module includes a circuit board, a plurality of unit pixels arranged on the circuit board, and a molding member covering the plurality of unit pixels. The molding member includes a light diffusion layer and a black molding layer covering the light diffusion layer.

Abstract: A transferring method for a light emitting device for a display includes manufacturing a wafer having unit pixels, cutting the wafer on a temporary substrate to singularize the unit pixels, measuring electrical or optical characteristics of the singularized unit pixels, and transferring unit pixels selected according to the electrical or optical characteristics to a carrier substrate. The selected unit pixels are transferred to the carrier substrate in a unit of a predetermined area encompassing a plurality of unit pixels.

Abstract: A flat bonding method of light emitting devices including bonding light emitting devices on a circuit board using a reflow process, and re-bonding at least a portion of the light emitting devices bonded on the circuit board using a press plate while pressing the portion of the light emitting devices.

Abstract: A display panel including a circuit board including first pads, first light emitting devices disposed on the circuit board and including pads, at least one second light emitting device disposed on the circuit board and including pads, metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board, and a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion.

Abstract: A method of transferring a plurality of micro LEDs formed on a substrate including transferring the micro LEDs onto a first carrier substrate having a first adhesive material layer, reducing an adhesiveness of the first adhesive material layer by curing the first adhesive material layer, transferring the micro LEDs from the first carrier substrate onto a second carrier substrate having a second adhesive material layer, bonding at least a portion of the micro LEDs on the second carrier substrate to pads of a circuit board using a metal bonding layer, and separating the second carrier substrate from the micro LEDs bonded onto the circuit board.

Abstract: A display panel including a circuit board having first pads, a plurality of light emitting devices disposed on the circuit board and having second pads, at least one of the light emitting devices including a repaired light emitting device, and a metal bonding layer bonding the first pads and the second pads, in which the metal bonding layer of the repaired light emitting device has at least one of a thickness and a composition different from that of the metal bonding layer of the remaining light emitting devices.