Patents by Inventor Ik Kyun Na

Ik Kyun Na has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8070199
    Abstract: Disclosed is a semiconductor package pickup apparatus. The apparatus includes a picker base formed with first and second main feeding holes, which are connected to each pneumatic line providing a pneumatic pressure and aligned in a dual-layer structure, and an adsorption pad coupled to a lower portion of the picker base and formed with adsorption holes connected to the first and second main feeding holes. The pneumatic pressure supplied into the first and second main feeding holes is independently controlled, so that the apparatus easily loads or picks up semiconductor packages, even if the size of the semiconductor packages becomes reduced.
    Type: Grant
    Filed: April 18, 2006
    Date of Patent: December 6, 2011
    Assignee: Hanmi Semiconductor, Inc.
    Inventors: Ik Kyun Na, Yong Goo Lee, Nho-Kwon Kwak
  • Publication number: 20090311087
    Abstract: Disclosed is a semiconductor package pickup apparatus. The apparatus includes a picker base formed with first and second main feeding holes, which are connected to each pneumatic line providing a pneumatic pressure and aligned in a dual-layer structure, and an adsorption pad coupled to a lower portion of the picker base and formed with adsorption holes connected to the first and second main feeding holes. The pneumatic pressure supplied into the first and second main feeding holes is independently controlled, so that the apparatus easily loads or picks up semiconductor packages, even if the size of the semiconductor packages becomes reduced.
    Type: Application
    Filed: April 18, 2006
    Publication date: December 17, 2009
    Inventors: Ik Kyun Na, Yong Goo Lee, Nho-Kwon Kwak