Patents by Inventor Ik Soo Kwon

Ik Soo Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230148968
    Abstract: An implantable device and method of manufacture include a substantially hermetic polychlorotrifluoroethylene (PCTFE) enclosure with closely-spaced wires extending through a slit in the enclosure. A method for manufacturing the implantable device includes cutting a slit in a piece of polymer and extending a plurality of insulated wires through the slit. Each of the insulated wires are parallel to a neighboring wire of the insulated wires. The piece of polymer is thermally bonded around each wire of the plurality of insulated wires such that the piece of polymer is sealed around insulation of each wire with a portion of each wire extending through the piece of polymer.
    Type: Application
    Filed: November 17, 2021
    Publication date: May 18, 2023
    Applicant: Neuralink Corp.
    Inventors: Ik Soo Kwon, Dongjin Seo, John W.F. To
  • Publication number: 20230154809
    Abstract: An implantable device and method of manufacture include a substantially hermetic polychlorotrifluoroethylene (PCTFE) enclosure with closely-spaced wires extending out of the enclosure. The implantable device includes a PCTFE first portion of an enclosure and a PCTFE second portion of the enclosure. The first and second portions are configured to mate with each other to form the enclosure. A plurality of insulated wires extend between the first and second portions of the enclosure. Each of the insulated wires are parallel to each other and separated by less than 150 micrometers (?m) from a neighboring wire. A thermal weld seam of PCTFE is disposed between the first portion of the enclosure and the second portion of the enclosure and conformally adheres around insulation of each wire such that the enclosure is sealed.
    Type: Application
    Filed: November 17, 2021
    Publication date: May 18, 2023
    Applicant: Neuralink Corp.
    Inventors: John W.F. To, Ik Soo Kwon, Donjin Seo, Yu Niu ("Peter") Huang, Jiahao Guo, Robin E. Young, Joshua Scott Hess, Zachary M. Tedoff, Russell N. Ohnemus, Dominic A. Herincx