Patents by Inventor Iku Higashidani

Iku Higashidani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160133760
    Abstract: A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material. The thickness of the oxide film on a surface to the molten solder plate layer is suppressed to be not more than 7 nm.
    Type: Application
    Filed: January 15, 2016
    Publication date: May 12, 2016
    Inventors: Hajime NISHI, Yuju ENDO, Ken TAKAHASHI, Hiromitsu KURODA, Hiroyuki AKUTSU, Katsunori SAWAHATA, Hiroshi BANDO, Iku HIGASHIDANI, Hiroshi OKIKAWA
  • Patent number: 9279176
    Abstract: A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material formed rectangular in a cross section thereof so as to be bonded by soldering to an electrode of a solar cell, using a flux. A thickness of an oxide film on a surface of the molten solder plated layer, which is a sum of a thickness of an SnO layer and a thickness of an SnO2 layer on the surface of the molten solder plated layer, is not more than 7 nm.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: March 8, 2016
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Ken Takahashi, Hiromitsu Kuroda, Hiroyuki Akutsu, Katsunori Sawahata, Hiroshi Bando, Iku Higashidani, Hiroshi Okikawa
  • Patent number: 8653380
    Abstract: A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: February 18, 2014
    Assignees: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Ken Takahashi, Hiromitsu Kuroda, Hiroshi Okikawa, Kuniaki Kimoto, Hiroyuki Akutsu, Yukio Ito, Iku Higashidani
  • Patent number: 8250744
    Abstract: A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: August 28, 2012
    Assignees: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Seigi Aoyama, Hiroshi Bando, Iku Higashidani, Yoshiharu Masaki, Hiroshi Okikawa
  • Patent number: 8143525
    Abstract: A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: March 27, 2012
    Assignees: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Hiroyuki Akutsu, Hiroshi Bando, Iku Higashidani, Katsunori Sawahata, Yukio Ito, Hiroshi Okikawa
  • Publication number: 20110220196
    Abstract: Disclosed is a lead wire for a solar cell having excellent bondability with a solar cell. The solar cell lead wire (10) has a band plate-shaped electroconductive material (12) that is formed with straight-angled cross-sectional shape and is covered by a molten solder plating layer (13), with the thickness of the oxide film on the surface of the molten solder plating layer (13) being 7 nm or less.
    Type: Application
    Filed: November 20, 2009
    Publication date: September 15, 2011
    Inventors: Hajime Nishi, Yuju Endo, Ken Takahashi, Hiromitsu Kuroda, Hiroyuki Akutsu, Katsunori Sawahata, Hiroshi Bando, Iku Higashidani, Hiroshi Okikawa
  • Publication number: 20100218981
    Abstract: A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.
    Type: Application
    Filed: February 26, 2010
    Publication date: September 2, 2010
    Applicants: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Ken Takahashi, Hiromitsu Kuroda, Hiroshi Okikawa, Kuniaki Kimoto, Hiroyuki Akutsu, Yukio Ito, Iku Higashidani
  • Publication number: 20100018748
    Abstract: A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling.
    Type: Application
    Filed: July 17, 2009
    Publication date: January 28, 2010
    Applicants: HITACHI CABLE, LTD., HITACHI CABLE FINE-TECH, LTD.
    Inventors: Seigi Aoyama, Hiroshi Bando, Iku Higashidani, Yoshiharu Masaki, Hiroshi Okikawa
  • Publication number: 20090255710
    Abstract: A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.
    Type: Application
    Filed: December 16, 2008
    Publication date: October 15, 2009
    Applicants: Hitachi Cable, Ltd., Hitachi Cable Fine-Tech, Ltd.
    Inventors: Hajime Nishi, Yuju Endo, Hiroyuki Akutsu, Hiroshi Bando, Iku Higashidani, Katsunori Sawahata, Yukio Ito, Hiroshi Okikawa