Abstract: An apparatus and method of managing power in a communication device determines if the communication device is moving in one of a plurality of predefined movement modes, which may be one of a first mode and a second mode. The method causes the communication device 1) to consume power at a first rate if in the first mode, and 2) consume power at a second rate, relative to the first rate, if in the second mode. The first rate is different than the second rate.

Abstract: The oscillation type inertial force sensor includes an oscillator arranged to detect an inertial force, an oscillation circuit unit arranged to drive the oscillator, and a signal processing circuit unit arranged to generate a signal according to the magnitude of the inertial force on the basis of a detection output of the oscillator, and further includes a holding arranged to hold a processed signal in the signal processing circuit unit at a predetermined potential during a period immediately after power-on until operation of the oscillation circuit unit becomes stable in response to power-on.

Abstract: An apparatus and method of managing power in a communication device determines if the communication device is moving in one of a plurality of predefined movement modes, which may be one of a first mode and a second mode. The method causes the communication device 1) to consume power at a first rate if in the first mode, and 2) consume power at a second rate, relative to the first rate, if in the second mode. The first rate is different than the second rate.

Abstract: The oscillation type inertial force sensor includes an oscillator arranged to detect an inertial force, an oscillation circuit unit arranged to drive the oscillator, and a signal processing circuit unit arranged to generate a signal according to the magnitude of the inertial force on the basis of a detection output of the oscillator, and further includes a holding arranged to hold a processed signal in the signal processing circuit unit at a predetermined potential during a period immediately after power-on until operation of the oscillation circuit unit becomes stable in response to power-on.

Abstract: A vibrating gyroscope includes supporting members which are fixed in the vicinity of two node axes n1 and n2 of a bar-shaped vibrator. The supporting members corresponding to node axis n1 extend from the locations at which they are fixed to the vibrator in the widthwise direction of the vibrator, and also include bending portions and a proximity portion. The bending portions bend toward node axis n1. At the proximity portion, the supporting members are in close proximity with each other with a gap therebetween in the vicinity of node axis n1.

Abstract: A blanking plate is attached to the bottom surfaces of a split board and a remaining board, which are separated from one bare board. After depositing solder paste on a back electrode of the split board, a solder ball is attached on the solder paste. The split board is then heated to melt the solder ball. The molten solder flows along the back electrode and an edge electrode into a through-hole. A portion of the molten solder swells out of the bottom surface of the bare board, and solidifies and bonds to the back electrode and the edge electrode.

Abstract: A vibrating gyroscope includes supporting members which are fixed in the vicinity of two node axes n1 and n2 of a bar-shaped vibrator. The supporting members corresponding to node axis n1 extend from the locations at which they are fixed to the vibrator in the widthwise direction of the vibrator, and also include bending portions and a proximity portion. The bending portions bend toward node axis n1. At the proximity portion, the supporting members are in close proximity with each other with a gap therebetween in the vicinity of node axis n1.

Abstract: A blanking plate is attached to the bottom surfaces of a split board and a remaining board, which are separated from one bare board. After depositing solder paste on a back electrode of the split board, a solder ball is attached on the solder paste. The split board is then heated to melt the solder ball. The molten solder flows along the back electrode and an edge electrode into a through-hole. A portion of the molten solder swells out of the bottom surface of the bare board, and solidifies and bonds to the back electrode and the edge electrode.