Patents by Inventor Iku Sano

Iku Sano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12023761
    Abstract: A laser processing device includes a stage; a laser irradiation unit; an image capturing unit; a control portion configured to execute controlling the laser irradiation unit such that one or a plurality of modified regions are formed inside the semiconductor substrate when the wafer is irradiated with the laser light, determining whether or not a crack extending from the modified region is in a crack reaching state where the crack has reached a front surface side of the semiconductor substrate on the basis of a signal output from the image capturing unit, and deriving information related to adjustment of irradiation conditions of the laser irradiation unit on the basis of determination results.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: July 2, 2024
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Iku Sano, Takeshi Sakamoto
  • Publication number: 20230343646
    Abstract: A workpiece cutting method includes: a first step of pasting an expandable sheet on a workpiece; a second step of irradiating, after the first step, the workpiece with laser light to form a modified region and expanding the expandable sheet to divide the workpiece into a plurality of chips, and meanwhile, to form a gap disposed between the plurality of chips and extending to a side surface of the workpiece; a third step of irradiating the expandable sheet with an ultraviolet light after the first step; a fourth step of filling, after the second step and the third step, the gap with resin from an outer edge part of the workpiece including the side surface; a fifth step of curing the resin after the fourth step; and a sixth step of taking out the chips from above the expandable sheet after the fifth step.
    Type: Application
    Filed: February 5, 2021
    Publication date: October 26, 2023
    Applicants: Kyoritsu Chemical & Co., Ltd., HAMAMATSU PHOTONICS K.K.
    Inventors: Daisuke KURITA, Yasunobu MATSUMOTO, Takeshi SAKAMOTO, Iku SANO
  • Publication number: 20230335421
    Abstract: An inspection device includes a laser irradiation unit irradiating a wafer with laser light, a display displaying information, and a control unit. The control unit is constituted to execute deriving of an estimated processing result including information a modified region and a crack extending from the modified region formed on the wafer when the wafer is irradiated with the laser light by the laser irradiation unit on the basis of set recipes (processing conditions), and controlling the display so as to display an estimated processing result image depicting both a graphic image of the wafer and a graphic image of the modified region and the crack in the wafer in consideration of positions of the modified region and the crack in the wafer derived as the estimated processing result.
    Type: Application
    Filed: March 3, 2021
    Publication date: October 19, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi SAKAMOTO, Takafumi OGIWARA, Iku SANO
  • Publication number: 20230245906
    Abstract: A laser processing device comprising: an irradiation unit configured to irradiate an object with laser light; an image capturing part configured to capture an image of the object; and a control unit configured to control at least the irradiation unit and the image capturing part, wherein the control unit performs a first process of irradiating the object with the laser light by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object, a second process of, after the first process, capturing an image of the object with light having transparency to the object and acquiring information indicating a formation state of the modified spot and/or the fracture, by control of the image capturing part.
    Type: Application
    Filed: March 3, 2021
    Publication date: August 3, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi SAKAMOTO, Iku SANO
  • Publication number: 20230158609
    Abstract: A laser processing device includes a control unit, and the control unit executes a first process of controlling a laser irradiation unit according to a first processing condition set such that a modified region and a modified region are formed inside a wafer; a second process of identifying a state related to each of the modified regions, and of determining whether or not the first processing condition is proper; a third process of controlling the laser irradiation unit according to a second processing condition set such that the modified regions are formed and a modified region is formed between the modified regions in a thickness direction of the wafer inside the wafer; and a fourth process of identifying a state related to each of the modified regions, and of determining whether or not the second processing condition is proper.
    Type: Application
    Filed: March 31, 2021
    Publication date: May 25, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Iku SANO, Takeshi SAKAMOTO, Katsuhiro KOREMATSU
  • Publication number: 20230154774
    Abstract: An inspection device includes: a laser irradiation unit; an imaging unit; and a control unit. The control unit is configured to execute a processing process of controlling the laser irradiation unit according to a recipe set such that a plurality of modified regions are formed inside a wafer by irradiating the wafer with a laser beam and a full-cut state where cracks extending from the modified regions have reached a back surface and a surface is attained; an identification process of identifying a state of the crack on the back surface extending from the modified region, and a state of at least one of the modified regions and the cracks inside the wafer, based on a signal; and a determination process of determining whether or not a dicing force applied to the wafer according to the recipe is proper, based on information identified in the identification process.
    Type: Application
    Filed: March 31, 2021
    Publication date: May 18, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi SAKAMOTO, Takafumi OGIWARA, Iku SANO
  • Publication number: 20230120386
    Abstract: A laser processing device includes an irradiation unit configured to irradiate an object with laser light, an image capturing part configured to capture an image of the object, and a control unit configured to control at least the irradiation unit and the image capturing part. A plurality of lines is set in the object. The control unit performs a first process of irradiating the object with the laser light for each of the plurality of lines by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object.
    Type: Application
    Filed: March 3, 2021
    Publication date: April 20, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi SAKAMOTO, Iku SANO
  • Publication number: 20230113051
    Abstract: This inspection device includes: a laser irradiation unit that irradiates a wafer having a back surface and a front surface with a laser beam from the back surface side of the wafer; an imaging unit that outputs light having permeability to the wafer and detects the light propagating through the wafer; and a control part configured to perform a first process of controlling the laser irradiation unit so that a modified region is formed inside the wafer by irradiating the wafer with the laser beam and a second process of deriving a position of the modified region on the basis of a signal output from the imaging unit that detects the light and deriving a thickness of the wafer on the basis of the derived position of the modified region and a set recipe.
    Type: Application
    Filed: March 3, 2021
    Publication date: April 13, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi SAKAMOTO, Takafumi OGIWARA, Iku SANO
  • Publication number: 20230109456
    Abstract: This inspection device includes: a laser irradiation unit, an imaging unit that takes an image of a wafer, a display that receives an input, and a control part, wherein the display receives an input of wafer processing information including information of the wafer and a laser processing target for the wafer, and the control part is configured to determine a recipe (a processing condition) including an irradiation condition of the laser beam by the laser irradiation unit based on the wafer processing information received through the display, to control the laser irradiation unit so that the wafer is irradiated with the laser beam according to the determined recipe, to acquire a laser processing result of the wafer due to the irradiation of the laser beam by controlling the imaging unit to take an image of the wafer, and to evaluate the recipe based on the laser processing result.
    Type: Application
    Filed: March 3, 2021
    Publication date: April 6, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi SAKAMOTO, Takafumi OGIWARA, Iku SANO
  • Publication number: 20230095941
    Abstract: A laser processing device includes an irradiation unit configured to irradiate an object with laser light, an image capturing part configured to capture an image of the object with light having transparency to the object, a display unit configured to display information, and a control unit configured to control at least the irradiation unit, the image capturing part, and the display unit. The control unit performs a first process of irradiating the object with the laser light by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object, a second process of, after the first process, capturing an image of the object by control of the image capturing part and acquiring information indicating a formation state of the modified spot and/or the fracture.
    Type: Application
    Filed: March 3, 2021
    Publication date: March 30, 2023
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Iku SANO, Takeshi SAKAMOTO
  • Publication number: 20220331908
    Abstract: A laser processing device includes a stage; a laser irradiation unit; an image capturing unit; a control portion configured to execute controlling the laser irradiation unit such that one or a plurality of modified regions are formed inside the semiconductor substrate when the wafer is irradiated with the laser light, determining whether or not a crack extending from the modified region is in a crack reaching state where the crack has reached a front surface side of the semiconductor substrate on the basis of a signal output from the image capturing unit, and deriving information related to adjustment of irradiation conditions of the laser irradiation unit on the basis of determination results.
    Type: Application
    Filed: September 16, 2020
    Publication date: October 20, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Iku SANO, Takeshi SAKAMOTO
  • Publication number: 20220331909
    Abstract: A laser processing device includes a stage; a laser irradiation unit configured to irradiate the wafer with laser light; an image capturing unit configured to detect light propagated through a semiconductor substrate; and a control portion configured to execute controlling the laser irradiation unit such that one or a plurality of modified regions are formed inside the semiconductor substrate when the wafer is irradiated with the laser light, deriving a position of a tip of an upper crack on a rear surface side, which is a crack extending from the modified region to the rear surface side of the semiconductor substrate, on the basis of a signal output from the image capturing unit having detected the light, and determining whether or not a crack reaching state has been realized on the basis of the position of the tip of the upper crack on the rear surface side.
    Type: Application
    Filed: September 16, 2020
    Publication date: October 20, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Iku SANO, Takeshi SAKAMOTO
  • Patent number: 11450576
    Abstract: An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output light, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect whether or not there is a tip of a fracture in an inspection region between a front surface and the modified region closest to the front surface of the semiconductor substrate. The objective lens positions a virtual focus symmetrical with a focus with respect to the front surface in the inspection region. The light detection part detects light propagating from the back surface side of the semiconductor substrate to the back surface side via the front surface.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: September 20, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi Sakamoto, Yasutaka Suzuki, Iku Sano
  • Publication number: 20220044969
    Abstract: An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output light, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect whether or not there is a tip of a fracture in an inspection region between a first modified region closest to a front surface of the semiconductor substrate and a second modified region closest to the first modified region. The objective lens aligns a focus from the back surface side in an inspection region. The light detection part detects light propagating in the semiconductor substrate from the front surface side to the back surface side.
    Type: Application
    Filed: October 2, 2019
    Publication date: February 10, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi SAKAMOTO, Yasutaka SUZUKI, Iku SANO
  • Publication number: 20220005737
    Abstract: An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output light, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect whether or not there is a tip of a fracture in an inspection region between a front surface and the modified region closest to the front surface of the semiconductor substrate. The objective lens positions a virtual focus symmetrical with a focus with respect to the front surface in the inspection region. The light detection part detects light propagating from the back surface side of the semiconductor substrate to the back surface side via the front surface.
    Type: Application
    Filed: October 2, 2019
    Publication date: January 6, 2022
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi SAKAMOTO, Yasutaka SUZUKI, Iku SANO
  • Publication number: 20210398855
    Abstract: An inspecting device includes a stage configured to support a wafer in which a plurality of rows of modified regions are formed in a semiconductor substrate, a light source configured to output, an objective lens configured to pass light propagated through the semiconductor substrate, a light detection part configured to detect light passing through the objective lens, and an inspection part configured to inspect a tip position of a fracture in an inspection region between a back surface and the modified region closest to the back surface of the semiconductor substrate. The objective lens aligns a focus from the back surface side in an inspection region. The light detection part detects light propagating from the front surface side of the semiconductor substrate to the back surface side.
    Type: Application
    Filed: October 2, 2019
    Publication date: December 23, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takeshi SAKAMOTO, Yasutaka SUZUKI, Iku SANO
  • Publication number: 20010032212
    Abstract: A method comprising the steps of (A) a step that an information center stores registered members' personal information in a storage portion 9; (B) a step that a member obtains another member's business card 1 including the another member's identification number; (C) a step that the member transmits the another member's identification number together with the member's identification number to the information center via the Internet; and (D) a step that the information center transmits the another member's personal information to the member via the Internet.
    Type: Application
    Filed: April 16, 2001
    Publication date: October 18, 2001
    Inventor: Iku Sano