Patents by Inventor Iku Tokihisa

Iku Tokihisa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
    Patent number: 9038266
    Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: May 26, 2015
    Assignee: IBIDEN CO., LTD.
    Inventors: Sho Akai, Tatsuya Imai, Iku Tokihisa
  • Method for manufacturing multilayer printed wiring board
    Patent number: 8661665
    Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.
    Type: Grant
    Filed: December 9, 2011
    Date of Patent: March 4, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Sho Akai, Tatsuya Imai, Iku Tokihisa
  • Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
    Patent number: 8633400
    Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: January 21, 2014
    Assignee: Ibiden Co., Ltd.
    Inventors: Sho Akai, Tatsuya Imai, Iku Tokihisa
  • Multilayer printed wiring board and method for manufacturing multilayer printed wiring board
    Patent number: 8314340
    Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: November 20, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Sho Akai, Tatsuya Imai, Iku Tokihisa
  • MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
    Publication number: 20120082779
    Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer.
    Type: Application
    Filed: December 8, 2011
    Publication date: April 5, 2012
    Applicant: IBIDEN CO., LTD.
    Inventors: Sho AKAI, Tatsuya Imai, Iku Tokihisa
  • MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
    Publication number: 20120080400
    Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.
    Type: Application
    Filed: December 9, 2011
    Publication date: April 5, 2012
    Applicant: IBIDEN CO., LTD.
    Inventors: Sho AKAI, Tatsuya Imai, Iku Tokihisa
  • MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
    Publication number: 20100126758
    Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer.
    Type: Application
    Filed: September 28, 2009
    Publication date: May 27, 2010
    Applicant: IBIDEN, CO,. LTD.
    Inventors: Sho AKAI, Tatsuya Imai, Iku Tokihisa
  • MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
    Publication number: 20100122839
    Abstract: A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer.
    Type: Application
    Filed: September 28, 2009
    Publication date: May 20, 2010
    Applicant: IBIDEN, CO., LTD.
    Inventors: Sho AKAI, Tatsuya Imai, Iku Tokihisa