Patents by Inventor Ikue Yokomizo

Ikue Yokomizo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical overlay measurement methods and structures for wafer-to-wafer bonding
    Patent number: 11569139
    Abstract: A method includes providing a first wafer including a respective set of first metal bonding pads and at least one first alignment diagnostic structure, providing a second wafer including a respective set of second metal bonding pads and a respective set of second alignment diagnostic structures, overlaying the first wafer and the second wafer, measuring at least one of a current, voltage or contact resistance between the first alignment diagnostic structures and the second alignment diagnostic structures to determine an overlay offset, and bonding the second wafer to the first wafer.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: January 31, 2023
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Ikue Yokomizo, Michiaki Sano, Kazuto Watanabe, Hajime Yamamoto, Takashi Yamaha, Koichi Ito, Katsuya Kato, Ryo Hiramatsu, Hiroshi Sasaki, Akihiro Tobioka, Liang Li
  • ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-WAFER BONDING
    Publication number: 20220285234
    Abstract: A method includes providing a first wafer including a respective set of first metal bonding pads and at least one first alignment diagnostic structure, providing a second wafer including a respective set of second metal bonding pads and a respective set of second alignment diagnostic structures, overlaying the first wafer and the second wafer, measuring at least one of a current, voltage or contact resistance between the first alignment diagnostic structures and the second alignment diagnostic structures to determine an overlay offset, and bonding the second wafer to the first wafer.
    Type: Application
    Filed: March 8, 2021
    Publication date: September 8, 2022
    Inventors: Ikue YOKOMIZO, Michiaki SANO, Kazuto WATANABE, Hajime YAMAMOTO, Takashi YAMAHA, Koichi ITO, Katsuya KATO, Ryo HIRAMATSU, Hiroshi SASAKI, Akihiro TOBIOKA, Liang LI
  • BONDED ASSEMBLY CONTAINING SIDE BONDING STRUCTURES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20200321324
    Abstract: A bonded assembly includes a first stack containing a first semiconductor die bonded to a second semiconductor die along a stacking direction, first external bonding pads formed within the first semiconductor die, and bonding connection wires. Each of the bonding connection wires extends over a sidewall of the first semiconductor die and protrudes into the first semiconductor die through the sidewall of the first semiconductor die to contact a respective one of the first external bonding pads.
    Type: Application
    Filed: April 2, 2019
    Publication date: October 8, 2020
    Inventors: Michiaki Sano, Takashi YAMAHA, Koichi ITO, Ikue YOKOMIZO, Ryo HIRAMATSU, Kazuto WATANABE, Katsuya KATO, Hajime YAMAMOTO, Hiroshi SASAKI
  • Bonded assembly containing side bonding structures and methods of manufacturing the same
    Patent number: 10797035
    Abstract: A bonded assembly includes a first stack containing a first semiconductor die bonded to a second semiconductor die along a stacking direction, first external bonding pads formed within the first semiconductor die, and bonding connection wires. Each of the bonding connection wires extends over a sidewall of the first semiconductor die and protrudes into the first semiconductor die through the sidewall of the first semiconductor die to contact a respective one of the first external bonding pads.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: October 6, 2020
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: Michiaki Sano, Takashi Yamaha, Koichi Ito, Ikue Yokomizo, Ryo Hiramatsu, Kazuto Watanabe, Katsuya Kato, Hajime Yamamoto, Hiroshi Sasaki
  • Distortion-compensated wafer bonding method and apparatus using a temperature-controlled backside thermal expansion layer
    Patent number: 10790296
    Abstract: A bonded structure may be formed by measuring die areas of first semiconductor dies on a wafer at a measurement temperature, generating a two-dimensional map of local target temperatures that are estimated to thermally adjust a die area of each of the first semiconductor dies to a target die area, loading the wafer to a bonding apparatus comprising at least one temperature sensor, and iteratively bonding a plurality of second semiconductor dies to a respective one of the first semiconductor dies by sequentially adjusting a temperature of the wafer to a local target temperature of a respective first semiconductor die that is bonded to a respective one of the second semiconductor dies. An apparatus for forming such a bonded structure may include a computer, a chuck for holding the wafer, a die attachment unit, and a temperature control mechanism.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: September 29, 2020
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: Takashi Yamaha, Katsuya Kato, Kazuto Watanabe, Hajime Yamamoto, Michiaki Sano, Koichi Ito, Ikue Yokomizo, Ryo Hiramatsu, Hiroshi Sasaki