Abstract: A drying equipment includes an equipment body including a vapor bath, carrier for carring a semiconductor wafer, receiver tray, inert gas supply unit, cooling pipe, exhaust unit, transportation unit, control unit, etc. An air supply opening of a blower is opposite to a top opening of the vapor bath. The vapor bath contains an organic solvent therein. A vapor is generated by heating the organic solvent. A vapor phase boundary surface is formed on the boundary between the vapor and air overlying the same. When the wafer at low temperature is put into the vapor bath by means of the transportation unit, the organic solvent vapor condenses on the surface of the wafer. The inert gas supply unit supplies an inert gas to the vapor in the vapor bath. The wafer is pulled up slowly from the vapor by means of the transportation unit, and passes the vapor phase boundary surface on the way.