Patents by Inventor Ikuhiro Kuwano

Ikuhiro Kuwano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
    Publication number: 20210225651
    Abstract: A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.
    Type: Application
    Filed: April 8, 2021
    Publication date: July 22, 2021
    Applicant: NIKON CORPORATION
    Inventors: Hajime MITSUISHI, Isao SUGAYA, Minoru FUKUDA, Masaki TSUNODA, Hidehiro MAEDA, Ikuhiro KUWANO
  • Bonding method, bonding device, and holding member
    Patent number: 11004686
    Abstract: A method for bonding a first substrate and a second substrate includes: forming a protrusion at a partial region of the first substrate; measuring a position of the first substrate after the protrusion is formed in the first substrate; and bonding the first substrate and the second substrate by contacting the protrusion of the first substrate with a surface of the second substrate to form a contact region and enlarging the contact region.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: May 11, 2021
    Assignee: NIKON CORPORATION
    Inventors: Hajime Mitsuishi, Isao Sugaya, Minoru Fukuda, Masaki Tsunoda, Hidehiro Maeda, Ikuhiro Kuwano