Abstract: A method for manufacturing a light emitting device includes: preparing a wavelength conversion member; preparing a light emitting element comprising a pair of electrodes at a second face side of the light emitting element; forming a light transmissive member, which includes: disposing a liquid resin material on a second main face of the wavelength conversion member, disposing the light emitting element on the liquid resin material such that (i) a first face of the light emitting element is opposed to the second main face of the wavelength converting member, (ii) a portion of a first lateral face of the light emitting element and a portion of a second lateral face of the light emitting element are covered by the liquid resin material, and (iii) a first corner of the light emitting element is exposed from the liquid resin material, and curing the liquid resin material; and forming a covering member.

Abstract: A method of manufacturing a light emitting device includes mounting an element set on a support substrate. The element set includes an element substrate and a plurality of light emitting elements on the element substrate. Each of the light emitting elements includes a semiconductor layered body having a surface and a pair of electrodes formed on the semiconductor layered body surface. A light reflecting member is provided between the element set and the support substrate. The element substrate is removed from the plurality of light emitting elements.

Abstract: A method for manufacturing a light emitting device includes: preparing a wavelength conversion member; preparing a light emitting element comprising a pair of electrodes at a second face side of the light emitting element; forming a light transmissive member, which includes: disposing a liquid resin material on a second main face of the wavelength conversion member, disposing the light emitting element on the liquid resin material such that (i) a first face of the light emitting element is opposed to the second main face of the wavelength converting member, (ii) a portion of a first lateral face of the light emitting element and a portion of a second lateral face of the light emitting element are covered by the liquid resin material, and (iii) a first corner of the light emitting element is exposed from the liquid resin material, and curing the liquid resin material; and forming a covering member.

Abstract: A method for manufacturing a light emitting device includes: preparing a wavelength conversion member; preparing a light emitting element comprising a pair of electrodes at a second face side of the light emitting element; forming a light transmissive member, which includes: disposing a liquid resin material on a second main face of the wavelength conversion member, disposing the light emitting element on the liquid resin material such that (i) a first face of the light emitting element is opposed to the second main face of the wavelength converting member, (ii) a portion of a first lateral face of the light emitting element and a portion of a second lateral face of the light emitting element are covered by the liquid resin material, and (iii) a first corner of the light emitting element is exposed from the liquid resin material, and curing the liquid resin material; and forming a covering member.

Abstract: A method for manufacturing a light emitting device includes: preparing a wavelength conversion member; preparing a light emitting element comprising a pair of electrodes at a second face side of the light emitting element; forming a light transmissive member, which includes: disposing a liquid resin material on a second main face of the wavelength conversion member, disposing the light emitting element on the liquid resin material such that (i) a first face of the light emitting element is opposed to the second main face of the wavelength converting member, (ii) a portion of a first lateral face of the light emitting element and a portion of a second lateral face of the light emitting element are covered by the liquid resin material, and (iii) a first corner of the light emitting element is exposed from the liquid resin material, and curing the liquid resin material; and forming a covering member.

Abstract: A method of manufacturing a light emitting device includes mounting an element set on a support substrate. The element set includes an element substrate and a plurality of light emitting elements on the element substrate. Each of the light emitting elements includes a semiconductor layered body having a surface and a pair of electrodes formed on the semiconductor layered body surface. A light reflecting member is provided between the element set and the support substrate. The element substrate is removed from the plurality of light emitting elements.

Abstract: A light emitting device includes a light emitting element having a first face, a second face opposing the first face, a plurality of side faces extending between the first face and the second face, a plurality of corners where the second face meets two of the plurality of side faces, and a pair of electrodes on a second face side of the light emitting element; a light transmissive member covering a portion of at least one of the side faces and a portion of an edge where said at least one side face meets the second face such that at least one of the plurality of corners is exposed from the light transmissive member; and a covering member covering the at least one exposed corner of the light emitting element and the exterior of the light transmissive member such that the pair of electrodes are exposed from the covering member.

Abstract: A method of manufacturing a light emitting device, includes mounting, on a support substrate, an element set that includes a plurality of light emitting elements on an element substrate. A light reflecting member is provided between the element set and the support substrate. The element substrate is removed from the plurality of light emitting elements. The support substrate and the light reflecting member is cut between the plurality of light emitting elements so as to singulate a plurality of light emitting devices.

Abstract: A method of manufacturing a light emitting device, includes mounting, on a support substrate, an element set that includes a plurality of light emitting elements on an element substrate. A light reflecting member is provided between the element set and the support substrate. The element substrate is removed from the plurality of light emitting elements. The support substrate and the light reflecting member is cut between the plurality of light emitting elements so as to singulate a plurality of light emitting devices.

Abstract: A light emitting device includes a light emitting element having a first face, a second face opposing the first face, a plurality of side faces extending between the first face and the second face, a plurality of corners where the second face meets two of the plurality of side faces, and a pair of electrodes on a second face side of the light emitting element; a light transmissive member covering a portion of at least one of the side faces and a portion of an edge where said at least one side face meets the second face such that at least one of the plurality of corners is exposed from the light transmissive member; and a covering member covering the at least one exposed corner of the light emitting element and the exterior of the light transmissive member such that the pair of electrodes are exposed from the covering member.

Abstract: A method for manufacturing a light emitting device comprises (a) preparing a structure including a substrate, a semiconductor layer formed on the substrate, and a p-side electrode and an n-side electrode formed on the semiconductor layer; (b) preparing a support member including a p-side wiring and an n-side wiring on the same surface thereof; (c) electrically connecting the p-side electrode and the n-side electrode of the structure to the p-side wiring and the n-side wiring of the support member, respectively, using an anisotropic conductive material containing conductive particles and a first resin; and after step (c), (d) removing the substrate from the structure.

Abstract: A light emitting element has a semiconductor layer, a pair of positive and negative electrodes, and a reinforcing portion. The pair of positive and negative electrodes is disposed on a lower face side of the semiconductor layer. The pair of electrodes is connected to the substrate. The reinforcing portion is disposed on an outer edge part of an upper face of the semiconductor layer. The reinforcing portion is made from a light-transmissive material. The upper face includes an exposed portion exposed from the reinforcing portion.

Abstract: A light emitting element has a semiconductor layer, a pair of positive and negative electrodes, and a reinforcing portion. The pair of positive and negative electrodes is disposed on a lower face side of the semiconductor layer. The pair of electrodes is connected to the substrate. The reinforcing portion is disposed on an outer edge part of an upper face of the semiconductor layer. The reinforcing portion is made from a light-transmissive material. The upper face includes an exposed portion exposed from the reinforcing portion.

Abstract: A method for manufacturing a light emitting device comprises (a) preparing a structure including a substrate, a semiconductor layer formed on the substrate, and a p-side electrode and an n-side electrode formed on the semiconductor layer; (b) preparing a support member including a p-side wiring and an n-side wiring on the same surface thereof; (c) electrically connecting the p-side electrode and the n-side electrode of the structure to the p-side wiring and the n-side wiring of the support member, respectively, using an anisotropic conductive material containing conductive particles and a first resin; and after step (c), (d) removing the substrate from the structure.