Patents by Inventor Ikuko Shiina

Ikuko Shiina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6737118
    Abstract: Silica-based low dielectric constant materials having three-dimensional network structures containing siloxane backbones which comprise SiO4 tetrahedron structural units, as well as their production and use. The materials can be applied as interlayer dielectrics for semiconductor elements and the like.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: May 18, 2004
    Assignee: Nippon Steel Corporation
    Inventors: Noriko Yamada, Toru Takahashi, Tadashi Sakon, Yoichi Matsuzaki, Atsushi Nogami, Shingo Katayama, Ikuko Shiina
  • Patent number: 6589644
    Abstract: Silica-based low dielectric constant materials having three-dimensional network structures containing siloxane backbones which comprise SiO4 tetrahedron structural units, as well as their production and use. The materials can be applied as interlayer dielectrics for semiconductor elements and the like.
    Type: Grant
    Filed: November 24, 1999
    Date of Patent: July 8, 2003
    Assignee: Nippon Steel Corporation
    Inventors: Noriko Yamada, Toru Takahashi, Tadashi Sakon, Yoichi Matsuzaki, Atsushi Nogami, Shingo Katayama, Ikuko Shiina
  • Publication number: 20020156180
    Abstract: Silica-based low dielectric constant materials having three-dimensional network structures containing siloxane backbones which comprise Si04 tetrahedron structural units, as well as their production and use. The materials can be applied as interlayer dielectrics for semiconductor elements and the like.
    Type: Application
    Filed: April 12, 2002
    Publication date: October 24, 2002
    Inventors: Noriko Yamada, Toru Takahashi, Tadashi Sakon, Yoichi Matsuzaki, Atsushi Nogami, Shingo Katayama, Ikuko Shiina