Patents by Inventor Ikumi Sakata

Ikumi Sakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9815230
    Abstract: A method for manufacturing an imprint mold which can prevent accumulation of the transferring resin at the joining portion of the film mold is provided. A method for manufacturing an imprint mold, including a winding step to wind a resin film mold onto a cylindrical transferring roll, the resin film mold being provided with a reverse pattern of a desired fine concave-convex pattern and the resin film mold being wound onto the transferring roll so that a gap without the reverse pattern is provided at a butting portion of both ends of the resin film mold; a resin filling step to fill a resin composition into the gap; and a pattern forming step to form a pattern substantially the same as the reverse pattern onto the resin composition, is provided.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: November 14, 2017
    Assignee: SOKEN CHEMICAL & ENGINEERING Co., Ltd.
    Inventors: Takehide Misawa, Ikumi Sakata
  • Publication number: 20150290847
    Abstract: A method for manufacturing an imprint mold which can prevent accumulation of the transferring resin at the joining portion of the film mold is provided. A method for manufacturing an imprint mold, including a winding step to wind a resin film mold onto a cylindrical transferring roll, the resin film mold being provided with a reverse pattern of a desired fine concave-convex pattern and the resin film mold being wound onto the transferring roll so that a gap without the reverse pattern is provided at a butting portion of both ends of the resin film mold; a resin filling step to fill a resin composition into the gap; and a pattern forming step to form a pattern substantially the same as the reverse pattern onto the resin composition, is provided.
    Type: Application
    Filed: November 18, 2013
    Publication date: October 15, 2015
    Applicant: SOKEN CHEMICAL & ENGINEERING CO., LTD.
    Inventors: Takehide Misawa, Ikumi Sakata
  • Patent number: 8157347
    Abstract: An ink jet recording head comprising a discharge port for discharging an ink; and a sealing tape for sealing the discharge port; wherein the sealing tape includes a pressure-sensitive adhesive layer constituted of an acrylic crosslinked polymer formed by crosslinking an alkyl(meth)acrylate ester copolymer with a metal chelate compound, and is peelably adhered, through the pressure-sensitive adhesive layer, to a part where the discharge port is formed.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: April 17, 2012
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tadayoshi Inamoto, Yoshiaki Kurihara, Masako Shimomura, Satoshi Shimazu, Kazuto Takashima, Ikumi Sakata, Koji Tomita
  • Publication number: 20070064059
    Abstract: An ink jet recording head comprising a discharge port for discharging an ink; and a sealing tape for sealing the discharge port; wherein the sealing tape includes a pressure-sensitive adhesive layer constituted of an acrylic crosslinked polymer formed by crosslinking an alkyl (meth)acrylate ester copolymer with a metal chelate compound, and is peelably adhered, through the pressure-sensitive adhesive layer, to a part where the discharge port is formed.
    Type: Application
    Filed: July 6, 2006
    Publication date: March 22, 2007
    Applicant: Canon Kabushiki Kaisha
    Inventors: Tadayoshi Inamoto, Yoshiaki Kurihara, Masako Shimomura, Satoshi Shimazu, Kazuto Takashima, Ikumi Sakata, Koji Tomita
  • Publication number: 20010046021
    Abstract: A conductive particle used for an anisotropic conductive adhesive provides an anisotropic conductive bonding between terminal electrodes without deforming a wiring pattern or the terminal electrode of a circuit board. A conductive layer is formed on a surface of a core particle of the conductive particle. The conductive particle has a yield point within a range of degree of deformation from 5% to 40% so that a modulus of compressive deformation of the conductive particle drastically increases at the yield point.
    Type: Application
    Filed: August 27, 1998
    Publication date: November 29, 2001
    Inventors: TAKESHI KOZUKA, TSUTOMU YAMAZAKI, IKUMI SAKATA