Patents by Inventor Ikumi Sawa

Ikumi Sawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin sheet
    Patent number: 10512161
    Abstract: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 ?S/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 ?S/cm or less, can provide a thin insulating layer having excellent insulating properties.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: December 17, 2019
    Assignee: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Shiro Tatsumi, Ikumi Sawa
  • Resin sheet
    Patent number: 10257928
    Abstract: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 ?S/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 ?S/cm or less, can provide a thin insulating layer having excellent insulating properties.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: April 9, 2019
    Assignee: Ajinomoto Co., Inc.
    Inventors: Shigeo Nakamura, Shiro Tatsumi, Ikumi Sawa
  • Method for producing printed wiring board
    Patent number: 10076029
    Abstract: Printed wiring boards, in which the insulating layer exhibits excellent peel strength with respect to a conductive layer after a roughening treatment, even when using a resin composition having a high content of inorganic filler, may be obtained by: (A) laminating, onto an internal layer substrate, an adhesive sheet which includes a support and a resin composition layer in contact with the support, so that the resin composition layer is in contact with the internal layer substrate; (B) thermally curing the resin composition layer to form an insulating layer; and (C) removing the support, when the support satisfies certain conditions (TD1) and (TD2) in a TD direction thereof when it is heated under specific heating conditions.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: September 11, 2018
    Assignee: Ajinomoto Co., Inc.
    Inventors: Masanori Ohkoshi, Ikumi Sawa, Genjin Mago, Eiichi Hayashi
  • RESIN SHEET
    Publication number: 20170290149
    Abstract: Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 ?S/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 ?S/cm or less, can provide a thin insulating layer having excellent insulating properties.
    Type: Application
    Filed: March 29, 2017
    Publication date: October 5, 2017
    Applicant: Ajinomoto Co., Inc.
    Inventors: Shigeo NAKAMURA, Shiro TATSUMI, Ikumi SAWA
  • METHOD FOR PRODUCING PRINTED WIRING BOARD
    Publication number: 20150250052
    Abstract: Printed wiring boards, in which the insulating layer exhibits excellent peel strength with respect to a conductive layer after a roughening treatment, even when using a resin composition having a high content of inorganic filler, may be obtained by: (A) laminating, onto an internal layer substrate, an adhesive sheet which includes a support and a resin composition layer in contact with the support, so that the resin composition layer is in contact with the internal layer substrate; (B) thermally curing the resin composition layer to form an insulating layer; and (C) removing the support, when the support satisfies certain conditions (TD1) and (TD2) in a TD direction thereof when it is heated under specific heating conditions.
    Type: Application
    Filed: February 27, 2015
    Publication date: September 3, 2015
    Applicant: Ajinomoto Co., Inc.
    Inventors: Masanori OHKOSHI, Ikumi Sawa, Genjin Mago, Eiichi Hayashi