Abstract: A surface-treated metal material includes a metal sheet, a plating layer formed on the metal sheet and containing aluminum, magnesium, and zinc, and a composite coating formed on a surface of the plating layer, the composite coating including an organic silicon compound, one or two of a zirconium compound and a titanium compound, a phosphoric acid compound, a fluorine compound, and a vanadium compound, wherein, when a surface of the composite coating is analyzed at a spot size of ?30 ?m using micro-fluorescent X-rays, a maximum value of V/Zn, which is a mass ratio of a V content to a Zn content, is 0.010 to 0.100.

Abstract: This surface-treated steel sheet includes: a steel sheet; a Zn-based plating layer formed on the steel sheet; and a coating formed on the Zn-based plating layer, in which a Si concentration, a P concentration, a F concentration, a V concentration, a Zr concentration, a Zn concentration, and an Al concentration of the coating are, by mass %, Si: 10.00% to 25.00%, P: 0.01% to 5.00%, F: 0.01% to 2.00%, V: 0.01% to 4.00%, Zr: 0.01% to 3.00%, Zn: 0% to 3.00%, and Al: 0% to 3.00%, in a narrow spectrum of 5i2p obtained by performing XP S analysis on a surface of the coating, a ratio of an integrated intensity of a peak having a local, maximum value, at 103.37±0.25 eV to an integrated intensity of a peak having a local maximum value at 102.26±0.25 eV is 0.04 or more and 0.25 or less.

Abstract: A surface-treated metal material includes a metal sheet, a plating layer formed on the metal sheet and containing aluminum, magnesium, and zinc, and a composite coating formed on a surface of the plating layer, the composite coating including an organic silicon compound, one or two of a zirconium compound and a titanium compound, a phosphoric acid compound, a fluorine compound, and a vanadium compound, wherein, when a surface of the composite coating is analyzed at a spot size of ?30 ?m using micro-fluorescent X-rays, a maximum value of V/Zn, which is a mass ratio of a V content to a Zn content, is 0.010 to 0.100.

Abstract: A load detection circuit includes a first detection part and a second detection part. The first detection part includes a first capacitor and a second capacitor, forms capacitive coupling with a signal transmission line connecting an output port of an RF amplifier and a load, and outputs a first signal. The second detection part includes a first inductor and a second inductor, forms inductive coupling with the signal transmission line, and outputs a second signal.

Abstract: Temperature compensation circuits and methods for adjusting one or more circuit parameters of a power amplifier (PA) to maintain approximately constant Gain versus time during pulsed operation sufficient to substantially offset self-heating of the PA. Some embodiments compensate for PA Gain “droop” due to self-heating using a Sample and Hold (S&H) circuit. Other embodiments include bias compensation circuits that directly regulate a bias signal to an amplifier stage as a function of localized heating of one or more of amplifier stages. Such bias compensation circuits include physical placement of at least one bias compensation circuit element in closer proximity to at least one amplifier stage than other bias compensation circuit elements. One bias compensation circuit embodiment includes a temperature-sensitive current mirror circuit for regulating the bias signal.

Abstract: Temperature compensation circuits and methods for adjusting one or more circuit parameters of a power amplifier (PA) to maintain approximately constant Gain versus time during pulsed operation sufficient to substantially offset self-heating of the PA. Some embodiments compensate for PA Gain “droop” due to self-heating using a Sample and Hold (S&H) circuit. Other embodiments include bias compensation circuits that directly regulate a bias signal to an amplifier stage as a function of localized heating of one or more of amplifier stages. Such bias compensation circuits include physical placement of at least one bias compensation circuit element in closer proximity to at least one amplifier stage than other bias compensation circuit elements. One bias compensation circuit embodiment includes a temperature-sensitive current mirror circuit for regulating the bias signal.

Abstract: A transparent electrode includes a conductive polymer layer, and plural carbon fibers having a diameter larger than the thickness of the conductive polymer layer, in which the carbon fibers are partially embedded in the conductive polymer layer. An organic electronic device includes the transparent electrode.

Abstract: A transparent electrode includes a conductive polymer layer, and plural carbon fibers having a diameter larger than the thickness of the conductive polymer layer, in which the carbon fibers are partially embedded in the conductive polymer layer. An organic electronic device includes the transparent electrode.