Patents by Inventor Ikumi TOKUDA

Ikumi TOKUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240291131
    Abstract: A directional coupler includes an input terminal, an output terminal, a detection terminal, a main line coupled to the input terminal and the output terminal, a sub-line, and a capacitor. The sub-line and the main line are arranged in a manner that enables magnetic field coupling and electric field coupling. The sub-line is coupled to one end of the capacitor and the detection terminal. The other end of the capacitor is coupled to ground.
    Type: Application
    Filed: May 7, 2024
    Publication date: August 29, 2024
    Inventor: Ikumi TOKUDA
  • Publication number: 20240213937
    Abstract: A radio frequency circuit includes a first circuit including a radio frequency input terminal, a radio frequency output terminal, and a control terminal, a power detector connected to the radio frequency output terminal, a correction circuit including a clock terminal, an enable terminal, an input terminal, and an output terminal, a first comparator connected between an output of the power detector and the clock terminal, and a second comparator connected between the output of the power detector and the enable terminal. The output terminal is connected to the control terminal. A reference voltage of the second comparator is higher than that of the first comparator.
    Type: Application
    Filed: March 4, 2024
    Publication date: June 27, 2024
    Inventor: Ikumi TOKUDA
  • Publication number: 20240175140
    Abstract: What is provided is a surface-treated steel sheet including a steel sheet, a zinc-based plated layer formed on a surface of the steel sheet, and a chemical conversion treatment layer formed on a surface of the zinc-based plated layer, in which the chemical conversion treatment layer contains Si, C, O and P, the chemical conversion treatment layer has a C concentration of 20.0 mass % or more, an O concentration of 15.0 mass % or more, a Si concentration of 10.0 mass % or more, and a P concentration of 0.
    Type: Application
    Filed: March 29, 2022
    Publication date: May 30, 2024
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Atsuo SHIMIZU, Ikumi TOKUDA, Hiromasa SHOJI
  • Patent number: 11965249
    Abstract: A surface-treated metal material includes a metal sheet, a plating layer formed on the metal sheet and containing aluminum, magnesium, and zinc, and a composite coating formed on a surface of the plating layer, the composite coating including an organic silicon compound, one or two of a zirconium compound and a titanium compound, a phosphoric acid compound, a fluorine compound, and a vanadium compound, wherein, when a surface of the composite coating is analyzed at a spot size of ?30 ?m using micro-fluorescent X-rays, a maximum value of V/Zn, which is a mass ratio of a V content to a Zn content, is 0.010 to 0.100.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: April 23, 2024
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Hiromasa Shoji, Kiyokazu Ishizuka, Kohei Tokuda, Mamoru Saito, Yasuto Goto, Ikumi Tokuda
  • Publication number: 20240044013
    Abstract: This surface-treated steel sheet includes: a steel sheet; a Zn-based plating layer formed on the steel sheet; and a coating formed on the Zn-based plating layer, in which a Si concentration, a P concentration, a F concentration, a V concentration, a Zr concentration, a Zn concentration, and an Al concentration of the coating are, by mass %, Si: 10.00% to 25.00%, P: 0.01% to 5.00%, F: 0.01% to 2.00%, V: 0.01% to 4.00%, Zr: 0.01% to 3.00%, Zn: 0% to 3.00%, and Al: 0% to 3.00%, in a narrow spectrum of 5i2p obtained by performing XP S analysis on a surface of the coating, a ratio of an integrated intensity of a peak having a local, maximum value, at 103.37±0.25 eV to an integrated intensity of a peak having a local maximum value at 102.26±0.25 eV is 0.04 or more and 0.25 or less.
    Type: Application
    Filed: January 6, 2022
    Publication date: February 8, 2024
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Atsuo SHIMIZU, Ikumi TOKUDA, Hiromasa SHOJI, Koji AKIOKA
  • Publication number: 20220145473
    Abstract: A surface-treated metal material includes a metal sheet, a plating layer formed on the metal sheet and containing aluminum, magnesium, and zinc, and a composite coating formed on a surface of the plating layer, the composite coating including an organic silicon compound, one or two of a zirconium compound and a titanium compound, a phosphoric acid compound, a fluorine compound, and a vanadium compound, wherein, when a surface of the composite coating is analyzed at a spot size of ?30 ?m using micro-fluorescent X-rays, a maximum value of V/Zn, which is a mass ratio of a V content to a Zn content, is 0.010 to 0.100.
    Type: Application
    Filed: March 19, 2020
    Publication date: May 12, 2022
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Hiromasa SHOJI, Kiyokazu ISHIZUKA, Kohei TOKUDA, Mamoru SAITO, Yasuto GOTO, Ikumi TOKUDA
  • Publication number: 20210344307
    Abstract: A load detection circuit includes a first detection part and a second detection part. The first detection part includes a first capacitor and a second capacitor, forms capacitive coupling with a signal transmission line connecting an output port of an RF amplifier and a load, and outputs a first signal. The second detection part includes a first inductor and a second inductor, forms inductive coupling with the signal transmission line, and outputs a second signal.
    Type: Application
    Filed: April 28, 2021
    Publication date: November 4, 2021
    Inventor: Ikumi TOKUDA
  • Patent number: 10439562
    Abstract: Temperature compensation circuits and methods for adjusting one or more circuit parameters of a power amplifier (PA) to maintain approximately constant Gain versus time during pulsed operation sufficient to substantially offset self-heating of the PA. Some embodiments compensate for PA Gain “droop” due to self-heating using a Sample and Hold (S&H) circuit. Other embodiments include bias compensation circuits that directly regulate a bias signal to an amplifier stage as a function of localized heating of one or more of amplifier stages. Such bias compensation circuits include physical placement of at least one bias compensation circuit element in closer proximity to at least one amplifier stage than other bias compensation circuit elements. One bias compensation circuit embodiment includes a temperature-sensitive current mirror circuit for regulating the bias signal.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: October 8, 2019
    Assignee: pSemi Corporation
    Inventors: Ikumi Tokuda, Tero Tapio Ranta, Keith Bargroff, Christopher C. Murphy, Robert Mark Englekirk
  • Publication number: 20180262163
    Abstract: Temperature compensation circuits and methods for adjusting one or more circuit parameters of a power amplifier (PA) to maintain approximately constant Gain versus time during pulsed operation sufficient to substantially offset self-heating of the PA. Some embodiments compensate for PA Gain “droop” due to self-heating using a Sample and Hold (S&H) circuit. Other embodiments include bias compensation circuits that directly regulate a bias signal to an amplifier stage as a function of localized heating of one or more of amplifier stages. Such bias compensation circuits include physical placement of at least one bias compensation circuit element in closer proximity to at least one amplifier stage than other bias compensation circuit elements. One bias compensation circuit embodiment includes a temperature-sensitive current mirror circuit for regulating the bias signal.
    Type: Application
    Filed: February 28, 2018
    Publication date: September 13, 2018
    Inventors: Ikumi Tokuda, Tero Tapio Ranta, Keith Bargroff, Christopher C. Murphy, Robert Mark Englekirk
  • Patent number: 10033006
    Abstract: A transparent electrode includes a conductive polymer layer, and plural carbon fibers having a diameter larger than the thickness of the conductive polymer layer, in which the carbon fibers are partially embedded in the conductive polymer layer. An organic electronic device includes the transparent electrode.
    Type: Grant
    Filed: April 6, 2015
    Date of Patent: July 24, 2018
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Ikumi Tokuda, Taihei Kaneto
  • Publication number: 20170125713
    Abstract: A transparent electrode includes a conductive polymer layer, and plural carbon fibers having a diameter larger than the thickness of the conductive polymer layer, in which the carbon fibers are partially embedded in the conductive polymer layer. An organic electronic device includes the transparent electrode.
    Type: Application
    Filed: April 6, 2015
    Publication date: May 4, 2017
    Applicant: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Ikumi TOKUDA, Taihei KANETO