Abstract: To include reading design data of a plurality of patterns formed on a sample and characteristic information indicating characteristics of each of the patterns from a storage device, the characteristic information being additionally written in the design data, dividing a pattern formed region of the sample on which the patterns are formed, into a plurality of regions where the characteristics are different from each other on a basis of the characteristic information, calculating parameter information according to the characteristics with respect to each of the regions, where the parameter information is provided for generating a reference image from the design data to be used in an inspection of the patterns, and generating the reference image from the design data on a basis of the calculated parameter information.

Abstract: An inspection apparatus and method comprising a unit for acquiring an optical image of an object to be inspected by irradiating the object with light, wherein the unit includes a line sensor comprising a plurality of sensors linearly arranged in a row, a generating unit for generating a reference image from design data of the object to be inspected, a comparing unit for comparing the optical image with the reference image, a unit for storing data of three lines acquired by the line sensor, and calculating differences between a gradation value of a pixel on a center line and each gradation value of the eight pixels adjacent to the pixel determining if the pixel is a defect if all of the eight differences of the adjacent pixels are more than a predetermined threshold.

Abstract: A pattern inspection apparatus includes a design pattern image generation circuit to generate a first design pattern image by developing an image of the first design pattern, and a second design pattern image by developing an image of the second design pattern for assisting the first design pattern, a comparison circuit to detect a defect candidate by comparing, for each pixel, the measured image with a main reference image which is a predetermined one of the first design pattern image and the second design pattern image, and a determination circuit to determine whether the defect candidate is a defect by using determination conditions obtained using, as a sub reference image, another predetermined one of the first design pattern image and the second design pattern image.

Abstract: A mask inspection apparatus includes an optical image acquisition unit configured to acquire an optical image by irradiating light on a mask, a reference image generation unit configured to generate a reference image from design data of the mask, a comparison circuit configured to compare the optical image with the reference image, a pattern data extraction unit configured to obtain coordinates of a defective portion determined to be defective by the comparison unit and to extract, from the design data, pattern data of a predetermined dimension range including the coordinates, and an interface unit configured to supply an aerial image measurement apparatus with information associated with the defect, the information including the defect coordinates and the extracted pattern data.

Abstract: A pattern inspection apparatus includes a design pattern image generation circuit to generate a first design pattern image by developing an image of the first design pattern, and a second design pattern image by developing an image of the second design pattern for assisting the first design pattern, a comparison circuit to detect a defect candidate by comparing, for each pixel, the measured image with a main reference image which is a predetermined one of the first design pattern image and the second design pattern image, and a determination circuit to determine whether the defect candidate is a defect by using determination conditions obtained using, as a sub reference image, another predetermined one of the first design pattern image and the second design pattern image.

Abstract: A measuring apparatus includes an input unit to input optical image data of a figure pattern obtained by a pattern inspection apparatus which inspects a defect of a pattern on a target object to be inspected by scanning an inspection region of the target object, from the pattern inspection apparatus, and to input reference image data generated from design data of the pattern by the pattern inspection apparatus to be compared with the optical image data, from the pattern inspection apparatus, a positional deviation distribution generation unit to generate positional deviation distribution by measuring positional deviation of the pattern on the target object, by using the optical image data and the reference image data input from the pattern inspection apparatus, and an output unit to output generated positional deviation distribution of the pattern on the target object, wherein the measuring apparatus is arranged independently from the pattern inspection apparatus.

Abstract: An inspection method and apparatus comprising, acquiring a plurality of optical images of a sample in which a plurality of dies having repetitive pattern are provided, comparing the optical images to each other by a die-to-die method and detecting a defect, obtaining at least one of a dimension difference and a dimension ratio between the repetitive pattern of the optical image to be inspected and the repetitive pattern of the optical image to be reference in the die-to-die method, extracting a die of the optical image having the dimension difference or dimension ratio closest to that at a defect position of a die of the optical image in which the defect is detected, compared, and stored, and determining that the defect does not exist in the optical image when the defect is not detected from the optical image in which the defect is originally detected.

Abstract: A pattern inspection apparatus includes a data processing circuitry to input detection data based on a secondary electron from a substrate for each irradiation unit region, where n1×m1 irradiation unit regions in irradiation unit regions configure one of n2×m2 image reference regions configuring an inspection measurement image, to calculate, for each of the n2×m2 image reference regions, a statistic value acquired from the detection data of all the n1×m1 irradiation unit regions in one of the n2×m2 image reference regions, and to define the statistic value as image reference data for the image reference region, and a comparison processing circuitry to receive transmission of the image reference data for each image reference region, and to compare, using a reference image corresponding to the inspection measurement image composed of the n2×m2 image reference regions, the measurement image with the reference image for each image reference region.

Abstract: A measuring apparatus includes an optical image input unit to input optical image data of a figure pattern obtained by a pattern inspection apparatus, which inspects defects of a pattern on a target object to be inspected by scanning an inspection region of the target object, from the pattern inspection apparatus, a design data input unit to input design data of the pattern on the target object, a reference image generation unit to generate reference image data to be compared with the optical image data, by performing image development of the design data, a positional deviation distribution generation unit to generate positional deviation distribution by measuring a positional deviation amount of the pattern on the target object, by using the optical image data obtained from the pattern inspection apparatus and the reference image data having been generated, and an output unit to output generated positional deviation distribution of the pattern.

Abstract: In a mask inspection apparatus, an optical image acquisition unit acquires an optical image of a pattern in a mask by irradiating light. A reference image generation unit generates a corresponding reference image. A defect detection unit detects a defect of the pattern by comparing the two images. A misplacement data processing unit obtains a misplacement amount of the pattern from the images, and generates misplacement data. A misplacement map processing unit generates and outputs the map to the defect detection unit. The defect detection unit includes, a first comparison unit for comparing the images, a threshold value reconfiguring unit for specifying a portion of the map corresponding to the defect detected, reconfiguring a threshold value according to the shape of the defect and the misplacement direction of the optical image of the specified portion, and a second comparison unit for re-comparing both images using the reconfigured threshold value.

Abstract: A pattern inspection method includes acquiring an image of a pattern in a stripe region concerned, regarding each of stripe regions of the first group each not including an adjacent stripe region in plural stripe regions obtained by virtually dividing an inspection region of a target object on which patterns have been formed into the plural stripe regions each partially overlapping an adjacent stripe region, wherein the acquiring is performed using laser lights or electron beams, in a longitudinal direction of the stripe region of the first group, and acquiring an image of a pattern in a stripe region concerned, regarding each of stripe regions of the second group each not including an adjacent stripe region, in remaining stripe regions other than the first group stripe regions, wherein the acquiring is performed using laser lights or electron beams, in the longitudinal direction of the stripe region of the second group.

Abstract: In a mask inspection apparatus, an optical image acquisition unit acquires an optical image of a pattern in a mask by irradiating light. A reference image generation unit generates a corresponding reference image. A defect detection unit detects a defect of the pattern by comparing the two images. A misplacement data processing unit obtains a misplacement amount of the pattern from the images, and generates misplacement data. A misplacement map processing unit generates and outputs the map to the defect detection unit. The defect detection unit includes, a first comparison unit for comparing the images, a threshold value reconfiguring unit for specifying a portion of the map corresponding to the defect detected, reconfiguring a threshold value according to the shape of the defect and the misplacement direction of the optical image of the specified portion, and a second comparison unit for re-comparing both images using the reconfigured threshold value.

Abstract: A mask has an inspection region virtually divided by a plurality of stripes. A position error-correcting unit is disposed on a stage in a region different from the mask, formed with patterns divided virtually by the plurality of stripes. A first deviation amount acquiring circuit acquires a first deviation amount from the optical image and the reference image of the position error correction unit. A second deviation amount acquiring circuit acquires a second deviation amount. A position correcting circuit corrects a positional relationship between the mask and the position error correction unit based on the first deviation amount, and obtains a fluctuation value of position coordinates of each pattern in the inspection region of the mask based on the second deviation amount and corrects the position coordinates.

Abstract: An inspection method and inspection apparatus comprising, acquiring an optical image of a pattern formed in a sample, generating a reference image corresponding to the optical image, comparing the optical image and the reference image using a die-to-database method to detect a defect in the optical image and storing information on the defect; regenerating a reference image by reflecting a dimension distribution of a pattern in the surface of the sample on the reference image, and re-comparing an optical image in which a defect is detected by the comparison using the die-to-database method and the regenerated reference image which corresponds to the optical image using the die-to-database method to detect the defect in the optical image in which the defect has been detected, storing information on the defect when the defect is redetected, and determining that the optical image has no defect.

Abstract: A mask inspection apparatus includes an optical image acquisition unit configured to acquire an optical image by irradiating light on a mask, a reference image generation unit configured to generate a reference image from design data of the mask, a comparison circuit configured to compare the optical image with the reference image, a pattern data extraction unit configured to obtain coordinates of a defective portion determined to be defective by the comparison unit and to extract, from the design data, pattern data of a predetermined dimension range including the coordinates, and an interface unit configured to supply an aerial image measurement apparatus with information associated with the defect, the information including the defect coordinates and the extracted pattern data.

Abstract: A measuring apparatus includes an optical image input unit to input optical image data of a figure pattern obtained by a pattern inspection apparatus, which inspects defects of a pattern on a target object to be inspected by scanning an inspection region of the target object, from the pattern inspection apparatus, a design data input unit to input design data of the pattern on the target object, a reference image generation unit to generate reference image data to be compared with the optical image data, by performing image development of the design data, a positional deviation distribution generation unit to generate positional deviation distribution by measuring a positional deviation amount of the pattern on the target object, by using the optical image data obtained from the pattern inspection apparatus and the reference image data having been generated, and an output unit to output generated positional deviation distribution of the pattern.

Abstract: A measuring apparatus includes an input unit to input optical image data of a figure pattern obtained by a pattern inspection apparatus which inspects a defect of a pattern on a target object to be inspected by scanning an inspection region of the target object, from the pattern inspection apparatus, and to input reference image data generated from design data of the pattern by the pattern inspection apparatus to be compared with the optical image data, from the pattern inspection apparatus, a positional deviation distribution generation unit to generate positional deviation distribution by measuring positional deviation of the pattern on the target object, by using the optical image data and the reference image data input from the pattern inspection apparatus, and an output unit to output generated positional deviation distribution of the pattern on the target object, wherein the measuring apparatus is arranged independently from the pattern inspection apparatus.

Abstract: An inspection method and inspection apparatus comprising, acquiring an optical image of a pattern formed in a sample, generating a reference image corresponding to the optical image, comparing the optical image and the reference image using a die-to-database method to detect a defect in the optical image and storing information on the defect; regenerating a reference image by reflecting a dimension distribution of a pattern in the surface of the sample on the reference image, and re-comparing an optical image in which a defect is detected by the comparison using the die-to-database method and the regenerated reference image which corresponds to the optical image using the die-to-database method to detect the defect in the optical image in which the defect has been detected, storing information on the defect when the defect is redetected, and determining that the optical image has no defect.

Abstract: An inspection region of a mask is virtually divided by stripes, and a pattern on a position error correcting unit is also virtually divided by stripes. Then, a stage is moved such that all the stripes of both the mask and the position error correcting unit are continuously scanned, so that optical images of these stripes are acquired. Fluctuation values of position coordinates of the patterns formed on the position error correcting unit are acquired from the optical images of the position error correcting unit. Based upon the fluctuation values, fluctuation values of the position coordinates of the respective patterns in the inspection region of the mask are obtained so that the position coordinates are corrected. Thereafter, a map is generated from the fluctuation values of the position coordinates of the respective patterns in the inspection region of the mask.

Abstract: An inspection method and apparatus comprising, acquiring a plurality of optical images of a sample in which a plurality of dies having repetitive pattern are provided, comparing the optical images to each other by a die-to-die method and detecting a defect, obtaining at least one of a dimension difference and a dimension ratio between the repetitive pattern of the optical image to be inspected and the repetitive pattern of the optical image to be reference in the die-to-die method, extracting a die of the optical image having the dimension difference or dimension ratio closest to that at a defect position of a die of the optical image in which the defect is detected, compared, and stored, and determining that the defect does not exist in the optical image when the defect is not detected from the optical image in which the defect is originally detected.