Abstract: An unsaturated polyester resin composition includes a resin component containing an unsaturated polyester and a polymerizable monomer, an aluminum hydroxide, and an expandable graphite. The mixing ratio of the aluminum hydroxide to 100 parts by mass of the resin component is 50 parts by mass or more and 300 parts by mass or less. The mixing ratio of the expandable graphite to 100 parts by mass of the resin component is 3 parts by mass or more and 10 parts by mass or less. The expandable graphite has an average particle size of 150 ?m or less.

Abstract: An unsaturated polyester resin composition includes a resin component containing an unsaturated polyester and a polymerizable monomer, an aluminum hydroxide, and an expandable graphite. The mixing ratio of the aluminum hydroxide to 100 parts by mass of the resin component is 50 parts by mass or more and 300 parts by mass or less. The mixing ratio of the expandable graphite to 100 parts by mass of the resin component is 3 parts by mass or more and 10 parts by mass or less. The expandable graphite has an average particle size of 150 ?m or less.

Abstract: In a cylinder device, a rod of which one end portion is joined to a piston in a cylinder and the other end portion protrudes from an opening portion of the cylinder includes a first member that is a hollow cylindrical member in sliding contact with a sliding contact member, and a second member that does not come into sliding contact with the sliding contact member. An outer diameter of at least a first member side end portion of the second member is smaller than an outer diameter of the first member. An inner peripheral portion of the first member is joined to an outer peripheral portion of the second member by friction weld joining.

Abstract: An unsaturated polyester resin composition includes an unsaturated polyester, a polymerizable monomer, a low shrinkage agent, aluminum hydroxide, and an electrically conductive filler. The unsaturated polyester is a polymerization product of a polybasic acid including a polybasic acid having an ethylenically unsaturated double bond at a predetermined ratio and a polyhydric alcohol. A polyvinyl acetate as the low shrinkage agent is included at a predetermined ratio with respect to the total amount of the unsaturated polyester, the polymerizable monomer, and the low shrinkage agent. The aluminum hydroxide is included at a predetermined ratio with respect to the total amount of the unsaturated polyester, the polymerizable monomer, and the low shrinkage agent.

Abstract: An unsaturated polyester resin composition includes: a resin component comprising an unsaturated polyester, a polymerizable monomer, and a low profile agent; aluminum hydroxide; and a fire retardant. The unsaturated polyester is a polymerized product of polybasic acid and polyhydric alcohol. The polybasic acid has an ethylenic unsaturated double bond at a predetermined ratio. The polyvinyl acetate is blended as a low profile agent relative to the resin component at a predetermined ratio. Aluminum hydroxide is blended relative to the resin component at a predetermined ratio.

Abstract: An unsaturated polyester resin composition includes an unsaturated polyester, a polymerizable monomer, a low profile agent, and aluminum hydroxide. The unsaturated polyester is a polymerized product of polybasic acid and polyhydric alcohol. The polybasic acid contains unsaturated polybasic acid, and the unsaturated polybasic acid is blended in an amount of 80 mol % or more relative to 100 mol % the polybasic acid. The low profile agent contains polyvinyl acetate, and the polyvinyl acetate is blended in an amount of 3 parts by mass or more and 10 parts by mass or less relative to 100 parts by mass of a total amount of the unsaturated polyester, polymerizable monomer, and low profile agent. The aluminum hydroxide is blended in an amount of 150 parts by mass or more and 300 parts by mass or less relative to 100 parts by mass of a total amount of the unsaturated polyester, polymerizable monomer, and low profile agent.

Abstract: In a cylinder device, a rod of which one end portion is joined to a piston in a cylinder and the other end portion protrudes from an opening portion of the cylinder includes a first member that is a hollow cylindrical member in sliding contact with a sliding contact member, and a second member that does not come into sliding contact with the sliding contact member. An outer diameter of at least a first member side end portion of the second member is smaller than an outer diameter of the first member. An inner peripheral portion of the first member is joined to an outer peripheral portion of the second member by friction weld joining.

Abstract: An object of the invention is to provide compositions which have low-temperature heat sealing properties, are free from stickiness, may achieve a heat seal strength controlled within a certain definite range when heat sealing takes place at low temperatures, have small changes in heat seal strength with time, and are such that in the packaging applications, the strength required to open the packages may be easily controlled within a certain definite range, and high-performance packages may be designed. The invention resides in a 1-butene.?-olefin copolymer composition including 99 to 1 parts by mass of at least one olefin polymer (X) selected from propylene polymers (X-1) and ethylene polymers (X-2), and 1 to 99 parts by mass of a 1-butene.?-olefin copolymer (Y) containing 0.1 to 30 mol % of one or more ?-olefins selected from ?-olefins and having a molecular weight distribution (Mw/Mn) of 1.0 to 3.5 [wherein the total of (X) and (Y) in the composition is 100 parts by mass].

Abstract: The polyolefin composite film is excellent in low-temperature heat sealability, heat-sealing strength and transparency, and at least has surface layer [i]//intermediate layer [iii]//core layer[i], wherein the surface layer[i]includes a propylene resin composition including 0-50 wt % of a specific propylene?-olefin random copolymer (A) and/or a specific 1-butene?-olefin copolymer (E), and 50-100 wt % of a propylene polymer (B) having a melting point of 120-170° C. ((A), (E) and (B) in the surface layer totals 100 wt %); the core layer [ii]includes a propylene resin composition including 70-100 wt % of a crystalline polypropylene (C) having a melting point of 150-170° C.

Abstract: An object of the invention is to provide compositions which have low-temperature heat sealing properties, are free from stickiness, may achieve a heat seal strength controlled within a certain definite range when heat sealing takes place at low temperatures, have small changes in heat seal strength with time, and are such that in the packaging applications, the strength required to open the packages may be easily controlled within a certain definite range, and high-performance packages may be designed. The invention resides in a 1-butene.?-olefin copolymer composition including 99 to 1 parts by mass of at least one olefin polymer (X) selected from propylene polymers (X-1) and ethylene polymers (X-2), and 1 to 99 parts by mass of a 1-butene.?-olefin copolymer (Y) containing 0.1 to 30 mol % of one or more ?-olefins selected from ?-olefins and having a molecular weight distribution (Mw/Mn) of 1.0 to 3.5 [wherein the total of (X) and (Y) in the composition is 100 parts by mass].

Abstract: An object of the invention is to provide compositions which have low-temperature heat sealing properties, are free from stickiness, may achieve a heat seal strength controlled within a certain definite range when heat sealing takes place at low temperatures, have small changes in heat seal strength with time, and are such that in the packaging applications, the strength required to open the packages may be easily controlled within a certain definite range, and high-performance packages may be designed. The invention resides in a 1-butene.?-olefin copolymer composition including 99 to 1 parts by mass of at least one olefin polymer (X) selected from propylene polymers (X-1) and ethylene polymers (X-2), and 1 to 99 parts by mass of a 1-butene.?-olefin copolymer (Y) containing 0.1 to 30 mol % of one or more ?-olefins selected from ?-olefins and having a molecular weight distribution (Mw/Mn) of 1.0 to 3.5 [wherein the total of (X) and (Y) in the composition is 100 parts by mass].

Abstract: An object of the invention is to provide compositions which have low-temperature heat sealing properties, are free from stickiness, may achieve a heat seal strength controlled within a certain definite range when heat sealing takes place at low temperatures, have small changes in heat seal strength with time, and are such that in the packaging applications, the strength required to open the packages may be easily controlled within a certain definite range, and high-performance packages may be designed. The invention resides in a 1-butene ?-olefin copolymer composition including 99 to 1 parts by mass of at least one olefin polymer (X) selected from propylene polymers (X-1) and ethylene polymers (X-2), and 1 to 99 parts by mass of a 1-butene ?-olefin copolymer (Y) containing 0.1 to 30 mol % of one or more ?-olefins selected from ?-olefins and having a molecular weight distribution (Mw/Mn) of 1.0 to 3.5 [wherein the total of (X) and (Y) in the composition is 100 parts by mass].

Abstract: The polyolefin composite film is excellent in low-temperature heat sealability, heat-sealing strength and transparency, and at least has surface layer [i]//intermediate layer [iii]//core layer [ii], wherein the surface layer [i] includes a propylene resin composition including 0-50 wt % of a specific propylene/?-olefin random copolymer (A) and/or a specific 1-butene/?-olefin copolymer (E), and 50-100 wt % of a propylene polymer (B) having a melting point of 120-170° C. ((A), (E) and (B) in the surface layer totals 100 wt %); the core layer [ii] includes a propylene resin composition including 70-100 wt % of a crystalline polypropylene (C) having a melting point of 150-170° C.

Abstract: Propylene-based polymers (A) are provided which, when used as pressure-sensitive adhesives to various adherends, show a desired initial adhesion and will not contaminate the adherends and which have excellent pellet handling properties. Pellets of the invention contain the propylene-based polymers (A). Pressure-sensitive adhesives of the invention contain the propylene-based polymers (A). The propylene-based polymer (A) includes 65 to 80 mol % of a structural unit derived from propylene, 5 to 10 mol % of a structural unit derived from ethylene and 15 to 25 mol % of a structural unit derived from a C4-20 ?-olefin (wherein these percentages are calculated based on 100 mol % of the total of the structural unit derived from propylene, the structural unit derived from ethylene and the structural unit derived from a C4-20 ?-olefin) and has a heat of crystal fusion of 5 to 45 (J/g) as measured by DSC. Compositions of the invention contain the propylene-based polymers (A).

Abstract: Propylene-based polymers (A) are provided which, when used as pressure-sensitive adhesives to various adherends, show a desired initial adhesion and will not contaminate the adherends and which have excellent pellet handling properties. Pellets of the invention contain the propylene-based polymers (A). Pressure-sensitive adhesives of the invention contain the propylene-based polymers (A). The propylene-based polymer (A) includes 65 to 80 mol % of a structural unit derived from propylene, 5 to 10 mol % of a structural unit derived from ethylene and 15 to 25 mol % of a structural unit derived from a C4-20 ?-olefin (wherein these percentages are calculated based on 100 mol % of the total of the structural unit derived from propylene, the structural unit derived from ethylene and the structural unit derived from a C4-20 ?-olefin) and has a heat of crystal fusion of 5 to 45 (J/g) as measured by DSC. Compositions of the invention contain the propylene-based polymers (A).

Abstract: A semiconductor wafer surface protection sheet which can prevent breakage of a semiconductor wafer even when a circuit-formed surface of the semiconductor wafer has a significant unevenness, and a method for protecting the semiconductor wafer by using such protection sheet. The semiconductor wafer surface protection sheet includes at least one resin layer (A) satisfying a relationship of G? (60)/G? (25)<0.1, where G? (25) is a storage elastic modulus at 25° C., and G? (60) is a storage elastic modulus at 60° C. The semiconductor wafer protecting method using such sheet is also provided.