Abstract: A three-dimensional measurement device includes: an optical system including an optical device that splits an incident light, irradiates a measurement object with a measurement light, irradiates a reference plane with a reference light, and combines at least part of the reflected measurement light with at least part of the reflected reference light to emit a combined light; a first light emitter that emits a first light that has a first wavelength; a second light emitter that emits a second light that has a second wavelength; a first imaging device that takes an image of an output light output from the optical device in which the first light enters; a second imaging device that takes an image of an output light output from the optical device in which the second light enters; and a control device that executes three-dimensional measurement of the measurement object.

Abstract: A three-dimensional measurement device includes: a light emitter; an optical system that splits an incident light, irradiates a measurement object with an object light and irradiates a reference plane with a reference light, and recombines the object and reference lights and emits a combined light; an imaging device that takes an image of a light emitted from the optical system; a storage device that stores transmission axis absolute angle data each obtained by a previous actual measurement of an absolute angle of a transmission axis of each polarizer; and a control device that calculates a phase difference between the reference and object lights based on luminance data of each pixel in luminance image data and the transmission axis absolute angle data of each polarizer corresponding to the pixel, and measures a height of the measurement object at the measurement position.

Abstract: A three-dimensional measurement device includes: an irradiator that emits a predetermined light; an optical system that splits the predetermined light into two lights, irradiates a measurement object with a measurement light and irradiates a reference plane with a reference light, and emits a combined light; an imaging device that takes an image of the combined light and obtains an interference fringe image; an objective lens for the measurement light that directs the measurement light toward the measurement object; an objective lens for the reference light that directs the reference light toward the reference plane; an imaging lens that forms an image of the combined light on the imaging device; and a control device that executes three-dimensional measurement of a measurement area on the measurement object based on the interference fringe image.

Abstract: A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

Abstract: A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

Abstract: A three-dimensional measurement device includes: an illuminator that irradiates a measured object with a predetermined light; an imaging device that comprises: an imaging sensor displaceable at least in a vertical direction; and a both-sided telecentric optical system that causes the imaging sensor to form an image of a predetermined area on the measured object irradiated with the predetermined light; a conveyor that moves the illuminator and the imaging device relative to the measured object; and a controller that: executes three-dimensional measurement of a predetermined measurement object on the measured object, based on the taken image; measures a height of the predetermined area at least at a time prior to imaging of the predetermined area under the predetermined light; and changes a height position of the imaging sensor based on a measurement result to adjust an interval between the predetermined area and the imaging sensor to a predetermined distance.

Abstract: A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

Abstract: A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device including: an irradiator that irradiates the solder and the adhesive with light; an imaging device that takes an image of the irradiated solder and the irradiated adhesive; and a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group.

Abstract: A three-dimensional measurement device includes: an illuminator that irradiates a measured object with a predetermined light; an imaging device that comprises: an imaging sensor displaceable at least in a vertical direction; and a both-sided telecentric optical system that causes the imaging sensor to form an image of a predetermined area on the measured object irradiated with the predetermined light; a conveyor that moves the illuminator and the imaging device relative to the measured object; and a controller that: executes three-dimensional measurement of a predetermined measurement object on the measured object, based on the taken image; measures a height of the predetermined area at least at a time prior to imaging of the predetermined area under the predetermined light; and changes a height position of the imaging sensor based on a measurement result to adjust an interval between the predetermined area and the imaging sensor to a predetermined distance.

Abstract: For measuring the three-dimensional shape of an object of measurement using a phase shift method, a three-dimensional shortening the measurement time. A printed state inspection device 1 includes a printed circuit board K printed with cream solder H, an illumination device 3 for illuminating three sine wave light component patterns with different phases on the surface of printed circuit board K, and a CCD camera 4 for picking-up images of the illuminated part of the printed circuit board K. A control device 7 creates a chart representing a relationship between brightness and coordinates for each light component from the image data obtained by the illumination of the light component patterns and determines relative phase angles among the light component patterns, and calculates the height of the cream solder H from the image data and the relative phase angles.

Abstract: For measuring the three-dimensional shape of an object of measurement using a phase shift method, a three-dimensional measuring instrument is provided which is capable of shortening the measurement time. A printed state inspection device 1 includes a table for placing a printed circuit board K printed with cream solder H, an illumination device 3 for illuminating three sine wave light component patterns with different phases on the surface of printed circuit board K, a CCD camera 4 for picking-up images of the illuminated part of the printed circuit board K, a white light illumination unit L for illuminating a white light on the surface of printed circuit board K, and a laser pointer for measuring the standard height. A control device 7 determines the existing area of the cream solder H from the image data obtained by the illumination of the white light, and calculates the height of the cream solder H from the image data obtained by the illumination device 3 by using a phase shift method.

Abstract: A shape measuring device includes a light source for generating slit light beam and a polygon mirror for scanning the light beam and illuminating an object to be measured. The device further includes space-coding light beam controlling means, phase-shifting light beam controlling means, and a CCD camera which picks up an optical image of an object to be measured obtained by illumination of the light beam. The space-coding light beam controlling means controls light beam whose distribution of integrated illumination has a stripe patter in accordance with a predetermined code and the phase-shifting light beam controlling means controls light beam whose distribution of integrated illumination has a sine-wave like pattern. The distribution of integrated illumination intensity is possessed by the light beam illuminating within a time period for picking up one frame.