Abstract: There is disclosed a chip type capacitor characterized by comprising a capacitor having lead wires derived from a terminal thereof and a sheathing frame having an accommodating space compatible with a dimension of an external shape of said capacitor, wherein a protuberance of a height substantially identical to the dimension of an external diameter of the lead wires of the capacitor is provided on the underside of the sheathing frame and the lead wires of the capacitor accommodated in the sheathing frame are bent alongside from an end of the aperture of the sheathing frame to the underside of the sheathing.

Abstract: A powdery adhesive comprised of spherical particles comprising 40 to 90 parts by weight of an epoxy resin component, 10 to 60 parts by weight of a rubber component and a latent curing agent contained inside the particles, the average particle size of the particles being from 0.1 to 500 .mu.m. The powdery adhesive may be prepared by a process comprising a step of preparing a compatible mixture comprising an epoxy resin component, a rubber component and a common organic solvent, a step of emulsifying or suspending the compatible mixture in an aqueous medium to form spherical particles, and a step of causing a phase separation of the epoxy resin component and the rubber component in the spherical particles.

Abstract: There is disclosed a chip type capacitor in which the capacitor is accommodated in a sheathing frame having the receiving space compatible with an external size of the capacitor, terminals derived from the same open end of the capacitor are bent along the open end and the top surface of the sheathing frame and a solderable metal layer is arranged in a part of the top surface thereof.