Abstract: An electrostatic chuck includes: a dielectric substrate on which at least one first gas hole is formed; a base plate on which at least one second gas hole is formed; and a joining layer which is provided between the dielectric substrate and the base plate and which is formed of an insulating material. A first opening being an end of the at least one first gas hole is formed on a surface of the dielectric substrate. A second opening being an end of the at least one second gas hole is formed at a position which differs from the at least one first opening on a surface of the base plate. A communication groove is formed on the surface of the base plate.

Abstract: An electrostatic chuck includes: a dielectric substrate on which at least one first gas hole is formed; a base plate on which at least one second gas hole is formed; and a joining layer which is provided between the dielectric substrate and the base plate and which is formed of an insulating material. A first opening being an end of the at least one first gas hole is formed on a surface of the dielectric substrate. A second opening being an end of the at least one second gas hole is formed at a position which differs from the at least one first opening on a surface of the base plate. A communication groove is formed on the surface of the base plate.

Abstract: To provide an electrostatic chuck which has a configuration in which a conductive member is arranged between a dielectric substrate and a base plate, and can be easily manufactured. An electrostatic chuck 10 includes a dielectric substrate 100, an RF electrode 140 provided inside the dielectric substrate 100, a base plate 200 made of metal and joined to the dielectric substrate 100, and a conductive member 400 configured to electrically connect the RF electrode 140 and the base plate 200 to each other. A recessed section 270 which accommodates a part of the conductive member 400 is formed in a surface 210 on the dielectric substrate 100 side of the base plate 200. In this electrostatic chuck 10, a length (L2) of a part of the conductive member 400 accommodated in the recessed section 270 is ½ or more of the entire length (L1) of the conductive member 400.

Abstract: An electrostatic chuck 10 includes: a dielectric substrate 100 that includes a first part 101 including a surface 110 as a placement surface, and a second part 102 thinner than the first part 101 projecting from an outer peripheral end of the first part 101 further toward an outer peripheral side; a first internal electrode 140 provided inside the first part 101; a second internal electrode 150 provided inside the second part 102; a first power supply member 401 that is provided on a surface 120 of the dielectric substrate 100 and electrically connected to the first internal electrode 140; and a second power supply member 402 that is provided on the surface 120 of the dielectric substrate 100 and electrically connected to the second internal electrode 150. Both of the first power supply member 401 and the second power supply member 402 are provided in the first part 101 of the dielectric substrate 100.

Abstract: An electrostatic chuck 10 includes a dielectric substrate 100, an RF electrode 140 provided inside the dielectric substrate 100, a feed terminal 170 arranged on an inner side of a recessed section 160 which is formed on a surface 120 opposite to a placement surface in the dielectric substrate 100, and a connection section 190 configured to electrically connect the RF electrode 140 with the feed terminal 170. The connection section 190 extends from a bottom 161 of the recessed section 160 toward the placement surface, and extends up to a position closer to the placement surface side than the RF electrode 140.

Abstract: An electrostatic chuck 10 includes a dielectric substrate 100, an internal electrode 140 provided inside the dielectric substrate 100, a base plate 200 in which a through hole 230 is formed, a power supply member 400 that is a member for supplying power to the internal electrode 140 and is inserted through the through hole 230, and an insulating member 500 arranged between an inner surface of the through hole 230 and the power supply member 400. The insulating member 500 includes a tubular first insulating member 510, and a tubular second insulating member 520 covering a part of the first insulating member 510 on an outer peripheral side. The electrostatic chuck 10 further includes an annular member 530 for preventing an electric discharge along a path from the power supply member 400 to the inner surface of the through hole 230 passing between the first insulating member 510 and the second insulating member 520.

Abstract: An electrostatic chuck 10 includes a first portion 101 including a surface 110 on which a wafer W is placed, and a second portion 102 projecting from an outer peripheral end of the first portion 101 further toward an outer peripheral side and being thinner than the first portion 101. A first gas hole 150 is formed in the first portion 101, and a first air-permeable member 400 having air-permeability is arranged inside the first gas hole 150. A second gas hole 160 is formed in the second portion 102, and a second air-permeable member 500 having air-permeability is arranged inside the second gas hole 160. A height dimension of the second air-permeable member 500 is smaller than a height dimension of the first air-permeable member 400.

Abstract: The electrostatic chuck 10 includes: a first portion 101 including a surface 110 on which a wafer W is placed; and a second portion 102 projecting from an outer peripheral end of the first portion 101 further toward an outer peripheral side, and including a surface 180 on which an annular member RE is placed. On a part of the surface 180, a roughened surface part 182 is provided to enable surrounding gas to easily enter a space between itself and the annular member RE as compared with another portion of the surface 180.

Abstract: An electrostatic chuck includes a dielectric substrate 100, and a base plate joined to the dielectric substrate. The dielectric substrate is provided with a flange section that is a part protruding outward along the entire periphery of a part of a side surface of the dielectric substrate on the base plate side. The base plate includes a surface which is closest to the dielectric substrate side and a part of which is joined to the dielectric substrate. A part of the surface, which is not joined to the dielectric substrate, surrounds the flange section along the entire periphery in top view.

Abstract: An electrostatic chuck includes a dielectric substrate, an attraction electrode provided inside the dielectric substrate, and a base plate joined to the dielectric substrate. In top view, the dielectric substrate includes a protrusion section which protrudes outward from a surface to be joined of the base plate, and a part of the attraction electrode is provided in the protrusion section.

Abstract: An electrostatic chuck includes a dielectric substrate, an attraction electrode provided inside the dielectric substrate, and an RF electrode provided inside the dielectric substrate. The RF electrode is provided in a range where an outer circumferential edge of the RF electrode is positioned inside an outer circumferential edge of the attraction electrode in top view.

Abstract: An electrostatic chuck includes a dielectric substrate and a base plate joined to the dielectric substrate. The base plate includes a first part that is a part on the dielectric substrate side, and a second part which is a part adjacent to the first part from an opposite side of the dielectric substrate and which has an outer shape larger than an outer shape of the first part in top view. The base plate is constituted by joining a plurality of members to each other, and a joint boundary B1 closest to the dielectric substrate is located in the second part.

Abstract: An electrostatic chuck includes a dielectric substrate, an RF electrode provided inside the dielectric substrate, and a base plate made of metal and joined to the dielectric substrate. The dielectric substrate includes a protrusion section protruding outward beyond a surface of the base plate in top view, and a part of the RF electrode is provided in the protrusion section.

Abstract: An electrostatic chuck includes a dielectric substrate including a surface serving as a placement surface, and a base plate which is joined to the dielectric substrate and which has formed therein a coolant flow path through which a coolant flows. In top view, the base plate includes a first part that is a part overlapped with an edge on an outer circumferential side of the surface, and a second part P2 that is a part on the further outer circumferential side relative to the first part P1, and the coolant flow path is formed in each of the first part P1 and the second part. The coolant flow path is formed in a manner that a cooling performance for the first part is set to be higher than a cooling performance for the second part.

Abstract: An electrostatic chuck includes a dielectric substrate 100, an RF electrode provided inside the dielectric substrate, a base plate made of a metal and joined to the dielectric substrate, and a conductive member configured to electrically connect the RF electrode and the base plate to each other. A first recessed section which accommodates a part of the conductive member is formed on the surface on the base plate side of the dielectric substrate. A second recessed section which accommodates a part of the conductive member is formed on a surface on the dielectric substrate side of the base plate. In top view, the first recessed section is larger than the second recessed section.

Abstract: An electrostatic chuck includes: a dielectric substrate in which a through hole is formed; an RF electrode which is embedded inside the dielectric substrate; and an attracting electrode which is embedded inside the dielectric substrate at a position that is closer to a placement surface than the RF electrode. When viewed from a direction perpendicular to the placement surface, a circular first opening which is concentric with the through hole and which includes the through hole is formed in the attracting electrode and a circular second opening which is concentric with the through hole and which includes the through hole is formed in the RF electrode. A radius of the second opening is larger than a radius of the first opening.

Abstract: An electrostatic chuck includes: a dielectric substrate on which a plurality of first gas holes are formed; a base plate on which a second gas hole is formed; and a joining layer which is provided between the dielectric substrate and the base plate and which is formed of an insulating material. A first opening being an end of each of the first gas holes is formed in plurality on a surface of the dielectric substrate on a side of the joining layer. A second opening being an end of the second gas hole is formed on a surface of the base plate on a side of the joining layer. The second opening is communicated with the plurality of first openings via a communication groove formed on the surface of the base plate on the side of the joining layer.

Abstract: An electrostatic chuck includes: a dielectric substrate on which at least one first gas hole is formed; a base plate on which at least one second gas hole is formed; and a joining layer which is provided between the dielectric substrate and the base plate and which is formed of an insulating material. A first opening being an end of the at least one first gas hole is formed on a surface of the dielectric substrate. A second opening being an end of the at least one second gas hole is formed at a position which differs from the at least one first opening on a surface of the base plate. A communication groove is formed on the surface of the base plate.

Abstract: An electrostatic chuck 10 includes: a dielectric substrate 100 which includes a surface 110 on which a substrate W is to be placed and in which through holes (gas holes 150 and lift pin holes 160) that penetrate the surface 110 are formed; an electrode terminal 121 which is provided on a surface 120 of the dielectric substrate 100 on an opposite side to the surface 110; a base plate 200 to be joined to the surface 120 of the dielectric substrate 100; and a joining layer 300 which is provided between the dielectric substrate 100 and the base plate 200 and which is formed of an insulating material. When viewed from a direction perpendicular to the surface 110, spaces 340 are formed at positions within the joining layer 300 that do not overlap with any of the through holes and the electrode terminal 121.

Abstract: An electrostatic chuck includes: an electrically-conductive base plate including a first part, a second part at an outer circumference of the first part, and a gas inlet path for introducing a cooling gas; a first electrostatic chuck part configured to clamp a wafer on the first part, including a ceramic dielectric substrate that includes an embedded first clamping electrode and at least one through-hole communicating with the gas inlet path; and a second electrostatic chuck part configured to clamp a focus ring on the second part, including a ceramic layer that includes at least one through-hole for introducing a cooling gas and that includes at least a first layer contacting the focus ring when the second electrostatic chuck part clamps the focus ring, in which the first layer is less dense than the ceramic dielectric substrate. Thereby, the electrostatic chuck can increase the device yield.