Patents by Inventor Ikuo Itakura
Ikuo Itakura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250242459Abstract: An electrostatic chuck includes a dielectric substrate 100, and a base plate joined to the dielectric substrate. The dielectric substrate is provided with a flange section that is a part protruding outward along the entire periphery of a part of a side surface of the dielectric substrate on the base plate side. The base plate includes a surface which is closest to the dielectric substrate side and a part of which is joined to the dielectric substrate. A part of the surface, which is not joined to the dielectric substrate, surrounds the flange section along the entire periphery in top view.Type: ApplicationFiled: January 23, 2025Publication date: July 31, 2025Inventors: Yuki SASAKI, Jun SHIRAISHI, Yutaka MOMIYAMA, Ikuo ITAKURA, Hitoshi SASAKI
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Publication number: 20250242460Abstract: An electrostatic chuck includes a dielectric substrate, an attraction electrode provided inside the dielectric substrate, and a base plate joined to the dielectric substrate. In top view, the dielectric substrate includes a protrusion section which protrudes outward from a surface to be joined of the base plate, and a part of the attraction electrode is provided in the protrusion section.Type: ApplicationFiled: January 23, 2025Publication date: July 31, 2025Inventors: Yuki SASAKI, Jun SHIRAISHI, Yutaka MOMIYAMA, Ikuo ITAKURA, Hitoshi SASAKI
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Publication number: 20250242457Abstract: An electrostatic chuck includes a dielectric substrate, an attraction electrode provided inside the dielectric substrate, and an RF electrode provided inside the dielectric substrate. The RF electrode is provided in a range where an outer circumferential edge of the RF electrode is positioned inside an outer circumferential edge of the attraction electrode in top view.Type: ApplicationFiled: January 22, 2025Publication date: July 31, 2025Inventors: Yuki SASAKI, Jun SHIRAISHI, Yutaka MOMIYAMA, Ikuo ITAKURA, Hitoshi SASAKI
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Publication number: 20250242458Abstract: An electrostatic chuck includes a dielectric substrate and a base plate joined to the dielectric substrate. The base plate includes a first part that is a part on the dielectric substrate side, and a second part which is a part adjacent to the first part from an opposite side of the dielectric substrate and which has an outer shape larger than an outer shape of the first part in top view. The base plate is constituted by joining a plurality of members to each other, and a joint boundary B1 closest to the dielectric substrate is located in the second part.Type: ApplicationFiled: January 23, 2025Publication date: July 31, 2025Inventors: Yuki SASAKI, Jun SHIRAISHI, Yutaka MOMIYAMA, Ikuo ITAKURA, Hitoshi SASAKI
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Publication number: 20250246472Abstract: An electrostatic chuck includes a dielectric substrate, an RF electrode provided inside the dielectric substrate, and a base plate made of metal and joined to the dielectric substrate. The dielectric substrate includes a protrusion section protruding outward beyond a surface of the base plate in top view, and a part of the RF electrode is provided in the protrusion section.Type: ApplicationFiled: January 22, 2025Publication date: July 31, 2025Inventors: Yuki SASAKI, Jun SHIRAISHI, Yutaka MOMIYAMA, Ikuo ITAKURA, Hitoshi SASAKI
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Publication number: 20250246473Abstract: An electrostatic chuck includes a dielectric substrate including a surface serving as a placement surface, and a base plate which is joined to the dielectric substrate and which has formed therein a coolant flow path through which a coolant flows. In top view, the base plate includes a first part that is a part overlapped with an edge on an outer circumferential side of the surface, and a second part P2 that is a part on the further outer circumferential side relative to the first part P1, and the coolant flow path is formed in each of the first part P1 and the second part. The coolant flow path is formed in a manner that a cooling performance for the first part is set to be higher than a cooling performance for the second part.Type: ApplicationFiled: January 23, 2025Publication date: July 31, 2025Inventors: Yuki SASAKI, Jun SHIRAISHI, Yutaka MOMIYAMA, Ikuo ITAKURA, Hitoshi SASAKI
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Publication number: 20250233001Abstract: An electrostatic chuck includes a dielectric substrate 100, an RF electrode provided inside the dielectric substrate, a base plate made of a metal and joined to the dielectric substrate, and a conductive member configured to electrically connect the RF electrode and the base plate to each other. A first recessed section which accommodates a part of the conductive member is formed on the surface on the base plate side of the dielectric substrate. A second recessed section which accommodates a part of the conductive member is formed on a surface on the dielectric substrate side of the base plate. In top view, the first recessed section is larger than the second recessed section.Type: ApplicationFiled: January 7, 2025Publication date: July 17, 2025Inventors: Yuki SASAKI, Jun SHIRAISHI, Yutaka MOMIYAMA, Ikuo ITAKURA
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Publication number: 20240331985Abstract: An electrostatic chuck includes: a dielectric substrate in which a through hole is formed; an RF electrode which is embedded inside the dielectric substrate; and an attracting electrode which is embedded inside the dielectric substrate at a position that is closer to a placement surface than the RF electrode. When viewed from a direction perpendicular to the placement surface, a circular first opening which is concentric with the through hole and which includes the through hole is formed in the attracting electrode and a circular second opening which is concentric with the through hole and which includes the through hole is formed in the RF electrode. A radius of the second opening is larger than a radius of the first opening.Type: ApplicationFiled: March 20, 2024Publication date: October 3, 2024Applicant: TOTO LTD.Inventors: Ryosuke SAKURAI, Keisuke SANO, Masafumi IKEGUCHI, Jun SHIRAISHI, Ikuo ITAKURA, Yutaka MOMIYAMA
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Publication number: 20240279810Abstract: An electrostatic chuck includes: a dielectric substrate on which a plurality of first gas holes are formed; a base plate on which a second gas hole is formed; and a joining layer which is provided between the dielectric substrate and the base plate and which is formed of an insulating material. A first opening being an end of each of the first gas holes is formed in plurality on a surface of the dielectric substrate on a side of the joining layer. A second opening being an end of the second gas hole is formed on a surface of the base plate on a side of the joining layer. The second opening is communicated with the plurality of first openings via a communication groove formed on the surface of the base plate on the side of the joining layer.Type: ApplicationFiled: February 16, 2024Publication date: August 22, 2024Applicant: TOTO LTD.Inventors: Shunya MIYAZAKI, Jun SHIRAISHI, Yutaka MOMIYAMA, Ikuo ITAKURA
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Publication number: 20240283379Abstract: An electrostatic chuck includes: a dielectric substrate on which at least one first gas hole is formed; a base plate on which at least one second gas hole is formed; and a joining layer which is provided between the dielectric substrate and the base plate and which is formed of an insulating material. A first opening being an end of the at least one first gas hole is formed on a surface of the dielectric substrate. A second opening being an end of the at least one second gas hole is formed at a position which differs from the at least one first opening on a surface of the base plate. A communication groove is formed on the surface of the base plate.Type: ApplicationFiled: February 16, 2024Publication date: August 22, 2024Applicant: TOTO LTD.Inventors: Shunya MIYAZAKI, Jun SHIRAISHI, Yutaka MOMIYAMA, Ikuo ITAKURA
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Publication number: 20240282612Abstract: An electrostatic chuck 10 includes: a dielectric substrate 100 which includes a surface 110 on which a substrate W is to be placed and in which through holes (gas holes 150 and lift pin holes 160) that penetrate the surface 110 are formed; an electrode terminal 121 which is provided on a surface 120 of the dielectric substrate 100 on an opposite side to the surface 110; a base plate 200 to be joined to the surface 120 of the dielectric substrate 100; and a joining layer 300 which is provided between the dielectric substrate 100 and the base plate 200 and which is formed of an insulating material. When viewed from a direction perpendicular to the surface 110, spaces 340 are formed at positions within the joining layer 300 that do not overlap with any of the through holes and the electrode terminal 121.Type: ApplicationFiled: February 16, 2024Publication date: August 22, 2024Applicant: TOTO LTD.Inventors: Shunya MIYAZAKI, Jun SHIRAISHI, Yutaka MOMIYAMA, Ikuo ITAKURA
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Patent number: 11410868Abstract: An electrostatic chuck includes: an electrically-conductive base plate including a first part, a second part at an outer circumference of the first part, and a gas inlet path for introducing a cooling gas; a first electrostatic chuck part configured to clamp a wafer on the first part, including a ceramic dielectric substrate that includes an embedded first clamping electrode and at least one through-hole communicating with the gas inlet path; and a second electrostatic chuck part configured to clamp a focus ring on the second part, including a ceramic layer that includes at least one through-hole for introducing a cooling gas and that includes at least a first layer contacting the focus ring when the second electrostatic chuck part clamps the focus ring, in which the first layer is less dense than the ceramic dielectric substrate. Thereby, the electrostatic chuck can increase the device yield.Type: GrantFiled: February 19, 2021Date of Patent: August 9, 2022Assignee: Toto Ltd.Inventors: Masaki Sato, Ikuo Itakura, Shuichiro Saigan, Jun Shiraishi, Yutaka Momiyama, Kouta Kobayashi
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Patent number: 11380574Abstract: An electrostatic chuck includes: an electrically-conductive base plate including a first part, a second part at an outer circumference of the first part, and a gas inlet path for introducing a cooling gas; a first electrostatic chuck part configured to clamp a wafer on the first part, including a ceramic dielectric substrate that includes an embedded first clamping electrode and at least one through-hole communicating with the gas inlet path; and a second electrostatic chuck part configured to clamp a focus ring on the second part, including a ceramic layer that includes at least one through-hole for introducing a cooling gas and that includes at least a first layer contacting the focus ring when the second electrostatic chuck part clamps the focus ring, in which the first layer is less dense than the ceramic dielectric substrate. Thereby, the electrostatic chuck can increase the device yield.Type: GrantFiled: February 19, 2021Date of Patent: July 5, 2022Assignee: Toto Ltd.Inventors: Masaki Sato, Ikuo Itakura, Shuichiro Saigan, Jun Shiraishi, Yutaka Momiyama, Kouta Kobayashi
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Publication number: 20210175109Abstract: An electrostatic chuck includes: an electrically-conductive base plate including a first part, a second part at an outer circumference of the first part, and a gas inlet path for introducing a cooling gas; a first electrostatic chuck part configured to clamp a wafer on the first part, including a ceramic dielectric substrate that includes an embedded first clamping electrode and at least one through-hole communicating with the gas inlet path; and a second electrostatic chuck part configured to clamp a focus ring on the second part, including a ceramic layer that includes at least one through-hole for introducing a cooling gas and that includes at least a first layer contacting the focus ring when the second electrostatic chuck part clamps the focus ring, in which the first layer is less dense than the ceramic dielectric substrate. Thereby, the electrostatic chuck can increase the device yield.Type: ApplicationFiled: February 19, 2021Publication date: June 10, 2021Inventors: Masaki SATO, Ikuo ITAKURA, Shuichiro SAIGAN, Jun SHIRAISHI, Yutaka MOMIYAMA, Kouta KOBAYASHI
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Patent number: 11018039Abstract: According to the embodiment, the electrostatic chuck includes a ceramic dielectric substrate having a first major surface and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The ceramic dielectric substrate includes a first hole part positioned between the first major surface and the first porous part. At least one of the ceramic dielectric substrate or the first porous part includes a second hole part positioned between the first hole part and the first porous part, and a dimension of the second hole part is smaller than a dimension of the first porous part and larger than a dimension of the first hole part.Type: GrantFiled: March 14, 2019Date of Patent: May 25, 2021Assignee: Toto Ltd.Inventors: Kosuke Yamaguchi, Jun Shiraishi, Ikuo Itakura, Yutaka Momiyama, Shuichiro Saigan
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Patent number: 10923383Abstract: According to the embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object, a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface of the ceramic dielectric substrate and being opposite to the gas introduction path. The first porous part includes a first region positioned on the ceramic dielectric substrate side. The ceramic dielectric substrate includes a first substrate region positioned on the first region side. The first region and the first substrate region are provided in contact with each other, and an average particle diameter in the first region is different from an average particle diameter in the first substrate region.Type: GrantFiled: March 14, 2019Date of Patent: February 16, 2021Assignee: Toto Ltd.Inventors: Takara Katayama, Kosuke Yamaguchi, Ikuo Itakura, Yutaka Momiyama, Jun Shiraishi, Shuichiro Saigan
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Patent number: 10497600Abstract: According to the embodiment, the first invention relates to an electrostatic chuck. The electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The first porous part includes sparse portions including pores and a dense portion having a density higher than a density of the sparse portions. Each of the sparse portions extends from the base plate toward the ceramic dielectric substrate. The dense portion is positioned between the sparse portions. The sparse portions include a wall portion provided between the pores and the pores.Type: GrantFiled: March 13, 2019Date of Patent: December 3, 2019Assignee: Toto Ltd.Inventors: Kosuke Yamaguchi, Jun Shiraishi, Ikuo Itakura, Yutaka Momiyama, Shuichiro Saigan
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Publication number: 20190287839Abstract: According to the embodiment, the electrostatic chuck includes a ceramic dielectric substrate having a first major surface and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The ceramic dielectric substrate includes a first hole part positioned between the first major surface and the first porous part. At least one of the ceramic dielectric substrate or the first porous part includes a second hole part positioned between the first hole part and the first porous part, and a dimension of the second hole part is smaller than a dimension of the first porous part and larger than a dimension of the first hole part.Type: ApplicationFiled: March 14, 2019Publication date: September 19, 2019Inventors: Kosuke YAMAGUCHI, Jun SHIRAISHI, Ikuo ITAKURA, Yutaka MOMIYAMA, Shuichiro SAIGAN
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Publication number: 20190287840Abstract: According to the embodiment, an electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object, a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface of the ceramic dielectric substrate and being opposite to the gas introduction path. The first porous part includes a first region positioned on the ceramic dielectric substrate side. The ceramic dielectric substrate includes a first substrate region positioned on the first region side. The first region and the first substrate region are provided in contact with each other, and an average particle diameter in the first region is different from an average particle diameter in the first substrate region.Type: ApplicationFiled: March 14, 2019Publication date: September 19, 2019Inventors: Takara KATAYAMA, Kosuke YAMAGUCHI, Ikuo ITAKURA, Yutaka MOMIYAMA, Jun SHIRAISHI, Shuichiro SAIGAN
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Publication number: 20190287838Abstract: According to the embodiment, the first invention relates to an electrostatic chuck. The electrostatic chuck includes a ceramic dielectric substrate having a first major surface placing a suction object and a second major surface on an opposite side to the first major surface, a base plate supporting the ceramic dielectric substrate and including a gas introduction path, and a first porous part provided at a position between the base plate and the first major surface and being opposite to the gas introduction path. The first porous part includes sparse portions including pores and a dense portion having a density higher than a density of the sparse portions. Each of the sparse portions extends from the base plate toward the ceramic dielectric substrate. The dense portion is positioned between the sparse portions. The sparse portions include a wall portion provided between the pores and the pores.Type: ApplicationFiled: March 13, 2019Publication date: September 19, 2019Inventors: Kosuke YAMAGUCHI, Jun SHIRAISHI, Ikuo ITAKURA, Yutaka MOMIYAMA, Shuichiro SAIGAN