Abstract: An electronic component includes: an insulator part (10) of rectangular solid shape; a coil element (32) provided inside the insulator part (10); bottom electrodes (40) provided on a bottom face (14) of the insulator part (10) and electrically connected to the coil element (32); a plating layer (62) provided in a manner overlapping each bottom electrode (40) so that its end (64) on the bottom face (14) is away from the end (42) of the bottom electrode (40); a plating layer (60) which is arranged between the bottom electrode (40) and the plating layer (62) and overlaps the bottom electrode (40), and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer (62); and an insulation layer (70) provided on the bottom face (14) in a manner covering the end (42) of the bottom electrode (40).

Abstract: An electronic component includes: an insulator part (10) of rectangular solid shape; a coil element (32) provided inside the insulator part (10); bottom electrodes (40) provided on a bottom face (14) of the insulator part (10) and electrically connected to the coil element (32); a plating layer (62) provided in a manner overlapping each bottom electrode (40) so that its end (64) on the bottom face (14) is away from the end (42) of the bottom electrode (40); a plating layer (60) which is arranged between the bottom electrode (40) and the plating layer (62) and overlaps the bottom electrode (40), and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer (62); and an insulation layer (70) provided on the bottom face (14) in a manner covering the end (42) of the bottom electrode (40).

Abstract: In an embodiment, an electronic component includes: an insulator part 10 of rectangular solid shape; a coil element 32 provided inside the insulator part 10; bottom electrodes 40 provided on a bottom face 14 of the insulator part 10 and electrically connected to the coil element 32; a plating layer 62 provided in a manner overlapping each bottom electrode 40 so that its end 64 on the bottom face 14 is away from the end 42 of the bottom electrode 40; and a plating layer 60 which is arranged between the bottom electrode 40 and the plating layer 62 and overlaps the bottom electrode 40, and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer 62. The electronic component can suppress generation of cracking in the insulator part.

Abstract: One object of the present invention is to enable identification of the direction of an electronic component, while suppressing increase in cost. The present invention provides an electronic component comprising: an insulator portion having a plurality of surfaces (e.g., a top surface, a bottom surface, end surfaces, and side surfaces), the insulator portion including a plurality of regions having different transmissivities of a light beam entering one of the plurality of surfaces (e.g., a top surface, a bottom surface, end surfaces, and side surfaces); an internal conductor portion provided in the insulator portion; and external electrodes provided on the insulator portion and electrically connected to the internal conductor portion.

Abstract: In an embodiment, an electronic component includes: an insulator part 10 of rectangular solid shape; a coil element 32 provided inside the insulator part 10; bottom electrodes 40 provided on a bottom face 14 of the insulator part 10 and electrically connected to the coil element 32; a plating layer 62 provided in a manner overlapping each bottom electrode 40 so that its end 64 on the bottom face 14 is away from the end 42 of the bottom electrode 40; and a plating layer 60 which is arranged between the bottom electrode 40 and the plating layer 62 and overlaps the bottom electrode 40, and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer 62. The electronic component can suppress generation of cracking in the insulator part.

Abstract: One object of the present invention is to enable identification of the direction of an electronic component, while suppressing increase in cost. The present invention provides an electronic component comprising: an insulator portion having a plurality of surfaces (e.g., a top surface, a bottom surface, end surfaces, and side surfaces), the insulator portion including a plurality of regions having different transmissivities of a light beam entering one of the plurality of surfaces (e.g., a top surface, a bottom surface, end surfaces, and side surfaces); an internal conductor portion provided in the insulator portion; and external electrodes provided on the insulator portion and electrically connected to the internal conductor portion.

Abstract: A device includes: a pillar-shaped core consisting of a first magnetic insulating material that has two quadric prism segments at both ends thereof symmetrically and has a cylindrical segment, which has an external shape smaller than that of the quadric prism segments, coaxially between the two quadric prism segments; a resistance film that is formed in a substantially uniform thickness so as to cover an outer circumferential face of the pillar-shaped core; a spiral line segment having a predetermined number of circumferences that is formed in a portion present on the cylindrical segment of the resistance film by subjecting a spiral sulcus to laser trimming; an oxide film that is formed to cover at least a surface of a shoulder portion extending from a side to an upper surface of lines constituting the spiral line segment; an armor consisting of a second magnetic insulating material that is formed to cover a surface of the portion present on the cylindrical segment of the resistance film and such that an exte

Abstract: A device includes: a pillar-shaped core consisting of a first magnetic insulating material that has two quadric prism segments at both ends thereof symmetrically and has a cylindrical segment, which has an external shape smaller than that of the quadric prism segments, coaxially between the two quadric prism segments; a conductor film that is formed in a substantially uniform thickness so as to cover an outer circumferential face of the pillar-shaped core; a spiral line segment having a predetermined number of circumferences that is formed in a portion present on the cylindrical segment of the conductor film by subjecting a spiral sulcus to laser trimming; an oxide film that is formed to cover at least a surface of a shoulder portion extending from a side to an upper surface of lines constituting the spiral line segment; an armor consisting of a second magnetic insulating material that is formed to cover a surface of the portion present on the cylindrical segment of the conductor film and such that an externa

Abstract: A device includes: a pillar-shaped core consisting of a first magnetic insulating material that has two quadric prism segments at both ends thereof symmetrically and has a cylindrical segment, which has an external shape smaller than that of the quadric prism segments, coaxially between the two quadric prism segments; a resistance film that is formed in a substantially uniform thickness so as to cover an outer circumferential face of the pillar-shaped core; a spiral line segment having a predetermined number of circumferences that is formed in a portion present on the cylindrical segment of the resistance film by subjecting a spiral sulcus to laser trimming; an oxide film that is formed to cover at least a surface of a shoulder portion extending from a side to an upper surface of lines constituting the spiral line segment; an armor consisting of a second magnetic insulating material that is formed to cover a surface of the portion present on the cylindrical segment of the resistance film and such that an exte

Abstract: A device includes: a pillar-shaped core consisting of a first magnetic insulating material that has two quadric prism segments at both ends thereof symmetrically and has a cylindrical segment, which has an external shape smaller than that of the quadric prism segments, coaxially between the two quadric prism segments; a conductor film that is formed in a substantially uniform thickness so as to cover an outer circumferential face of the pillar-shaped core; a spiral line segment having a predetermined number of circumferences that is formed in a portion present on the cylindrical segment of the conductor film by subjecting a spiral sulcus to laser trimming; an oxide film that is formed to cover at least a surface of a shoulder portion extending from a side to an upper surface of lines constituting the spiral line segment; an armor consisting of a second magnetic insulating material that is formed to cover a surface of the portion present on the cylindrical segment of the conductor film and such that an externa

Abstract: A chip component is manufactured through a step of burning a unburned unit element made of ceramics having prism-shaped parts at its ends, a step of polishing the edges of the burned unit element, and a step of forming a resistor conductor, an electrode conductor and a armor on the polished unit element.

Abstract: A chip component is manufactured through a step of burning a unburned unit element made of ceramics having prism-shaped parts at its ends, a step of polishing the edges of the burned unit element, and a step of forming a resistor conductor, an electrode conductor and a armor on the polished unit element.