Patents by Inventor Ikuo Kamada
Ikuo Kamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8010224Abstract: A plasma cutting device performs cutting in a plurality of stages. In a first cutting sub-process, a manufactured product is cut out from a base material upon a stage according to an NC program. Next, images of respective regions in the vicinities of proper positions at two corner points of the manufactured product which has been cut out are photographed by an image sensor, the actual positions of these two corner points of the manufactured product are detected from these images which have been photographed, and the translation distances and the rotational angle between the actual positions which have been detected and the proper positions are calculated. The NC program is corrected. And, in a subsequent cutting sub-process, additional cutting for beveling is carried out upon cutting surfaces at the outer circumference of the manufactured product, according to the corrected NC program.Type: GrantFiled: October 27, 2006Date of Patent: August 30, 2011Assignee: Komatsu Industries CorporationInventors: Yoshihiro Yamaguchi, Ikuo Kamada, Takahiro Iriyama
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Patent number: 7960669Abstract: A hybrid thermal cutting apparatus has both a laser head and a plasma torch, both of which can be controlled independently, can perform both laser processing and plasma processing, thus reducing the running costs. A large number of cutting lines for cutting out various types of manufactured products from plate materials are classified into a laser cutting type and a plasma cutting type, according to the cutting length, whether they are the external periphery of manufactured products or apertures, the size of the manufactured products or the apertures, the required process accuracy, the plate thickness, or the like. The lines of the laser cutting type are cut by laser processing, while the lines of the plasma cutting type are cut by plasma processing.Type: GrantFiled: June 20, 2005Date of Patent: June 14, 2011Assignee: Komatsu Industries CorporationInventors: Yoshihiro Yamaguchi, Tetsuya Kabata, Ikuo Kamada
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Publication number: 20090250445Abstract: A plasma cutting device performs cutting in a plurality of stages. In a first cutting sub-process, a manufactured product is cut out from a base material upon a stage according to an NC program. Next, images of respective regions in the vicinities of proper positions at two corner points of the manufactured product which has been cut out are photographed by an image sensor, the actual positions of these two corner points of the manufactured product are detected from these images which have been photographed, and the translation distances and the rotational angle between the actual positions which have been detected and the proper positions are calculated. The NC program is corrected. And, in a subsequent cutting sub-process, additional cutting for beveling is carried out upon cutting surfaces at the outer circumference of the manufactured product, according to the corrected NC program.Type: ApplicationFiled: October 27, 2006Publication date: October 8, 2009Applicant: Kotmatsu Industries CorporationInventors: Yoshihiro Yamaguchi, Ikuo Kamada, Takahiro Iriyama
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Publication number: 20070241083Abstract: A hybrid thermal cutting apparatus has both a laser head and a plasma torch, both of which can be controlled independently, can perform both laser processing and plasma processing, thus reducing the running costs. A large number of cutting lines for cutting out various types of manufactured products from plate materials are classified into a laser cutting type and a plasma cutting type, according to the cutting length, whether they are the external periphery of manufactured products or apertures, the size of the manufactured products or the apertures, the required process accuracy, the plate thickness, or the like. The lines of the laser cutting type are cut by laser processing, while the lines of the plasma cutting type are cut by plasma processing.Type: ApplicationFiled: June 20, 2005Publication date: October 18, 2007Applicant: KOMATSU INDUSTRIES CORPORATIONInventors: Yoshihiro Yamaguchi, Tetsuya Kabata, Ikuo Kamada
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Patent number: 5913760Abstract: A punch press comprising (i) a tool set magazine that is located above a work table for supporting a workpiece and is juxtaposed with a main frame for supporting a punching head and (ii) a tool set delivery system for delivering tool sets between the tool set magazine and the punching head.Type: GrantFiled: July 15, 1997Date of Patent: June 22, 1999Assignee: Komatsu Ltd.Inventors: Ikuo Kamada, Satoshi Matsuura, Takiji Kitagawa
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Patent number: 5913761Abstract: A punch press comprising (i) a tool set magazine that is located above a work table for supporting a workpiece and is juxtaposed with a main frame for supporting a punching head and (ii) a tool set delivery system for delivering tool sets between the tool set magazine and the punching head.Type: GrantFiled: December 18, 1995Date of Patent: June 22, 1999Assignee: Komatsu Ltd.Inventors: Ikuo Kamada, Satoshi Matsuura, Takiji Kitagawa
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Patent number: 5595560Abstract: For die arrangement, bar code tags which correspond to identification numbers given to a punch and die to be attached to a punch press are read by a bar code reader, and die information on the punch and die as well as die assembly information on a die assembly in which the punch and die are paired for pressing operation are stored in a non-volatile memory. In connection with the die assembly information, the address of the die assembly stocked in the punch press is stored. When starting pressing operation, the die assembly is fetched according to the die assembly information to perform die replacement.Type: GrantFiled: June 6, 1995Date of Patent: January 21, 1997Assignee: Kabushiki Kaisha Komatsu SeisakushoInventor: Ikuo Kamada
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Patent number: 5531087Abstract: A metal sheet bending machine for bending a metal sheet inserted between an upper bender and lower bender to a desired angle. While the metal sheet is being bent to the desired angle, a linear image of projected measuring light, which rotates with a change in the bending angle of the metal sheet, is formed by a measuring light source on an outer face of the bent metal sheet and sequentially photographed and stored. Based on the stored images, the bending angle of the metal sheet is calculated. Based on the result of the calculation, the positions of tile upper and/or lower benders are controlled whereby the metal sheet can be bent to the desired angle.Type: GrantFiled: August 18, 1994Date of Patent: July 2, 1996Assignee: Kabushiki Kaisha Komatsu SeisakushoInventors: Hiroyuki Kitabayashi, Yoshiaki Kuroda, Ikuo Kamada, Toshiyuki Ooenoki
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Patent number: 5367902Abstract: A metal sheet bending machine for bending a metal sheet inserted between an upper bender and lower bender to a desired angle. While the metal sheet is being bent to the desired angle, a linear image of projected measuring light, which rotates with a change in time bending angle of the metal sheet, is formed by a measuring light source on an outer face of the bent metal sheet and sequentially photographed and stored. Based on the stored images, the bending angle of the metal sheet is calculated. Based on the result of the calculation, the positions of the upper and/or lower benders are controlled whereby the metal sheet can be bent to the desired angle.Type: GrantFiled: April 5, 1993Date of Patent: November 29, 1994Assignee: Komatsu Ltd.Inventors: Hiroyuki Kitabayashi, Yoshiaki Kuroda, Ikuo Kamada