Patents by Inventor Ikuo Katsurada

Ikuo Katsurada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6607381
    Abstract: An auxiliary heat-insulating jig is provided between a wafer boat and a heat-insulating jig. The auxiliary heat-insulating jig comprises a plurality of vertically arranged plate insulators. The plate insulators are made of opaque quartz. Thus, an auxiliary heat-insulating jig necessary for modifying a high-speed temperature-control heat treatment apparatus of an intermediate temperature specification to a high-speed temperature-control heat treatment apparatus of a high-temperature specification is provided.
    Type: Grant
    Filed: January 24, 2002
    Date of Patent: August 19, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masashi Minami, Ikuo Katsurada
  • Publication number: 20020172908
    Abstract: An auxiliary heat-insulating jig is provided between a wafer boat and a heat-insulating jig. The auxiliary heat-insulating jig comprises a plurality of vertically arranged plate insulators. The plate insulators are made of opaque quartz. Thus, an auxiliary heat-insulating jig necessary for modifying a high-speed temperature-control heat treatment apparatus of an intermediate temperature specification to a high-speed temperature-control heat treatment apparatus of a high-temperature specification is provided.
    Type: Application
    Filed: January 24, 2002
    Publication date: November 21, 2002
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masashi Minami, Ikuo Katsurada
  • Publication number: 20020121242
    Abstract: A plurality of jetting outlets having a jetting outlet shape of a Vincent Bach curve are disposed in a jetting part of a heat-treatment apparatus. An oxygen pipe, an air pipe, and an argon pipe are connected to the jetting part. A wafer supplied into a reaction tube is warmed and subjected to a heat treatment at a predetermined temperature. Thereafter, in cooling the wafer, a cooling gas containing oxygen is introduced from the jetting part into the reaction tube after the wafer is cooled to a predetermined temperature, whereby the wafer is further cooled. This restrains exfoliation of the film formed on the wafer.
    Type: Application
    Filed: October 24, 2001
    Publication date: September 5, 2002
    Applicant: Mitsubishi Denki Kabushiki Kaisha and Ohmiya Corporation
    Inventors: Masashi Minami, Ikuo Katsurada
  • Publication number: 20020113027
    Abstract: There is provided a retainer for use in heat treatment of a substrate which enables an increase in the accuracy of flatness of support sections for supporting a substrate. The retainer includes silicon wafer support sections for supporting a plurality of substrates by means of surface contact, and spacers for defining intervals of the silicon wafer support sections with respect to a vertical direction. Since the support sections and the spacers can be manufactured separately from each other, the accuracy of flatness of the support sections and intervals between the support sections with respect to the vertical direction are determined by the accuracy of individual support sections and spacers. So long as initial accuracy of support sections and that of spacers are maintained, a high-precision retainer can be obtained.
    Type: Application
    Filed: February 8, 2002
    Publication date: August 22, 2002
    Applicant: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Masashi Minami, Ikuo Katsurada