Abstract: The invention provides a mounting construction in which an electronic component is mounted on a flexible substrate. The mounting construction comprises a flexible substrate including a flexible sheet, bendable electrode pattern forming portions formed on the flexible sheet, and electrode patterns formed on the electrode pattern forming portions, an electronic component having electrode portions, and a clamping member having clamping pieces for clamping the electronic component therebetween. The electrode pattern forming portions are deflected, so as to cause the electrode patterns to be contacted with the electrode portions of the electronic component placed on the flexible substrate. By this, the electronic component is clamped by the clamping pieces of the clamping member through the deflected electrode pattern forming portions. Thus, the electronic component may be easily and positively secured to the flexible substrate, without employing additional reinforcing means such as adhesives.