Patents by Inventor Ikuo Sunaka

Ikuo Sunaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096654
    Abstract: A substrate processing method includes: increasing a temperature of a substrate by heating the substrate; after the increasing the temperature of the substrate, forming a liquid film of a pre-wetting liquid on a first surface of the substrate by supplying the pre-wetting liquid to the first surface of the substrate while heating and rotating the substrate at a first rotational speed; after the forming the liquid film, processing the first surface of the substrate with a chemical liquid by supplying the chemical liquid to the first surface of the substrate while heating and rotating the substrate at a second rotational speed that is lower than the second rotational speed; and after the processing the first surface of the substrate, decreasing the temperature of the substrate.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 21, 2024
    Inventors: Fumihiro KAMIMURA, Masatoshi KASAHARA, Teruomi MINAMI, Ikuo SUNAKA
  • Patent number: 11869777
    Abstract: A substrate processing method includes: increasing a temperature of a substrate by heating the substrate; after the increasing the temperature of the substrate, forming a liquid film of a pre-wetting liquid on a first surface of the substrate by supplying the pre-wetting liquid to the first surface of the substrate while heating and rotating the substrate at a first rotational speed; after the forming the liquid film, processing the first surface of the substrate with a chemical liquid by supplying the chemical liquid to the first surface of the substrate while heating and rotating the substrate at a second rotational speed that is lower than the second rotational speed; and after the processing the first surface of the substrate, decreasing the temperature of the substrate.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: January 9, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Fumihiro Kamimura, Masatoshi Kasahara, Teruomi Minami, Ikuo Sunaka
  • Patent number: 11094568
    Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: August 17, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kenji Nakamizo, Satoshi Morita, Akinori Tanaka, Hiroshi Komiya, Mikio Nakashima, Kousuke Fukuda, Youichi Masaki, Ryoji Ando, Ikuo Sunaka
  • Publication number: 20210098271
    Abstract: A substrate processing method includes: increasing a temperature of a substrate by heating the substrate; after the increasing the temperature of the substrate, forming a liquid film of a pre-wetting liquid on a first surface of the substrate by supplying the pre-wetting liquid to the first surface of the substrate while heating and rotating the substrate at a first rotational speed; after the forming the liquid film, processing the first surface of the substrate with a chemical liquid by supplying the chemical liquid to the first surface of the substrate while heating and rotating the substrate at a second rotational speed that is lower than the second rotational speed; and after the processing the first surface of the substrate, decreasing the temperature of the substrate.
    Type: Application
    Filed: September 24, 2020
    Publication date: April 1, 2021
    Inventors: Fumihiro KAMIMURA, Masatoshi KASAHARA, Teruomi MINAMI, Ikuo SUNAKA
  • Patent number: 10128138
    Abstract: A substrate transfer method is provided. The substrate transfer method comprises: loading the transfer container to a load port, and separating the cover body from the container main body; detecting an accommodation status of the substrate in the container main body by a detection unit; correcting, by a correction device, the accommodation status of the substrate in the container main body in which the accommodation status of the substrate detected by the detection unit is abnormal; and allowing a substrate transfer device to enter the container main body in which the accommodation status of the substrate is corrected, and unloading the substrate from the container main body.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: November 13, 2018
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Katsuhiro Morikawa, Ikuo Sunaka, Seiji Nakano, Kazunori Kuratomi, Toshio Shimazu
  • Publication number: 20180308730
    Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.
    Type: Application
    Filed: April 24, 2018
    Publication date: October 25, 2018
    Inventors: Kenji NAKAMIZO, Satoshi MORITA, Akinori TANAKA, Hiroshi KOMIYA, Mikio NAKASHIMA, Kousuke FUKUDA, Youichi MASAKI, Ryoji ANDO, Ikuo SUNAKA
  • Patent number: 10067514
    Abstract: A substrate processing apparatus includes a mixing tank, a first opening/closing valve, a second opening/closing valve, a first flow rate measuring unit, a second flow rate measuring unit, a control unit, and a substrate processing unit. A first liquid and a second liquid are mixed such that the second liquid is mixed in an amount more than that of the first liquid. The first and second opening/closing valves open/close a first flow path and a second flow path, respectively. The first and second flow rate measuring units measure flow rates of the first and second liquids flowing through the first and second flow paths, respectively. The control unit controls opening/closing of the first opening/closing valve and the second opening/closing valve. The substrate processing unit processes a substrate by supplying a mixed liquid of the first and second liquids to the substrate.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: September 4, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Yasuo Kiyohara, Ikuo Sunaka, Koji Tanaka, Takami Satoh, Kazuyoshi Mizumoto, Takashi Uno, Hirotaka Maruyama, Hidetomo Uemukai, Tomiyasu Maezono
  • Patent number: 9773690
    Abstract: A substrate processing apparatus includes: a load port into and out of which the transport container is carried; and an apparatus controller that controls operations in the load port. The apparatus controller includes a storage unit that stores transition data of parameter values sent from outside based on a transport container identification code. The transition data of the parameter values each comprises a usage count of the transport container and a corresponding parameter value that quantifies a result of at least one of an operation performed to remove the lid after the transport container is carried into the load port and an operation performed to carry the container out of the load port.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: September 26, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Katsuhiro Morikawa, Ikuo Sunaka, Suguru Enokida
  • Patent number: 9696262
    Abstract: A substrate processing apparatus includes: a load port into which the transport container is carried; a detecting unit that detects storage condition of the substrates which are contained in the transport container, which has been carried into the load port and the lid of which has been removed; a processing unit that processes the substrates removed from the transport container having been carried into the load port; and a control unit.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: July 4, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Katsuhiro Morikawa, Ikuo Sunaka
  • Publication number: 20170178935
    Abstract: A substrate transfer method is provided. The substrate transfer method comprises: loading the transfer container to a load port, and separating the cover body from the container main body; detecting an accommodation status of the substrate in the container main body by a detection unit; correcting, by a correction device, the accommodation status of the substrate in the container main body in which the accommodation status of the substrate detected by the detection unit is abnormal; and allowing a substrate transfer device to enter the container main body in which the accommodation status of the substrate is corrected, and unloading the substrate from the container main body.
    Type: Application
    Filed: March 3, 2017
    Publication date: June 22, 2017
    Inventors: Katsuhiro Morikawa, Ikuo Sunaka, Seiji Nakano, Kazunori Kuratomi, Toshio Shimazu
  • Patent number: 9627238
    Abstract: A substrate transfer apparatus unloads a substrate from a transfer container in which a cover body airtightly closes a substrate unloading opening formed at a front surface of a container main body and multiple substrates are accommodated in the form of shelves. The substrate transfer apparatus includes a load port to which the transfer container is loaded; a detection unit configured to detect an accommodation status of the substrate in the container main body that is loaded to the load port and separated from the cover body; a substrate transfer device configured to enter the container main body and unload the substrate; and a correction device configured to correct the accommodation status of the substrate in the container main body before the substrate is unloaded from the container main body by the substrate transfer device when the detection unit detects abnormality in the accommodation status.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: April 18, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Katsuhiro Morikawa, Ikuo Sunaka, Seiji Nakano, Kazunori Kuratomi, Toshio Shimazu
  • Publication number: 20160172225
    Abstract: A substrate processing apparatus includes: a load port into and out of which the transport container is carried; and an apparatus controller that controls operations in the load port. The apparatus controller includes a storage unit that stores transition data of parameter values sent from outside based on a transport container identification code. The transition data of the parameter values each comprises a usage count of the transport container and a corresponding parameter value that quantifies a result of at least one of an operation performed to remove the lid after the transport container is carried into the load port and an operation performed to carry the container out of the load port.
    Type: Application
    Filed: December 10, 2013
    Publication date: June 16, 2016
    Inventors: Katsuhiro MORIKAWA, Ikuo SUNAKA, Suguru ENOKIDA
  • Publication number: 20150300960
    Abstract: A substrate processing apparatus includes: a load port into which the transport container is carried; a detecting unit that detects storage condition of the substrates which are contained in the transport container, which has been carried into the load port and the lid of which has been removed; a processing unit that processes the substrates removed from the transport container having been carried into the load port; and a control unit.
    Type: Application
    Filed: December 5, 2013
    Publication date: October 22, 2015
    Inventors: Katsuhiro MORIKAWA, Ikuo SUNAKA
  • Publication number: 20150146498
    Abstract: A substrate processing apparatus includes a mixing tank, a first opening/closing valve, a second opening/closing valve, a first flow rate measuring unit, a second flow rate measuring unit, a control unit, and a substrate processing unit. A first liquid and a second liquid are mixed such that the second liquid is mixed in an amount more than that of the first liquid. The first and second opening/closing valves open/close a first flow path and a second flow path, respectively. The first and second flow rate measuring units measure flow rates of the first and second liquids flowing through the first and second flow paths, respectively. The control unit controls opening/closing of the first opening/closing valve and the second opening/closing valve. The substrate processing unit processes a substrate by supplying a mixed liquid of the first and second liquids to the substrate.
    Type: Application
    Filed: November 18, 2014
    Publication date: May 28, 2015
    Inventors: Yasuo Kiyohara, Ikuo Sunaka, Koji Tanaka, Takami Satoh, Kazuyoshi Mizumoto, Takashi Uno, Hirotaka Maruyama, Hidetomo Uemukai, Tomiyasu Maezono
  • Publication number: 20140178162
    Abstract: A substrate transfer apparatus unloads a substrate from a transfer container in which a cover body airtightly closes a substrate unloading opening formed at a front surface of a container main body and multiple substrates are accommodated in the form of shelves. The substrate transfer apparatus includes a load port to which the transfer container is loaded; a detection unit configured to detect an accommodation status of the substrate in the container main body that is loaded to the load port and separated from the cover body; a substrate transfer device configured to enter the container main body and unload the substrate; and a correction device configured to correct the accommodation status of the substrate in the container main body before the substrate is unloaded from the container main body by the substrate transfer device when the detection unit detects abnormality in the accommodation status.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 26, 2014
    Applicant: Tokyo Electron Limited
    Inventors: Katsuhiro Morikawa, Ikuo Sunaka, Seiji Nakano, Kazunori Kuratomi, Toshio Shimazu
  • Patent number: 8707893
    Abstract: A substrate treatment system includes a plurality of treatment apparatuses, a position adjustment apparatus adjusting a center position of the substrate, a substrate transfer apparatus transferring the substrate to the treatment apparatuses and the position adjustment apparatus, and a control unit controlling operations of the apparatuses. The substrate transfer apparatus includes an arm part curved along a peripheral edge portion of the substrate with a radius of curvature larger than a radius of the substrate, and a holding part projecting inward from the arm part and holding a rear surface of the substrate. The position adjustment apparatus includes a mounting table which holds a central portion of the rear surface of the substrate and is rotatable and horizontally movable. The control unit controls the mounting table such that the center position of the substrate held on the mounting table is aligned with a center position of the arm part.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: April 29, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Masatoshi Deguchi, Hideo Funakoshi, Toshichika Takei, Norifumi Sato, Wataru Kiyota, Daisuke Ishimaru, Shinichi Machidori, Ikuo Sunaka, Shigenori Kamei
  • Publication number: 20120135148
    Abstract: A substrate treatment system includes a plurality of treatment apparatuses, a position adjustment apparatus adjusting a center position of the substrate, a substrate transfer apparatus transferring the substrate to the treatment apparatuses and the position adjustment apparatus, and a control unit controlling operations of the apparatuses. The substrate transfer apparatus includes an arm part curved along a peripheral edge portion of the substrate with a radius of curvature larger than a radius of the substrate, and a holding part projecting inward from the arm part and holding a rear surface of the substrate. The position adjustment apparatus includes a mounting table which holds a central portion of the rear surface of the substrate and is rotatable and horizontally movable. The control unit controls the mounting table such that the center position of the substrate held on the mounting table is aligned with a center position of the arm part.
    Type: Application
    Filed: November 18, 2011
    Publication date: May 31, 2012
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Masatoshi Deguchi, Hideo Funakoshi, Toshichika Takei, Norifumi Sato, Wataru Kiyota, Daisuke Ishimaru, Shinichi Machidori, Ikuo Sunaka, Shigenori Kamei