Abstract: A power supply control method of a production system including a first unit and a second unit includes: starting power supply for operation of the second unit in accordance with a signal acquired according to an operation status of the first unit (S41); starting the operation by the second unit after the start of the power supply (S44); acquiring stop time information indicating time from when the operation ends to when a next operation of the second unit starts (S22); determining, based on the acquired stop time information, whether or not to stop the power supply after the started operation ends (S24); and stopping the power supply when it is determined to stop the power supply (S48).

Abstract: A power supply control method of a production system including a first unit and a second unit includes: starting power supply for operation of the second unit in accordance with a signal acquired according to an operation status of the first unit (S41); starting the operation by the second unit after the start of the power supply (S44); acquiring stop time information indicating time from when the operation ends to when a next operation of the second unit starts (S22); determining, based on the acquired stop time information, whether or not to stop the power supply after the started operation ends (S24); and stopping the power supply when it is determined to stop the power supply (S48).

Abstract: An anticorrosive pigment composition containing neither any heavy metal harmful to the environment nor zinc, which may be harmful to the environment. The composition is a product of the reaction of (a) aluminum dihydrogen tripolyphosphate, (b) a calcium compound selected among oxides, hydroxides, and carbonates, and (c) a magnesium compound selected among oxides, hydroxides, and carbonates. The composition exerts no adverse influence on the storage stability of water-based anticorrosive coating materials.

Abstract: To provide a component mounting order optimizing method and a component mounting order optimizing apparatus by which it is easy to change a preparatory plan and it is possible to shorten time necessary for a change of substrates to be produced. An optimization program storage section 16 has a placement list preparing section 17 which obtains component placement data to be obtainable by a component information reading device 5 reading identification information of a component cassette, and prepares a component placement list in which identification information of component cassettes and positions which are loaded in a component supply section were associated, and a mounting order deciding section 18 which decides mounting order of components in such a state that an array of the component cassettes is fixed, on the basis of the component placement list.

Abstract: An anticorrosive pigment composition containing neither any heavy metal harmful to the environment nor zinc, which may be harmful to the environment. The composition is a product of the reaction of (a) aluminum dihydrogen tripolyphosphate, (b) a calcium compound selected among oxides, hydroxides, and carbonates, and (c) a magnesium compound selected among oxides, hydroxides, and carbonates. The composition exerts no adverse influence on the storage stability of water-based anticorrosive coating materials.

Abstract: To provide a line balance control method, a line balance control apparatus, and a component mounting machine, which do not require a higher-level device. A production line 100 is equipped with a printing machine 120, a coating machine 130, a component mounting machine 101, a component mounting machine 102, and a reflow machine 140, and they are connected through a communication line 110, respectively.

Abstract: A method of optimizing an order of component mounting which includes optimizing an order of component mounting for any one pattern among the plurality of patterns, calculating a quotient and a remainder by dividing the total number of the patterns included in the board by the number of mounters, determining the quotient as the number of patterns to be allocated in a case where the remainder is zero. The optimization method also includes determining a number, which is the quotient plus one, as the number of patterns to be allocated to the same number of the mounters as the remainder, starting from the mounter in a process farthest upstream, determining the quotient as the number of patterns to be allocated to the rest of the mounters, in the case where the remainder is one or greater, and allocating the allocated number of patterns, to each of the mounters.

Abstract: A component verification method for a mounter (100) that is capable of performing component verification with less labor. The method includes a position specification step (S12A) of specifying a placement position in the mounter (100) where a component tape is placed; a read step (S13) of reading component information from an IC tag (426b) that is attached to the component tape or a reel (426); and a verification step (S14) of verifying the component information and the placement position against component arrangement data that indicates components that should be mounted onto the board as well a position where the component tape should be placed.

Abstract: A server stores original data without a water-mark. When a user at a terminal apparatus connected with the server requests the server to display the original data on a display of the terminal apparatus, the server transforms the original data into an image data. Then the server adds a water-mark to the image data and transmits the image data with the water-mark to the terminal apparatus.

Abstract: To provide a component mounting order optimizing method and a component mounting order optimizing apparatus by which it is easy to change a preparatory plan and it is possible to shorten time necessary for a change of substrates to be produced. An optimization program storage section 16 has a placement list preparing section 17 which obtains component placement data to be obtainable by a component information reading device 5 reading identification information of a component cassette, and prepares a component placement list in which identification information of component cassettes and positions which are loaded in a component supply section were associated, and a mounting order deciding section 18 which decides mounting order of components in such a state that an array of the component cassettes is fixed, on the basis of the component placement list.

Abstract: To provide a line balance control method, a line balance control apparatus, and a component mounting machine, which do not require a higher-level device. A production line 100 is equipped with a printing machine 120, a coating machine 130, a component mounting machine 101, a component mounting machine 102, and a reflow machine 140, and they are connected through a communication line 110, respectively.

Abstract: An optimizing apparatus for optimizing a mounter equipped with a line gang pickup head which picks up a plurality of components and mounts them on a board. The apparatus includes a nozzle set determination unit for determining a nozzle set which reduces a mounting time in view of a number of times interchanging pickup nozzles and a total task number necessary for mounting the plural components, a nozzle pattern determination unit for determining an optimal nozzle pattern as well as an arrangement of pickup nozzles (nozzle arrangement) at a nozzle station, based on the nozzle set determined by the nozzle set determination unit, and Z-axis arrangement/mounting order optimization unit for determining an array order of component feeders and a mounting order of components while maintaining the determined nozzle set and nozzle pattern.

Abstract: In a semiconductor device adapted to be mounted on a board and to be electrically connected to the board, comprising, at least two semiconductor electric chips, and a substrate on which the semiconductor electric chips are mounted and to which the semiconductor electric chips are electrically connected, in such a manner that the semiconductor electric chips are mounted on and electrically connected to the board through the substrate, according to the present invention, a thickness of each of the semiconductor electric chips in a direction in which the each of the semiconductor electric chips and the substrate are stacked is smaller than a thickness of the substrate in the direction.

Abstract: Relevant document data are retrieved from a document management server that stores document data in accordance with a user operation at a document management client. A content of the document data is shown to the user at the document management client so that the user can provide an instruction whether to execute an alteration prevention by an operation of the user. When an instruction to execute an alteration prevention is provided, alteration prevention processing is executed at the document management server.

Abstract: Provided is an electronic document management system which sorts out and stores electronic documents automatically. The electronic document management system displays the management names on a console panel of an image scanner, which are associated with document management information and pre-stored in an electronic document management server. When a user selects a given management name, an electronic document is processed in accordance with the management method associated with the selected management name. This allows electronic documents to be sorted out and stored automatically in accordance with the management method desired by a user, without the necessity of using any identification document.

Abstract: An optimization apparatus capable of efficiently placing an electronic component. An optimization unit (203) determines a first assignment to the placement apparatus and calculates a first placement time required for placing all the electronic components assigned to the placement apparatus by the first assignment onto a circuit board by the placement apparatus. The optimization unit selects two placement apparatuses among a plurality of placement apparatuses, selects a type of an electronic component assigned for the selected placement apparatus, determines a second assignment by interchanging two selected times assigned, calculates a second placement time required for placing all the electronic components assigned to the placement apparatus by the second assignment onto the circuit board by the placement apparatus, and employs the one of the first assignment and the second assignment which has a smaller placement time.

Abstract: A distribution server distributes over a network, menu information that contains information for executing a job using a multifunction apparatus and information for identifying the job. The distribution server sets at least a portion of the information for executing the job using the multifunction apparatus as additional information added later to the menu information, and adds an input instruction to the menu information for executing additional information input using the multifunction apparatus. The multifunction apparatus that obtains the menu temporarily determines a portion of a fixed job for execution.

Abstract: A distribution server and includes a communicator that communicates with multifunction apparatuses via a network a menu generator that generates menu information based on information obtained by the communicator, the information including display capability information and job capability information for each multifunction apparatus. The menu information includes information for execution of a job and a menu name assigned for the job. A data memory stores the generated menu information and a distributor retrieves, from the data memory, menu information requested by the multifunction apparatus and distributes, via the network, the menu information to the requesting multifunction apparatus.

Abstract: A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an outer contour of a desired semiconductor chip, holding the semiconductor wafer by a wafer holding mechanism, grinding a back surface of the semiconductor wafer held by the wafer holding mechanism, detecting opening of a bottom face of the groove during the back surface grinding process to determine timing for finishing the back surface grinding. The opening of the groove can be detected by means of a light sensor for detecting light passing through the groove or a microwave sensor for detecting a microwave passing through the groove. In addition, it is possible to suck air inside the groove so as to detect the opening of the groove by a pressure rise in the air inside the groove.

Abstract: A method for identifying apparatuses to be recalled that enables identifying the locations of the products to be recalled, the method including: collecting steps (S2 and S4) of collecting the information items stored in IC tags from the apparatuses with the IC tag via a communication network, a checking step (S6) of checking the information items collected in the collecting step with the information items related to the apparatuses to be recalled, and an identifying step (S8) of identifying the apparatuses to be recalled in the apparatuses with the IC tag based on the checking results.