Abstract: Provided is a copper alloy plate that is for an FPC substrate and that has superior heat dissipation, repeated bending workability, shape retaining properties, and heat resistance. The copper alloy plate contains at least 0.01 mass % of the total of at least one element selected from the group consisting of Ag, Cr, Fe, In, Ni, P, Si, Sn, Ti, Zn, and Zr, contains no more than 1.0 mass % of Ag, no more than 0.08 mass % of Ti, no more than 2.0 mass % of Ni, no more than 3.5 mass % of Zn, and no more than 0.5 mass % of Cr, Fe, In, P, Si, Sn, and Zr by the total of the at least one element selected from the group, the remainder comprising Cu and impurities, has a conductivity of at least 60% IACS, has a tensile strength of at least 350 MPa, and has I(311)/IO(311) determined by X-ray diffraction in the thickness direction of the plate surface that satisfies the formula I(311)/IO(311)?0.5.

Abstract: Provided is a copper alloy plate that is for an FPC substrate and that has superior heat dissipation, repeated bending workability, shape retaining properties, and heat resistance. The copper alloy plate contains at least 0.01 mass % of the total of at least one element selected from the group consisting of Ag, Cr, Fe, In, Ni, P, Si, Sn, Ti, Zn, and Zr, contains no more than 1.0 mass % of Ag, no more than 0.08 mass % of Ti, no more than 2.0 mass % of Ni, no more than 3.5 mass % of Zn, and no more than 0.5 mass % of Cr, Fe, In, P, Si, Sn, and Zr by the total of the at least one element selected from the group, the remainder comprising Cu and impurities, has a conductivity of at least 60% IACS, has a tensile strength of at least 350 MPa, and has I(311)/IO(311) determined by X-ray diffraction in the thickness direction of the plate surface that satisfies the formula I(311)/IO(311)?0.5.

Abstract: An Fe—Ni alloy material for a shadow mask having, in terms of % by weight, 34.0 to 38.0% of Ni, 0.05 to 0.45% of Cu, 0.10 to 0.50% of a combined total for Mn and Cu, no more than 0.10% of Si and 0.0004 to 0.005% of S with the balance being Fe and other unavoidable impurities; wherein a total count of MnS precipitates and Cu—S type precipitates having a diameter of 0.01 to 3 &mgr;m located on the surface of a foil strip 0.05 to 0.3 mm thick being at least 2,000 count/mm2.

Abstract: In the production or a shadow mask, the through-holes for passing an electron beam are formed by etching of the Fe—Ni alloy. The variation in diameter of apertures is prevented by dispersing 2000 or more of precipitates and inclusions from 0.01 &mgr;m to 5 &mgr;m in diameter on the surface of said material per mm2. The Fe—Ni alloy of from 34 to 38% of Ni, not more than 0.5% of Mn, and if necessary, from 5 to 40 ppm of B, and from 5 to 40 ppm of N, the balance being Fe and unavoidable and incidental impurities with the proviso of 0.10% or less of C, 0.30% or less of Si, 0.30% or less of Al, 0.005% or less of S, and 0.005% or less of P.

Abstract: In the production or a shadow mask, the through-holes for passing an electron beam are formed by etching of the Fe—Ni alloy. The variation in diameter of apertures is prevented by dispersing 2000 or more of precipitates and inclusions from 0.01 &mgr;m to 5 &mgr;m in diameter on the surface of said material per mm2. The Fe—Ni alloy of from 34 to 38% of Ni, not more than 0.5% of Mn, and if necessary, from 5 to 40 ppm of B, and from 5 to 40 ppm of N, the balance being Fe and unavoidable and incidental impurities with the proviso of 0.10% or less of C, 0.30% or less of Si, 0.30% or less of Al, 0.005% or less of S, and 0.005% or less of P.