Patents by Inventor Ikuya Nii

Ikuya Nii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device
    Patent number: 7815343
    Abstract: The present invention provides a light emitting device which has high reliability and long service life by suppressing the sealing resin from peeling off the inner edge of the opening of the recess of the housing.
    Type: Grant
    Filed: August 2, 2007
    Date of Patent: October 19, 2010
    Assignee: Nichia Corporation
    Inventors: Ikuya Nii, Hiroaki Ukawa, Nobuhide Kasae, Toshimasa Takao
  • Semiconductor device
    Patent number: 7432589
    Abstract: The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area.
    Type: Grant
    Filed: April 17, 2007
    Date of Patent: October 7, 2008
    Assignee: Nichia Corporation
    Inventors: Saiki Yamamoto, Ikuya Nii, Hiroaki Ukawa
  • Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product
    Patent number: 7371462
    Abstract: The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.
    Type: Grant
    Filed: April 23, 2003
    Date of Patent: May 13, 2008
    Assignee: Kaneka Corporation
    Inventors: Manabu Tsumura, Masahito Ide, Katsuya Ouchi, Masafumi Kuramoto, Tomohide Miki, Ikuya Nii
  • Light emitting device
    Publication number: 20080037252
    Abstract: The present invention provides a light emitting device which has high reliability and long service life by suppressing the sealing resin from peeling off the inner edge of the opening of the recess of the housing.
    Type: Application
    Filed: August 2, 2007
    Publication date: February 14, 2008
    Applicant: NICHIA CORPORATION, a corporation of Japan
    Inventors: Ikuya Nii, Hiroaki Ukawa, Nobuhide Kasae, Toshimasa Takao
  • Semiconductor device
    Publication number: 20070246841
    Abstract: The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area.
    Type: Application
    Filed: April 17, 2007
    Publication date: October 25, 2007
    Applicant: NICHIA CORPORATION
    Inventors: Saiki Yamamoto, Ikuya Nii, Hiroaki Ukawa
  • Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product
    Publication number: 20050209400
    Abstract: The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.
    Type: Application
    Filed: April 23, 2003
    Publication date: September 22, 2005
    Inventors: Manabu Tsumura, Masahito Ide, Katsuya Ouchi, Masufumi Kuramoto, Tomohide Miki, Ikuya Nii