Patents by Inventor ILGEUN JUNG

ILGEUN JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages
    Patent number: 11705379
    Abstract: A semiconductor package may include a base, a first chip on the base, and first connection patterns that connect and couple the base and the first chip.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: July 18, 2023
    Inventors: Chanho Lee, Won Kim, Haeseok Park, Ilgeun Jung, Jinkuk Bae, Inyoung Lee, Sungdong Cho
  • SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20220262743
    Abstract: A semiconductor device may include a semiconductor substrate, a crack-blocking layer and a crack-blocking portion. The semiconductor substrate may include a plurality of chip regions and a scribe lane region configured to surround each of the plurality of the chip regions. A trench may be defined by one or more inner surfaces of the semiconductor device to be formed in the scribe lane region. The crack-blocking layer may be on an inner surface of the trench. The crack-blocking layer may be configured to block a spreading of a crack, which is generated in the scribe lane region during a cutting of the semiconductor substrate along the scribe lane region, from spreading into any of the chip regions. The crack-blocking portion may at least partially fill the trench and may be configured to block the spreading of the crack from the scribe lane region into any of the chip regions.
    Type: Application
    Filed: August 2, 2021
    Publication date: August 18, 2022
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Chulsoon CHANG, Sangki KIM, Ilgeun JUNG, Junghoon HAN
  • SEMICONDUCTOR PACKAGES
    Publication number: 20210305114
    Abstract: A semiconductor package may include a base, a first chip on the base, and first connection patterns that connect and couple the base and the first chip.
    Type: Application
    Filed: November 3, 2020
    Publication date: September 30, 2021
    Inventors: CHANHO LEE, WON KIM, HAESEOK PARK, ILGEUN JUNG, JINKUK BAE, INYOUNG LEE, SUNGDONG CHO