Abstract: An electronic device including a memory device with improved reliability is provided. The semiconductor device comprises a data pin configured to transmit a data signal, a command/address pin configured to transmit a command and an address, a command/address receiver connected to the command/address pin, and a computing unit connected to the command/address receiver, wherein the command/address receiver receives a first command and a first address from the outside through the command/address pin and generates a first instruction on the basis of the first command and the first address, and the computing unit receives the first instruction and performs computation based on the first instruction.

Abstract: A semiconductor device including a memory device which has improved reliability is provided. The semiconductor device comprises at least one data pin configured to transfer a data signal, at least one command address pin configured to transfer a command and an address, at least one serial pin configured to transfer a serial data signal, and processing circuitry connected to the at least one data pin and the at least one serial pin. The processing circuitry is configured to receive the data signal from outside through the at least one data pin, and the processing circuitry is configured to output the serial data signal through the at least one serial pin in response to the received data signal.

Abstract: A memory module includes a memory device configured to receive a first refresh command from a host, and perform a refresh operation in response to the first refresh command during a refresh time, and a computing unit configured to detect the first refresh command provided from the host to the memory device, and write a first error pattern at a first address of the memory device during the refresh time.

Abstract: A semiconductor device including a memory device which has improved reliability is provided. The semiconductor device comprises at least one data pin configured to transfer a data signal, at least one command address pin configured to transfer a command and an address, at least one serial pin configured to transfer a serial data signal, and processing circuitry connected to the at least one data pin and the at least one serial pin. The processing circuitry is configured to receive the data signal from outside through the at least one data pin, and the processing circuitry is configured to output the serial data signal through the at least one serial pin in response to the received data signal.

Abstract: An electronic device including a memory device with improved reliability is provided. The semiconductor device comprises a data pin configured to transmit a data signal, a command/address pin configured to transmit a command and an address, a command/address receiver connected to the command/address pin, and a computing unit connected to the command/address receiver, wherein the command/address receiver receives a first command and a first address from the outside through the command/address pin and generates a first instruction on the basis of the first command and the first address, and the computing unit receives the first instruction and performs computation based on the first instruction.

Abstract: A memory module includes a memory device configured to receive a first refresh command from a host, and perform a refresh operation in response to the first refresh command during a refresh time, and a computing unit configured to detect the first refresh command provided from the host to the memory device, and write a first error pattern at a first address of the memory device during the refresh time.

Abstract: The present invention provides a vertical semiconductor device package comprising a semiconductor chip, a heat spreader, a printed circuit board(PCB), a plurality of metal wires, and an encapsulating material. The semiconductor chip is directly attached to the heat spreader, and/or the heat spreader is directly attached to the metal layers in the PCB, which has multiple ground metal layers. A package module has a plurality of the vertical semiconductor device packages, which are vertically mounted on a second circuit board, and a heat sink, which is attached to each heat spreader. The present invention has advantages in that it enhances the heat dissipation properties and the electrical characteristics of the packages.

Abstract: An inner lead bonding apparatus having a heat dissipation plate attached to inner leads and to a support for upholding a lead frame of a tape automated bonding package. The heat dissipation plate is, during performance of an inner lead bonding process, located near the bonding interface of bumps formed on a semiconductor chip or on the inner leads and the inner leads, and includes a fastener for fixing itself to the support and elliptical bolt holes for enabling its contact position to the inner leads to be controllable.