Patents by Inventor Il Gyu Jung

Il Gyu Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220285244
    Abstract: The present invention improves a heat dissipation property of a semiconductor device by transferring hexagonal boron nitride (hBN) with a two-dimensional nanostructure to the semiconductor device. A semiconductor device of the present invention includes a substrate having a first surface and a second surface, a semiconductor layer formed on the first surface of the substrate, an hBN layer formed on at least one surface of the first surface and the second surface of the substrate, and a heat sink positioned on the second surface of the substrate. A radiation rate of heat generated during driving of an element is increased to decrease a reduction in lifetime of a semiconductor device due to a temperature increase. The semiconductor device has a structure and configuration which are very effective in improving a rapid temperature increase due to heat generated by high-power semiconductor devices.
    Type: Application
    Filed: December 27, 2021
    Publication date: September 8, 2022
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Il Gyu CHOI, Seong Il KIM, Hae Cheon KIM, Youn Sub NOH, Ho Kyun AHN, Sang Heung LEE, Jong Won LIM, Sung Jae CHANG, Hyun Wook JUNG
  • Publication number: 20220215866
    Abstract: A semiconductor device including a memory device which has improved reliability is provided. The semiconductor device comprises at least one data pin configured to transfer a data signal, at least one command address pin configured to transfer a command and an address, at least one serial pin configured to transfer a serial data signal, and processing circuitry connected to the at least one data pin and the at least one serial pin. The processing circuitry is configured to receive the data signal from outside through the at least one data pin, and the processing circuitry is configured to output the serial data signal through the at least one serial pin in response to the received data signal.
    Type: Application
    Filed: September 21, 2021
    Publication date: July 7, 2022
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yong Jun YU, Nam Hyung KIM, Do-Han KIM, Min Su KIM, Deok Ho SEO, Won Jae SHIN, Chang Min LEE, Il Gyu JUNG, In Su CHOI
  • Publication number: 20220208237
    Abstract: An electronic device including a memory device with improved reliability is provided. The semiconductor device comprises a data pin configured to transmit a data signal, a command/address pin configured to transmit a command and an address, a command/address receiver connected to the command/address pin, and a computing unit connected to the command/address receiver, wherein the command/address receiver receives a first command and a first address from the outside through the command/address pin and generates a first instruction on the basis of the first command and the first address, and the computing unit receives the first instruction and performs computation based on the first instruction.
    Type: Application
    Filed: August 20, 2021
    Publication date: June 30, 2022
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Chang Min LEE, Nam Hyung KIM, Dae Jeong KIM, Do Han KIM, Min Su KIM, Deok Ho SEO, Won Jae SHIN, Yong Jun YU, Il Gyu JUNG, In Su CHOI
  • Publication number: 20210373996
    Abstract: A memory module includes a memory device configured to receive a first refresh command from a host, and perform a refresh operation in response to the first refresh command during a refresh time, and a computing unit configured to detect the first refresh command provided from the host to the memory device, and write a first error pattern at a first address of the memory device during the refresh time.
    Type: Application
    Filed: February 17, 2021
    Publication date: December 2, 2021
    Inventors: Deok Ho Seo, Nam Hyung Kim, Dae-Jeong Kim, Do-Han Kim, Min Su Kim, Won Jae Shin, Yong Jun Yu, Chang Min Lee, Il Gyu Jung, In Su Choi
  • Patent number: 6326686
    Abstract: The present invention provides a vertical semiconductor device package comprising a semiconductor chip, a heat spreader, a printed circuit board(PCB), a plurality of metal wires, and an encapsulating material. The semiconductor chip is directly attached to the heat spreader, and/or the heat spreader is directly attached to the metal layers in the PCB, which has multiple ground metal layers. A package module has a plurality of the vertical semiconductor device packages, which are vertically mounted on a second circuit board, and a heat sink, which is attached to each heat spreader. The present invention has advantages in that it enhances the heat dissipation properties and the electrical characteristics of the packages.
    Type: Grant
    Filed: August 31, 1998
    Date of Patent: December 4, 2001
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joong Hyun Baek, Il Gyu Jung, Tae Koo Lee, Chang Ho Cho
  • Patent number: 5660318
    Abstract: An inner lead bonding apparatus having a heat dissipation plate attached to inner leads and to a support for upholding a lead frame of a tape automated bonding package. The heat dissipation plate is, during performance of an inner lead bonding process, located near the bonding interface of bumps formed on a semiconductor chip or on the inner leads and the inner leads, and includes a fastener for fixing itself to the support and elliptical bolt holes for enabling its contact position to the inner leads to be controllable.
    Type: Grant
    Filed: July 31, 1995
    Date of Patent: August 26, 1997
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Il Gyu Jung, Tae Gyeong Chung, Tae Koo Lee