Abstract: A method of a first terminal may include: identifying first RB set(s) to be used for SL communication among consecutive RB sets through an LBT procedure; identifying a first subchannel group included in the first RB set(s) and a second subchannel group including a first PRB in the first RB set(s), the first PRB being not included in the first subchannel group; configuring the first PRB within the second subchannel group as an SL communication resource; and transmitting, to a second terminal, control information indicating that the first PRB is configured as the SL communication resource.

Abstract: A semiconductor package includes: a first substrate including a first ground conductor disposed on at least a second surface of a first surface and the second surface; a plurality of electronic elements mounted on the first surface and the second surface of the first substrate; a second substrate adhered to the second surface of the first substrate and including a penetration part formed to accommodate the plurality of electronic elements mounted on the second surface of the first substrate and a second ground conductor connected to the first ground conductor; a molded portion encapsulating the plurality of electronic elements mounted on the first surface of the first substrate; and a shielding layer formed on outer surfaces of the molded portion and the first substrate and at least a portion of a side surface of the second substrate to shield electromagnetic waves.

Abstract: A semiconductor package includes: a first substrate including a first ground conductor disposed on at least a second surface of a first surface and the second surface; a plurality of electronic elements mounted on the first surface and the second surface of the first substrate; a second substrate adhered to the second surface of the first substrate and including a penetration part formed to accommodate the plurality of electronic elements mounted on the second surface of the first substrate and a second ground conductor connected to the first ground conductor; a molded portion encapsulating the plurality of electronic elements mounted on the first surface of the first substrate; and a shielding layer formed on outer surfaces of the molded portion and the first substrate and at least a portion of a side surface of the second substrate to shield electromagnetic waves.

Abstract: A package module includes first and second components, a conductive wall, and a molding portion. The first component and the second component are disposed on a substrate. The conductive wall is disposed between the first component and the second component. The molding portion is disposed on the first component, the second component, and the conductive wall, and has a slot defining a cavity above an upper portion of the conductive wall.

Abstract: There is provided an electronic component module capable of increasing a degree of integration by mounting electronic component on both surfaces of a substrate, the module including: a first substrate having mounted electrodes formed on both surfaces thereof; a plurality of electronic components mounted on both surfaces of the first substrate; at least one second substrate bonded to a lower surface of the first substrate; and an insulating part formed in at least one position in a gap between the first substrate and the second substrate and bonding the first substrate to the second bonding substrate.

Abstract: There is provided an electronic component module capable of increasing a degree of integration by mounting electronic component on both surfaces of a substrate, the module including: a first substrate having mounted electrodes formed on both surfaces thereof; a plurality of electronic components mounted on both surfaces of the first substrate; at least one second substrate bonded to a lower surface of the first substrate; and an insulating part formed in at least one position in a gap between the first substrate and the second substrate and bonding the first substrate to the second bonding substrate.

Abstract: In a communication terminal system and a method of displaying status information relative to at least one wireless terminal, terminal status information is received so as to enable current status information on registration, conversation, etc. of wireless terminals to be displayed on a display unit of a main device thereof. In such a communication terminal system and such a method of displaying status information relative to at least one wireless terminal, an identifier is allocated to each wireless terminal, initial registration for same system authentication is performed between the system main device and each wireless terminal based on the identifier, and the current status of each wireless terminal is displayed after authentication is completed through the registration process.

Abstract: In a communication terminal system, a system main device (i.e., main phone) terminal has a function of a keyphone main device so that the whole system is compact and the system has a wireless Local Area Network (LAN) Access Point (AP) for wirelessly transmitting and receiving voice and data between terminals controlled by the main device. The communication terminal system includes: at least one wireless LAN phone for transmitting and receiving data to and from a main device via a wireless connection; and the main device having an AP for a wireless connection with the wireless LAN phone, a wireless data processor for processing data transceived via the AP, a Digital Signal Processor (DSP) for converting data transceived via the wireless data processor to a voice signal or vice versa, an analog circuit for connecting the converted signal to an office line, and at least one office line port.