Patents by Inventor Il Jin

Il Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9958500
    Abstract: A vacuum socket includes a lower housing including a concave portion with a first hole, the concave portion having a recessed cross section and a printed circuit board in the concave portion, wherein the printed circuit board includes a second hole coupled to the first hole and pads provided along an edge region thereof, a cover provided in the concave portion to cover the printed circuit board, and a vacuum pad inserted in the first hole, the vacuum pad having a third hole coupled to the second hole, wherein the printed circuit board is electrically connected to a first semiconductor chip loaded between the printed circuit board and the cover, via the pads.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: May 1, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jang-Sun Kim, Il Jin, Seungchul Lee
  • Publication number: 20170010324
    Abstract: A vacuum socket includes a lower housing including a concave portion with a first hole, the concave portion having a recessed cross section and a printed circuit board in the concave portion, wherein the printed circuit board includes a second hole coupled to the first hole and pads provided along an edge region thereof, a cover provided in the concave portion to cover the printed circuit board, and a vacuum pad inserted in the first hole, the vacuum pad having a third hole coupled to the second hole, wherein the printed circuit board is electrically connected to a first semiconductor chip loaded between the printed circuit board and the cover, via the pads.
    Type: Application
    Filed: June 20, 2016
    Publication date: January 12, 2017
    Inventors: Jang-Sun Kim, Il Jin, Seungchul Lee