Patents by Inventor Il Jun

Il Jun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240190810
    Abstract: A novel compound for a capping layer, and an organic light-emitting device containing the same are disclosed.
    Type: Application
    Filed: December 29, 2023
    Publication date: June 13, 2024
    Inventors: Ho Wan HAM, Hyun Cheol AN, Hee Joo KIM, Dong Jun KIM, Jeong Woo HAN, Hyung Jin LEE, Ja Eun ANN, Dong Yuel KWON, Ill Hun CHO, Bo Ra LEE, Yeong Rong PARK, Il Soo OH, Dae Woong LEE, Hyeon Jeong IM
  • Publication number: 20240190811
    Abstract: A novel compound for a capping layer, and an organic light-emitting device containing the same are disclosed.
    Type: Application
    Filed: December 29, 2023
    Publication date: June 13, 2024
    Inventors: Ho Wan HAM, Hyun Cheol AN, Byung Cheol MIN, Hee Joo KIM, Dong Jun KIM, Hyung Jin LEE, Ja Eun ANN, Dong Yuel KWON, Yeong Rong PARK, Dae Woong LEE, Il Soo OH, Bo Ra LEE, Hyeon Jeong IM, Ill Hun CHO
  • Publication number: 20240186553
    Abstract: An embodiment method for preparing a polymer electrolyte membrane includes preparing a nanostructure including an imidazole group, mixing a benzimidazole-based polymer, the nanostructure, and a crosslinking agent including an isocyanate group to prepare a mixture, and forming the mixture in a form of a film. An embodiment fuel cell includes a polymer electrolyte membrane including a reaction product of a benzimidazole-based polymer, a nanostructure including an imidazole group, and a crosslinking agent including an isocyanate group, a cathode on a first surface of the polymer electrolyte membrane, and an anode on a second surface of the polymer electrolyte membrane opposite the first surface.
    Type: Application
    Filed: August 17, 2023
    Publication date: June 6, 2024
    Inventors: Il Seok Chae, Sung Kon Kim, Hyun Jun Kim, Min Guk Gu
  • Publication number: 20240170864
    Abstract: A plug connector coupled to a receptacle connector is presented, comprising: a conductor for signals; a ring-shaped conductor for ground, the conductor for ground surrounding the conductor for signals; a ring-shaped insulator surrounding the conductor for signals and being surrounded by the conductor for ground, and insulating between the conductor for signals and the conductor for ground; a lower body; and an upper body coupled onto the lower body. The conductor for signals includes a lower portion protruding below a first portion of the top of the insulator, a middle portion inserted into a hollow portion of the first portion, and an upper portion protruding above the first portion. The conductor for ground includes a lower portion protruding below the first portion and an upper portion surrounding the first portion. The lower body includes a lower housing, such that the upper portion is accommodated in the hollow portion.
    Type: Application
    Filed: March 3, 2022
    Publication date: May 23, 2024
    Applicants: SENSORVIEW CO., LTD., OKINS ELECTRONICS CO., LTD
    Inventors: Byoung Nam KIM, Kyoung Il KANG, Joung Min PARK, Sung Cheol CHO, Jin Kook JUN, Sung Gyu PARK, Soeung Chel JANG
  • Publication number: 20240164138
    Abstract: A novel compound for a capping layer, and an organic light-emitting device containing the same are disclosed.
    Type: Application
    Filed: December 29, 2023
    Publication date: May 16, 2024
    Inventors: Ho Wan HAM, Hyun Cheol AN, Hee Joo KIM, Dong Jun KIM, Ja Eun ANN, Dong Yuel KWON, Sung Kyu LEE, Tae Jin LEE, Bo Ra LEE, Yeong Rong PARK, Il Soo OH, Dae Woong LEE, Hyeon Jeong IM, Ill Hun CHO
  • Publication number: 20240145019
    Abstract: A power source switching circuit for a memory device includes: a first power source voltage terminal for supplying a first power source voltage, a second power source voltage terminal for supplying a second power source voltage, a first metal-oxide-semiconductor field-effect transistor (MOSFET) and a second MOSFET connected in series with the first power source voltage terminal, a first level shifter connected to the first MOSFET and supplied with the first power source voltage, a second level shifter connected to the second MOSFET and supplied with the second power source voltage, a third MOSFET connected to the second MOSFET, and a third level shifter connected to the third MOSFET and supplied with a third power source voltage, and a memory cell of a non-volatile memory is programmed using the first power source voltage or the second power source voltage.
    Type: Application
    Filed: June 7, 2023
    Publication date: May 2, 2024
    Applicant: Magnachip Semiconductor, Ltd.
    Inventors: Hyoung Kyu KIM, Il Jun KIM, Kwon Young OH, Sang Ho LEE
  • Patent number: 11958998
    Abstract: A composition including a plurality of quantum dots; a binder polymer; a thiol compound having at least two thiol groups; a polyvalent metal compound; a polymerizable monomer having a carbon-carbon double bond; a photoinitiator; and a solvent.
    Type: Grant
    Filed: May 5, 2021
    Date of Patent: April 16, 2024
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG DISPLAY CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Ha Il Kwon, Tae Gon Kim, Shang Hyeun Park, Eun Joo Jang, Shin Ae Jun, Garam Park
  • Publication number: 20240114414
    Abstract: Provided are a method and apparatus for providing a network switching service to a user equipment.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 4, 2024
    Applicant: KT CORPORATION
    Inventors: Ji-Young JUNG, Kun-Woo PARK, Se-Hoon KIM, Il-Yong KIM, Sang-Hyun PARK, Ho-Jun JANG, Won-Chang CHO
  • Publication number: 20240106794
    Abstract: Provided are a method and apparatus for a user equipment, a core network, and a second device to enable bidirectional communication for second devices. The method of the second device may include receiving internet protocol (IP) configuration information for automatically configuring an IP version 6 (IPv6) address of the second device from a core network through a user equipment; generating the IPv6 address using information in the IP configuration information; and transmitting the generated IPv6 address to the core network through the UE.
    Type: Application
    Filed: September 6, 2023
    Publication date: March 28, 2024
    Applicant: KT CORPORATION
    Inventors: Won-Chang CHO, Se-Hoon KIM, Il-Yong KIM, Kun-Woo PARK, Sang-Hyun PARK, Ho-Jun JANG, Ji-Young JUNG
  • Patent number: 11941219
    Abstract: A touch sensor includes a base layer including a sensing area and a non-sensing area; and a sensor electrode disposed in the sensing area and including sensor patterns. The sensing area may include a first area including at least one non-square boundary with a predetermined curvature and a second area not including the non-square boundary. In an exemplary embodiment of the present inventive concept, sensor patterns disposed in the first area and sensor patterns disposed in the second area among the sensor patterns may have different sizes from each other.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: March 26, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Won Jun Choi, Il Joo Kim, Deok Jung Kim
  • Patent number: 11915782
    Abstract: An electronic device including a memory device with improved reliability is provided. The semiconductor device comprises a data pin configured to transmit a data signal, a command/address pin configured to transmit a command and an address, a command/address receiver connected to the command/address pin, and a computing unit connected to the command/address receiver, wherein the command/address receiver receives a first command and a first address from the outside through the command/address pin and generates a first instruction on the basis of the first command and the first address, and the computing unit receives the first instruction and performs computation based on the first instruction.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: February 27, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang Min Lee, Nam Hyung Kim, Dae Jeong Kim, Do Han Kim, Min Su Kim, Deok Ho Seo, Won Jae Shin, Yong Jun Yu, Il Gyu Jung, In Su Choi
  • Publication number: 20230390893
    Abstract: A wafer processing method is provided. The method includes preparing a wafer having a notch portion at one side thereof, aligning the wafer by analyzing image information of the notch portion captured by a vision camera, and processing the notch portion using a notch wheel so that a certain region of the notch portion has a preset thickness.
    Type: Application
    Filed: October 15, 2021
    Publication date: December 7, 2023
    Applicant: MEERE COMPANY INC.
    Inventors: Il Jun JUNG, Ki Ho KIM, Jung Yul HAN, Ki Heon LEE, Ji Hun PARK
  • Publication number: 20220176301
    Abstract: A method of fabricating a semiconductor device includes providing a wafer inside a process chamber, performing an ALD (atomic layer deposition) process inside the process chamber to deposit titanium nitride on the wafer, providing a process gas used for the ALD process to a scrubber, filtering a first powder contained in the process gas, using a filter unit disposed in the scrubber and including a plurality of filters, adsorbing a second powder remaining in the process gas after passing through the filter unit, using a fin structure extending in a vertical direction inside the filter unit, and exhausting the process gas, from which the first and second powders are removed, from the scrubber.
    Type: Application
    Filed: November 28, 2021
    Publication date: June 9, 2022
    Applicants: Samsung Electronics Co., Ltd., CSK Inc.
    Inventors: Seo Young MAENG, Il Jun JEON, Su Ji GIM, Jin Hong KIM, Young Seok ROH, Jong Yong BAE, Jung Joon PYEON
  • Patent number: 11257186
    Abstract: An image processing apparatus is disclosed. The present image processing apparatus includes an input unit to which an image is input; and a processor which extracts visual characteristics by reducing an input image and obtains a high-definition image by reflecting extracted visual characteristics on the input image. The disclosure relates to an artificial intelligence (AI) system and application thereof that simulate functions such as cognition and decision-making of a human brain using a machine learning algorithm such as deep learning.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: February 22, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Il-jun Ahn, Woo-hyun Nam, Ki-heum Cho, Yong-sup Park, Tammy Lee, Min-su Cheon
  • Patent number: 11195261
    Abstract: Disclosed is an image processing apparatus. The present image processing apparatus comprises: an input unit for inputting an image; and a processor for shrinking the inputted image to a predetermined ratio, extracting a visual feature from the shrunken image, performing an image quality enhancement process reflecting the extracted visual feature in the inputted image, repeatedly performing, for a predetermined number of times, the shrinking, the extracting, and the image quality enhancement process on the image that has undergone the image quality enhancement process. The present disclosure relates to an artificial intelligence (AI) system and an application thereof that simulate the functions of a human brain, such as recognition, judgment, etc., by using a machine learning algorithm such as deep learning, etc.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: December 7, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woo-hyun Nam, Il-jun Ahn, Tammy Lee, Ki-heum Cho, Yong-sup Park, Min-su Cheon
  • Patent number: 11098406
    Abstract: A substrate support unit according to an example embodiment of the present inventive concept may include a support having an upper surface on which a substrate is disposed; a coupling ring on which an edge of the substrate is disposed, the coupling ring being having an annular shape, wherein the coupling ring is disposed on an edge of the support; and an arm part for raising and lowering the coupling ring and the substrate, wherein the arm part is disposed below the coupling ring and under a portion of the coupling ring, wherein the coupling ring has a first region disposed on the arm part and a second region disposed around the first region, wherein the first region has a thickness greater than that of the second region.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: August 24, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Il Jun Jeon, Ji Ho Uh, Je Hak Lee, Jun Sung Lee, Ji Woon Im
  • Patent number: 11006108
    Abstract: An image processing apparatus is provided. The image processing apparatus includes a processor configured to, in response to an image including a plurality of frames being input, change a predetermined parameter to a parameter corresponding to a compression rate of each of the plurality of frames for each frame, and process the input image by using the parameter changed for each frame, and an output interface configured to output the processed image.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: May 11, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ki-heum Cho, Yong-sup Park, Jae-yeon Park, Chang-han Kim, Il-jun Ahn, Hee-seok Oh, Tammy Lee, Min-su Cheon
  • Patent number: 10922798
    Abstract: An image processing apparatus is provided. The image processing apparatus according to an exemplary embodiment includes a communicator configured to receive an image, and a processor configured to generate a first image obtained by performing image processing on the received image by using a parameter for image processing, generate a second image obtained by reducing the first image at a predetermined ratio, and extract respective visual features from the first image and the second image, wherein the processor is further configured to adjust the parameter to allow a difference between the visual feature of the first image and the visual feature of the second image to be within a predetermined range.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: February 16, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Il-Jun Ahn, Ki-Heum Cho, Yong-Sup Park, Jae-Yeon Park, Hee-Seok Oh, Tammy Lee, Min-Su Cheon
  • Publication number: 20200058113
    Abstract: Disclosed is an image processing apparatus. The present image processing apparatus comprises: an input unit for inputting an image; and a processor for shrinking the inputted image to a predetermined ratio, extracting a visual feature from the shrunken image, performing an image quality enhancement process reflecting the extracted visual feature in the inputted image, repeatedly performing, for a predetermined number of times, the shrinking, the extracting, and the image quality enhancement process on the image that has undergone the image quality enhancement process. The present disclosure relates to an artificial intelligence (AI) system and an application thereof that simulate the functions of a human brain, such as recognition, judgment, etc., by using a machine learning algorithm such as deep learning, etc.
    Type: Application
    Filed: November 8, 2017
    Publication date: February 20, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woo-hyun NAM, Il-jun AHN, Tammy LEE, Ki-heum CHO, Yong-sup PARK, Min-su CHEON
  • Patent number: RE48618
    Abstract: Provided is a radio frequency transceiver. The radio frequency transceiver includes: a receiving unit for converting a radio frequency signal received by an antenna into an intermediate signal based on an intermediate local signal; a transmitting unit for converting an intermediate signal into a radio frequency signal based on a radio frequency local signal; and a local signal generating unit for generating the intermediate local signal and the radio frequency local signal.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: June 29, 2021
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Bong-Hyuk Park, Jong-Won Kim, Yong-Il Jun, Hyeong-Ho Lee