Patents by Inventor Il-Ki Kim

Il-Ki Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for controlling restart a vehicle, system having the same and method thereof
    Patent number: 11964658
    Abstract: A vehicle restart control apparatus includes a processor configured to generate an override torque according to the environment information of the host vehicle when the vehicle is restarted after stopping; and a storage configured to store data and algorithms driven by the processor.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: April 23, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Jeong Ki Hong, Kyung Joo Bang, Kyeong Eun Kim, Dong Hyuk Kim, Il Hwan Kim
  • Memory card pack
    Patent number: 7909251
    Abstract: A memory card pack includes an adaptor insertable in a memory slot of an application device and including a semiconductor chip having a control circuit therein and an expansion socket including a plurality of slots, each slot being configured to receive a memory card, and a plurality of contacts electrically connecting the control circuit to each memory card.
    Type: Grant
    Filed: January 17, 2007
    Date of Patent: March 22, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Doo-jin Yi, Do-il Kong, Il-ki Kim
  • Package with barrier wall and method for manufacturing the same
    Patent number: 7498193
    Abstract: A ball grid array (BGA) package that may suppress flash contamination may include a flash contamination barrier wall. The barrier wall may be a portion of a copper pattern provided on a substrate. During a molding process, the flash contamination barrier may prevent a flash from contaminating a ball land. The barrier wall may restrict the flash to flow through a concave portion that may be defined by a surface of the substrate.
    Type: Grant
    Filed: November 30, 2006
    Date of Patent: March 3, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-Keun Kwak, Il-Ki Kim
  • Memory card pack
    Publication number: 20070181699
    Abstract: A memory card pack includes an adaptor insertable in a memory slot of an application device and including a semiconductor chip having a control circuit therein and an expansion socket including a plurality of slots, each slot being configured to receive a memory card, and a plurality of contacts electrically connecting the control circuit to each memory card.
    Type: Application
    Filed: January 17, 2007
    Publication date: August 9, 2007
    Inventors: Doo-jin Yi, Do-il Kong, Il-ki Kim
  • Package with barrier wall and method for manufacturing the same
    Publication number: 20070069355
    Abstract: A ball grid array (BGA) package that may suppress flash contamination may include a flash contamination barrier wall. The barrier wall may be a portion of a copper pattern provided on a substrate. During a molding process, the flash contamination barrier may prevent a flash from contaminating a ball land. The barrier wall may restrict the flash to flow through a concave portion that may be defined by a surface of the substrate.
    Type: Application
    Filed: November 30, 2006
    Publication date: March 29, 2007
    Inventors: Min-Keun Kwak, Il-Ki Kim
  • Package with barrier wall and method for manufacturing the same
    Patent number: 7166906
    Abstract: A ball grid array (BGA) package that may suppress flash contamination may include a flash contamination barrier wall. The barrier wall may be a portion of a copper pattern provided on a substrate. During a molding process, the flash contamination barrier may prevent a flash from contaminating a ball land. The barrier wall may restrict the flash to flow through a concave portion that may be defined by a surface of the substrate.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: January 23, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-Keun Kwak, Il-Ki Kim
  • Package with barrier wall and method for manufacturing the same
    Publication number: 20050260844
    Abstract: A ball grid array (BGA) package that may suppress flash contamination may include a flash contamination barrier wall. The barrier wall may be a portion of a copper pattern provided on a substrate. During a molding process, the flash contamination barrier may prevent a flash from contaminating a ball land. The barrier wall may restrict the flash to flow through a concave portion that may be defined by a surface of the substrate.
    Type: Application
    Filed: May 21, 2004
    Publication date: November 24, 2005
    Inventors: Min-Keun Kwak, Il-Ki Kim